| Patents for H01L 23 - Details of semiconductor or other solid state devices (226,155) |
|---|
| 05/11/2004 | US6734041 Semiconductor chip module and method for manufacturing the same |
| 05/11/2004 | US6734040 Method of manufacturing semiconductor devices |
| 05/11/2004 | US6734039 Semiconductor chip grid array package design and method of manufacture |
| 05/11/2004 | US6734036 Semiconductor device and method of fabrication |
| 05/11/2004 | US6734032 Method and apparatus for marking a bare semiconductor die |
| 05/11/2004 | US6734029 Method for forming conductive film pattern, and electro-optical device and electronic apparatus |
| 05/11/2004 | US6734028 Method of detecting shallow trench isolation corner thinning by electrical stress |
| 05/11/2004 | US6733954 Semiconductor module substrate sheet, semiconductor module substrate sheet fabricating method and semiconductor module |
| 05/11/2004 | US6733902 Liquid epoxy resin composition and semiconductor device |
| 05/11/2004 | US6733901 Grinding a premix of an epoxy resin, a phenolic resin, a curing accelerator and an inorganic filler to obtain a specific particle size distribution and melt-kneading the ground material under a reduced pressure. |
| 05/11/2004 | US6733899 Metal plate and method of shaping the same |
| 05/11/2004 | US6733880 Adhesive film for semiconductor, lead frame with adhesive film for semiconductor and semiconductor device using the same |
| 05/11/2004 | US6733822 Firing an aluminum nitride molding having at least one highly isolated through-hole for via hole formation; specified shrinkage factor; noncracking |
| 05/11/2004 | US6733711 Plastic packaging of LED arrays |
| 05/11/2004 | US6733703 Mixed with an organic binder so that parts produced from such compounds will have a precisely controlled shrinkage upon sintering; allows the use of a single molding tool to fabricate parts to very tight manufacturing tolerances |
| 05/11/2004 | US6733614 Heat radiation of the thermal conductive sheet with conductive foil |
| 05/11/2004 | US6733607 Burning out parrafin wax in a channel, lamination |
| 05/11/2004 | US6733320 Contact for PGA and PGA socket |
| 05/11/2004 | US6733304 Electrical connector assembly with strengthened fixing posts |
| 05/11/2004 | US6732913 Method for forming a wafer level chip scale package, and package formed thereby |
| 05/11/2004 | US6732912 Solder ball attaching process |
| 05/11/2004 | US6732908 Microjoint chip carrier including multilayer substrate with plurality of receptacles in top surface, set of microjoint pads on device chips with conductive studs extending outwardly above surface, interconnect wiring connecting receptacles |
| 05/11/2004 | US6732786 Edge-mounted heat dissipation device having top-and-bottom fan structure |
| 05/11/2004 | CA2319430C A method for generating electrical conducting or semiconducting structures in two or three dimensions, a method for erasing the same structures and an electric field generator/modulator for use with the method for generating |
| 05/11/2004 | CA2274785C A chip module and process for the production thereof |
| 05/06/2004 | WO2004038800A2 Multilayered integrated circuit with non functional conductive traces |
| 05/06/2004 | WO2004038799A1 Electronic member, method for making the same, and semiconductor device |
| 05/06/2004 | WO2004038798A2 Stacked electronic structures including offset substrates |
| 05/06/2004 | WO2004038797A1 Method for assembling a power component |
| 05/06/2004 | WO2004038796A1 Method for producing a stepped edge profile comprised of a layered construction. |
| 05/06/2004 | WO2004038795A2 Thermal-conductive substrate package |
| 05/06/2004 | WO2004038793A1 Non-contact id card and the like and method for manufacturing same |
| 05/06/2004 | WO2004038782A1 Semiconductor device and process for producing the same |
| 05/06/2004 | WO2004038769A2 Flip-chip system and method of making same |
| 05/06/2004 | WO2004038767A2 Doped nanoscale wires and method of manufacture |
| 05/06/2004 | WO2004038433A1 Sheet-form connector and production method and application therefor |
| 05/06/2004 | WO2004038318A2 Vapor escape microchannel heat exchanger |
| 05/06/2004 | WO2004038308A1 Active micro cooler |
| 05/06/2004 | WO2004038302A2 Method and apparatus for removeably coupling a heat rejection device with a heat producing device |
| 05/06/2004 | WO2004038049A1 Composite material, method for producing same and member using same |
| 05/06/2004 | WO2004037712A2 Method for producing a packaged integrated circuit with a microcavity |
| 05/06/2004 | WO2004037447A1 Thermally conductive emi shield |
| 05/06/2004 | WO2004032231A3 Micro-structure cooling device and use thereof |
| 05/06/2004 | WO2004025728A3 Improvements in or relating to cooling of electronic components |
| 05/06/2004 | WO2004008497B1 Thermal interconnect and interface systems, methods of production and uses thereof |
| 05/06/2004 | WO2003084780A3 Electrochromic rearview mirror assembly incorporating a display/signal light |
| 05/06/2004 | WO2003079435A3 Microwave monolithic integrated circuit assembly with multi-orientation pyrolytic graphite heat-dissipating assembly |
| 05/06/2004 | WO2003063239A3 Method and apparatus for controlling die attach fillet height to reduce die shear stress |
| 05/06/2004 | WO2003017479A3 Electronic device and method of testing and of manufacturing |
| 05/06/2004 | WO2003010796A8 Structure and method for fabrication of a leadless chip carrier with embedded antenna |
| 05/06/2004 | WO2002073699A9 Nanofabrication |
| 05/06/2004 | WO2002069374A9 Tape ball grid array semiconductor package structure and assembly process |
| 05/06/2004 | US20040088669 Design methodology for dummy lines |
| 05/06/2004 | US20040088667 Semiconductor integrated circuit capable of facilitating layout modification |
| 05/06/2004 | US20040088658 Method of designing semiconductor device |
| 05/06/2004 | US20040088416 Printed circuit board and method manufacturing the same |
| 05/06/2004 | US20040087697 Heat conducting polymer mold products |
| 05/06/2004 | US20040087685 Mixtures of thermoplastic resins, binders, thickeners, curing agents and water, used as impregnation varnishes for electronics |
| 05/06/2004 | US20040087681 Toughened epoxy-anhydride no-flow underfill encapsulant |
| 05/06/2004 | US20040087427 Glass ceramic sintered body and wiring board using the sintered body |
| 05/06/2004 | US20040087249 Alignment mark and exposure alignment system and method using the same |
| 05/06/2004 | US20040087190 Connector module for integrated circuit device, and integrated circuit device suitable for use with the same |
| 05/06/2004 | US20040087179 Method for forming integrated dielectric layers |
| 05/06/2004 | US20040087175 Application of impressed-current cathodic protection to prevent metal corrosion and oxidation |
| 05/06/2004 | US20040087171 Combined conformal/non-conformal seed layers for metallic interconnects |
| 05/06/2004 | US20040087169 Dry etching method and semiconductor device manufacturing method |
| 05/06/2004 | US20040087160 Method and structure for controlling the interface roughness of cobalt disilicide |
| 05/06/2004 | US20040087157 Method for screening semiconductor devices for contact coplanarity |
| 05/06/2004 | US20040087150 Structural element and process for its production |
| 05/06/2004 | US20040087148 Copper interconnect by immersion/electroless plating in dual damascene process |
| 05/06/2004 | US20040087145 Semiconductor device and method of manufacturing |
| 05/06/2004 | US20040087140 Process for fabricating an electrical circuit comprising a polishing step |
| 05/06/2004 | US20040087137 Method of manufacturing interconnection structure applied to semiconductor device |
| 05/06/2004 | US20040087133 Method for manufacturing semiconductor device having porous structure with air-gaps |
| 05/06/2004 | US20040087132 Switching metal line configurations in metal layer structures |
| 05/06/2004 | US20040087131 Method for the solder-stop structuring of elevations on wafers |
| 05/06/2004 | US20040087130 Semiconductor device and mounted semiconductor device structure |
| 05/06/2004 | US20040087129 Solder bump structure and laser repair process for memory device |
| 05/06/2004 | US20040087128 Method and materials for printing particle-enhanced electrical contacts |
| 05/06/2004 | US20040087127 Process and arrangement for the selective metallization of 3D structures |
| 05/06/2004 | US20040087126 Method of forming a through-substrate interconnect |
| 05/06/2004 | US20040087098 Mim and metal resistor formation at cu beol using only one extra mask |
| 05/06/2004 | US20040087082 Mim capacitor and manufacturing method thereor |
| 05/06/2004 | US20040087077 Electronic assembly having semiconductor component with polymer support member and method of fabrication |
| 05/06/2004 | US20040087061 Structure and process for reducing die corner and edge stresses in microelectronic packages |
| 05/06/2004 | US20040087058 Substrate for carrying a semiconductor chip and a manufacturing method thereof |
| 05/06/2004 | US20040087057 Method for fabricating a flip chip package with pillar bump and no flow underfill |
| 05/06/2004 | US20040087053 Low cost fabrication and assembly of lid for semiconductor devices |
| 05/06/2004 | US20040087046 Method for testing chips on flat solder bumps |
| 05/06/2004 | US20040087043 Package structure and method for making the same |
| 05/06/2004 | US20040086739 Film carrier tape for mounting electronic part |
| 05/06/2004 | US20040086169 Enhanced uniqueness for pattern recognition |
| 05/06/2004 | US20040085801 Metal wiring pattern for memory devices |
| 05/06/2004 | US20040085797 Device having a state dependent upon the state of particles dispersed in a carrier |
| 05/06/2004 | US20040085743 Tape carrier package |
| 05/06/2004 | US20040085740 Support for an electrical circuit in particular an electrical breaker |
| 05/06/2004 | US20040085737 Heat sink for electronic devices, and circuit board and plasma display panel assembly each equipped with the heat sink |
| 05/06/2004 | US20040085736 Device and method for mounting integrated circuits on a printed circuit card |
| 05/06/2004 | US20040085735 Heat sink assembly with retaining device |
| 05/06/2004 | US20040085734 Radiator for radiating heat of a heat generating component, a cooling unit including the radiator, and an electronic apparatus including the cooling unit |