| Patents for H01L 23 - Details of semiconductor or other solid state devices (226,155) |
|---|
| 05/06/2004 | US20040085730 Heat isolation apparatus |
| 05/06/2004 | US20040085729 Heat dissipating fan |
| 05/06/2004 | US20040085704 Integrated circuit with reduced substrate coupling |
| 05/06/2004 | US20040085690 Semiconductor integrated circuit |
| 05/06/2004 | US20040085175 Solid state inducting device |
| 05/06/2004 | US20040085152 Arrangement and method impedance matching |
| 05/06/2004 | US20040085150 Terminations for shielded transmission lines fabricated on a substrate |
| 05/06/2004 | US20040085120 Eliminating defective decoupling capacitors |
| 05/06/2004 | US20040085099 Interleaved termination ring |
| 05/06/2004 | US20040084785 Resin-encapsulated semiconductor apparatus and process for its fabrication |
| 05/06/2004 | US20040084784 Die pad and chip and further parts of the leadframe are enclosed by a plastic molding compound, thereby producing a hermetic packaging for the chip |
| 05/06/2004 | US20040084783 Integrated circuit package capable of operating in multiple orientations |
| 05/06/2004 | US20040084782 High density area array solder microjoining interconnect structure and fabrication method |
| 05/06/2004 | US20040084781 Compact system module with built-in thermoelectric cooling |
| 05/06/2004 | US20040084780 Dual damascene structure for the wiring-line structures of multi-level interconnects in integrated circuit |
| 05/06/2004 | US20040084779 Bonding pad metal layer geometry design |
| 05/06/2004 | US20040084778 Semiconductor device |
| 05/06/2004 | US20040084777 Semiconductor device and method for fabricating the same |
| 05/06/2004 | US20040084776 Semiconductor equipment |
| 05/06/2004 | US20040084775 Solid state device and its manufacturing method |
| 05/06/2004 | US20040084774 Gas layer formation materials |
| 05/06/2004 | US20040084773 To prevent the diffusion of copper atoms during damascene process |
| 05/06/2004 | US20040084772 Compound structure for reduced contact resistance |
| 05/06/2004 | US20040084771 Methods and apparatus for a thin stacked ball-grid array package |
| 05/06/2004 | US20040084770 Chip-scale schottky device |
| 05/06/2004 | US20040084769 Semiconductor device and method for manufacturing the same |
| 05/06/2004 | US20040084768 Integrated circuit and method of manufacturing an integrated circuit and package |
| 05/06/2004 | US20040084767 Method for fabricating a semiconductor apparatus including a sealing member with reduced thermal stress |
| 05/06/2004 | US20040084766 System-in-a-package device |
| 05/06/2004 | US20040084764 Package structure, printed circuit board mounted with the same, electronic apparatus having the printed circuit board |
| 05/06/2004 | US20040084763 Thermal enhance package with universal heat spreader |
| 05/06/2004 | US20040084761 Method and structure of a reducing intra-level and inter-level capacitance of a semiconductor device |
| 05/06/2004 | US20040084759 Housing preform and electronic apparatus using the same |
| 05/06/2004 | US20040084758 Semiconductor package with lead frame as chip carrier and method for fabricating the same |
| 05/06/2004 | US20040084757 Micro leadframe package having oblique etching |
| 05/06/2004 | US20040084756 Electronic circuit device and manufacturing method thereof |
| 05/06/2004 | US20040084749 Hollow structure in an integrated circuit and method for producing such a hollow structure in an integrated circuit |
| 05/06/2004 | US20040084742 Bonding pads over input circuits |
| 05/06/2004 | US20040084740 Electronic module, methods of manufacturing and driving the same, and electronic instrument |
| 05/06/2004 | US20040084729 High voltage difference amplifier with spark gap ESD protection |
| 05/06/2004 | US20040084726 Semiconductor device having heat release structure using soi substrate and fabrication method thereof |
| 05/06/2004 | US20040084720 Low temperature hydrophobic direct wafer bonding |
| 05/06/2004 | US20040084715 Semiconductor device and method of manufacturing the same |
| 05/06/2004 | US20040084709 Capacitor having a cylindrical (or concave) structure to overcome a difficulty in etching a lower electrode as the height of a 3-dimensionally stacked capacitor increases |
| 05/06/2004 | US20040084704 Using fewer masks and simpler process steps (simpler because no SAC etch or mask reduction are necessary) as compared to conventional fabrication methods |
| 05/06/2004 | US20040084693 Metal bond pad for integrated circuits allowing improved probing ability of small pads |
| 05/06/2004 | US20040084688 Flip chip molded/exposed die process and package structure |
| 05/06/2004 | US20040084687 Wavelength-converting casting composition and white light-emitting semiconductor component |
| 05/06/2004 | US20040084686 Packaging material used for a display device and method of forming thereof |
| 05/06/2004 | US20040084681 Radiation emitter device having an integral micro-groove lens |
| 05/06/2004 | US20040084680 Barrier layer for a copper metallization layer including a low k dielectric |
| 05/06/2004 | US20040084671 Test structure is exposed to an electron beam, emitted secondary electrons are captured from test structure to locate a short by passive voltage contrast, the critical dimension is determined as smallest space without a short |
| 05/06/2004 | US20040084622 Specimen current mapper |
| 05/06/2004 | US20040084511 Method to achieve continuous hydrogen saturation in sparingly used electroless nickel plating process |
| 05/06/2004 | US20040084431 Electric heating for motor vehicles |
| 05/06/2004 | US20040084398 Module, especially a wafer module |
| 05/06/2004 | US20040084211 Z-axis packaging for electronic device and method for making same |
| 05/06/2004 | US20040084206 Fine pad pitch organic circuit board for flip chip joints and board to board solder joints and method |
| 05/06/2004 | US20040084205 Warpage-preventive circuit board and method for fabricating the same |
| 05/06/2004 | US20040084137 Method and structure for producing Z-axis interconnection assembly of printed wiring board elements |
| 05/06/2004 | US20040083742 Cooling system |
| 05/06/2004 | EP1416780A2 LGA package socket |
| 05/06/2004 | EP1416779A2 Multi-layer circuit board and method of manufacturing the same |
| 05/06/2004 | EP1416536A2 Eliminating defective decoupling capacitors |
| 05/06/2004 | EP1416535A2 Tape carrier for tab |
| 05/06/2004 | EP1416534A1 Integrated circuit system with a latent heat storage module |
| 05/06/2004 | EP1416533A2 Power device and direct aluminium bonded substrate thereof |
| 05/06/2004 | EP1416532A1 Module component |
| 05/06/2004 | EP1416529A1 Manufacturing method of semiconductor device |
| 05/06/2004 | EP1416528A2 Method of forming cavity between multilayered wirings |
| 05/06/2004 | EP1416527A1 Method for forming a stepped profile from stacked layers |
| 05/06/2004 | EP1416031A1 Heat conducting polymer mold products |
| 05/06/2004 | EP1415519A1 Welded leadframe |
| 05/06/2004 | EP1415378A1 Voltage limiting protection for high frequency power device |
| 05/06/2004 | EP1415344A2 Semiconductor structure implementing sacrificial material and methods for making and implementing the same |
| 05/06/2004 | EP1415343A2 Sheet for sealing electric wiring |
| 05/06/2004 | EP1415342A1 Device for cooling housings, areas, components, media and the like |
| 05/06/2004 | EP1415341A2 Method of fabricating an alloy film on a face of a heat exchanger for an integrated circuit |
| 05/06/2004 | EP1415336A2 Methods and systems for positioning substrates using spring force of phase-changeable bumps therebetween |
| 05/06/2004 | EP1415335A1 Use of diverse materials in air-cavity packaging of electronic devices |
| 05/06/2004 | EP1415271A1 Bonding of semiconductor chips in chip cards |
| 05/06/2004 | EP1414895A1 Flame retardant molding compositions |
| 05/06/2004 | DE20317856U1 Luftleitverkleidung Luftleitverkleidung |
| 05/06/2004 | DE19946203B4 Stützstruktur für eine gestapelte Fuseanordnung Support structure for a stacked Fuseanordnung |
| 05/06/2004 | DE19654703B4 Vorrichtung und Verfahren zum Formen von Zuleitungen Apparatus and method for forming leads |
| 05/06/2004 | DE19631133B4 Halbleitervorrichtung mit einer Sicherungsschicht A semiconductor device with a data link layer |
| 05/06/2004 | DE10248927A1 Electric molybdenum contact layer for a thin layer solar cell contains embedded nitrogen as an additional component |
| 05/06/2004 | DE10248644A1 Leistungshalbleitermodul The power semiconductor module |
| 05/06/2004 | DE10209115B4 Halbleiterbauelement mit porösen Bereichen A semiconductor device having porous regions |
| 05/06/2004 | CA2503577A1 Method for producing a packaged integrated circuit with a microcavity |
| 05/05/2004 | CN1494820A Ceramic electronic component and method of producing the same |
| 05/05/2004 | CN1494741A Arrangement and method for impedance matching |
| 05/05/2004 | CN1494739A Method for making electronic devices including silicon and LTCC and devices produced thereby |
| 05/05/2004 | CN1494371A Heat transfer element, cooler with the element and electronic apparatus |
| 05/05/2004 | CN1494366A Wiring board having sandwich layer containing inorganic filling |
| 05/05/2004 | CN1494227A Input device usable as electronic label |
| 05/05/2004 | CN1494152A Semiconductor device and its mfg. method |
| 05/05/2004 | CN1494149A Electronic apparatus |
| 05/05/2004 | CN1494148A Multi chip semi-conductor package and its manufacturing method |
| 05/05/2004 | CN1494147A Semiconductor device |