| Patents for H01L 23 - Details of semiconductor or other solid state devices (226,155) |
|---|
| 05/05/2004 | CN1494146A Electro static discharging protective circuit and its designing method |
| 05/05/2004 | CN1494145A Fuse element and integrated circuit device using said element |
| 05/05/2004 | CN1494144A 半导体装置 Semiconductor device |
| 05/05/2004 | CN1494143A Semiconductor device and its mfg. method, circuidboard, electronic device and apparatus for mfg. semiconductor device |
| 05/05/2004 | CN1494142A Lead wire, resin closed semiconductor device and its mfg. method |
| 05/05/2004 | CN1494141A 半导体器件 Semiconductor devices |
| 05/05/2004 | CN1494140A Wire pad structure capable of improving impedance matching |
| 05/05/2004 | CN1494139A Camera assembly for small electronic apparatus |
| 05/05/2004 | CN1494138A Parallel plate heat transfer device and its manufacturing method |
| 05/05/2004 | CN1494137A Conducting blade |
| 05/05/2004 | CN1494136A Chip packaging structure having internal set heat radiation fin |
| 05/05/2004 | CN1494135A Electron device heat radiator and circuit board and plasma display unit surface plate installed with said device |
| 05/05/2004 | CN1494134A 半导体装置 Semiconductor device |
| 05/05/2004 | CN1494133A Base plate capable of preventing warping phenomenon production |
| 05/05/2004 | CN1494132A High wet sensitive electron device element and its manufacturing method |
| 05/05/2004 | CN1494131A Structure reinforced open window type semiconductor packaging unit |
| 05/05/2004 | CN1494129A Semiconductor device and mfg. method thereof |
| 05/05/2004 | CN1494124A Method for designing semiconductor device |
| 05/05/2004 | CN1494117A Method for etching polycrystalline silicon |
| 05/05/2004 | CN1494109A Circuit apparatus mfg. method |
| 05/05/2004 | CN1494106A Method and device used for protecting wiring and integrated circuit device |
| 05/05/2004 | CN1494027A Power wiring method for semiconductor integrated circuit and semiconductor integrated circuit |
| 05/05/2004 | CN1493954A Electronic apparatus having multiple radiators where liquid refrigerant flowing |
| 05/05/2004 | CN1493949A Electronic apparatus with heating element |
| 05/05/2004 | CN1493419A Manufacturing method of base plate material for electron device |
| 05/05/2004 | CN1148804C Highly integrated chip-on-chip packaging |
| 05/05/2004 | CN1148802C Low alpha emission interconnect system of electronic device and its forming method |
| 05/05/2004 | CN1148801C Manufacture method of radiator |
| 05/05/2004 | CN1148796C Semiconductor chip device and package method thereof |
| 05/05/2004 | CN1148795C Manufacturing method of semi-conductor device |
| 05/05/2004 | CN1148794C 半导体装置 Semiconductor device |
| 05/05/2004 | CN1148793C Film carrier tape, semiconductor device and assembly, its manufacturing method, electronic appliance for packaging substrate |
| 05/05/2004 | CN1148792C Method for directly fixing heat radiator onto chip carrier by using flexile epoxy resin |
| 05/05/2004 | CN1148629C Current guider of heat radiation module |
| 05/05/2004 | CN1148628C Heat radiator |
| 05/05/2004 | CN1148401C Liquid organopolysiloxane resins, process for their preparation, low viscosity polydiorganosiloxane compositions containing liquid organopolysiloxane resins and their use |
| 05/04/2004 | US6732335 Semiconductor IC with an inside capacitor for a power supply circuit and a method of automatically designing the same |
| 05/04/2004 | US6732002 Apparatus and methods for predicting multiple product chip yields through critical area matching |
| 05/04/2004 | US6731514 Stackable module |
| 05/04/2004 | US6731513 Shielded multi-conductor interconnect bus for MEMS |
| 05/04/2004 | US6731512 Active package for integrated circuit |
| 05/04/2004 | US6731511 Wiring board, method of manufacturing the same, electronic component, and electronic instrument |
| 05/04/2004 | US6731506 Retaining device for heat sink |
| 05/04/2004 | US6731505 Integrated circuit mounting system with separate loading forces for socket and heat sink |
| 05/04/2004 | US6731504 Heat sink fastener |
| 05/04/2004 | US6731503 Electrically isolated module |
| 05/04/2004 | US6731493 Low impedance inter-digital capacitor and method of using |
| 05/04/2004 | US6731438 System comprising substrate that has been subjected to mass transport process, lens alignment structure on substrate that yields light pattern when substrate or near plane is imaged, and metal layer aligned to light pattern from lens structure |
| 05/04/2004 | US6731373 Method for imprinting a wafer with identifying information, and exposing method and apparatus for imprinting a wafer with identifying information |
| 05/04/2004 | US6731353 Method and apparatus for transferring blocks |
| 05/04/2004 | US6731221 Electrically modifiable product labeling |
| 05/04/2004 | US6731128 TFI probe I/O wrap test method |
| 05/04/2004 | US6731031 Apparatus and method for heat sink device |
| 05/04/2004 | US6731016 Method and apparatus for marking microelectronic dies and microelectronic devices |
| 05/04/2004 | US6731015 Super low profile package with stacked dies |
| 05/04/2004 | US6731014 Semiconductor package substrate, semiconductor package |
| 05/04/2004 | US6731013 Wiring substrate, semiconductor device and package stack semiconductor device |
| 05/04/2004 | US6731012 Non-planar surface for semiconductor chips |
| 05/04/2004 | US6731011 Memory module having interconnected and stacked integrated circuits |
| 05/04/2004 | US6731010 Resin sealed stacked semiconductor packages with flat surfaces |
| 05/04/2004 | US6731008 Semiconductor device with conductive contact layer structure |
| 05/04/2004 | US6731007 Semiconductor integrated circuit device with vertically stacked conductor interconnections |
| 05/04/2004 | US6731006 Doped copper interconnects using laser thermal annealing |
| 05/04/2004 | US6731005 Semiconductor device including fuses for relieving defective areas |
| 05/04/2004 | US6731003 Wafer-level coated copper stud bumps |
| 05/04/2004 | US6731002 High frequency power device with a plastic molded package and direct bonded substrate |
| 05/04/2004 | US6731001 Semiconductor device including bonded wire based to electronic part and method for manufacturing the same |
| 05/04/2004 | US6731000 Folded-flex bondwire-less multichip power package |
| 05/04/2004 | US6730999 Clip chip carrier |
| 05/04/2004 | US6730998 Stereolithographic method for fabricating heat sinks, stereolithographically fabricated heat sinks, and semiconductor devices including same |
| 05/04/2004 | US6730997 Method of transferring ultra-thin substrates and application of the method to the manufacture of a multi-layered thin film device |
| 05/04/2004 | US6730996 Semiconductor device |
| 05/04/2004 | US6730995 Two-stage transfer molding device to encapsulate MMC module |
| 05/04/2004 | US6730994 Portion of lead frame otherwise used as die attach paddle or as pattern of inner lead-over-chip leads is bifurcated and interdigitated to become effective decoupling capacitor pair |
| 05/04/2004 | US6730993 Laser diode and heatsink quick connect/disconnect assembly |
| 05/04/2004 | US6730991 Integrated circuit chip package |
| 05/04/2004 | US6730989 Semiconductor package and method |
| 05/04/2004 | US6730985 Semiconductor integrated circuit device |
| 05/04/2004 | US6730982 FBEOL process for Cu metallizations free from Al-wirebond pads |
| 05/04/2004 | US6730975 DRAM device |
| 05/04/2004 | US6730969 Radiation hardened MOS transistor |
| 05/04/2004 | US6730968 Whole chip ESD protection |
| 05/04/2004 | US6730950 Local interconnect using the electrode of a ferroelectric |
| 05/04/2004 | US6730948 Semiconductor device including acrylic resin layer |
| 05/04/2004 | US6730946 Semiconductor device |
| 05/04/2004 | US6730931 Integrated circuit feature layout for improved chemical mechanical polishing |
| 05/04/2004 | US6730930 Memory element and method for fabricating a memory element |
| 05/04/2004 | US6730860 Electronic assembly and a method of constructing an electronic assembly |
| 05/04/2004 | US6730856 Ceramic circuit board and method for manufacturing the same |
| 05/04/2004 | US6730855 Electronic element |
| 05/04/2004 | US6730731 For diffusing heat from a variety of components of electronic hardware such as semiconductor elements, a power supply, a light source, and other parts |
| 05/04/2004 | US6730618 Low k dielectric materials with inherent copper ion migration barrier |
| 05/04/2004 | US6730608 Full image exposure of field with alignment marks |
| 05/04/2004 | US6730602 Method for forming aluminum bumps by sputtering and chemical mechanical polishing |
| 05/04/2004 | US6730596 Method of and apparatus for forming interconnection |
| 05/04/2004 | US6730594 Method for manufacturing semiconductor device |
| 05/04/2004 | US6730591 Method of using silicon rich carbide as a barrier material for fluorinated materials |
| 05/04/2004 | US6730590 Semiconductor integrated circuit device and fabrication process thereof |
| 05/04/2004 | US6730589 Electronic component and semiconductor device, method of making the same and method of mounting the same, circuit board, and electronic instrument |
| 05/04/2004 | US6730573 MIM and metal resistor formation at CU beol using only one extra mask |