| Patents for H01L 23 - Details of semiconductor or other solid state devices (226,155) |
|---|
| 05/12/2004 | CN1495870A Composite intermediate connection element of microelectronic component and its making method |
| 05/12/2004 | CN1495866A Semiconductor device and its making method |
| 05/12/2004 | CN1495852A Semiconductor device and its making method and device |
| 05/12/2004 | CN1495814A Microelectronic element bearer and mfg. method thereof |
| 05/12/2004 | CN1495795A Semiconductor storage device |
| 05/12/2004 | CN1495776A Voice coding device and decoding devie, optical recording medium and voice transmission method |
| 05/12/2004 | CN1495587A Method for retaining heat-conducting pin in heat-conducting diffusion plate and its device |
| 05/12/2004 | CN1495540A Alignment system of photoetching system utilizing at least two wavelengths and its method |
| 05/12/2004 | CN1495478A Contact structure and mfg. method, thin film transistor array panel and mfg. method |
| 05/12/2004 | CN1495245A Heat-conducting composite sheet and preparing method thereof |
| 05/12/2004 | CN1149908C Integrated circuit assembling and disassembling device and its assembling and disassembling head |
| 05/12/2004 | CN1149676C 半导体装置 Semiconductor device |
| 05/12/2004 | CN1149675C Semiconductor device |
| 05/12/2004 | CN1149673C Tape carrier package |
| 05/12/2004 | CN1149672C Semiconductor device and manufacturing method thereof |
| 05/12/2004 | CN1149671C Semiconductor device |
| 05/12/2004 | CN1149669C Method for coating thermal grease on integrated circuit |
| 05/12/2004 | CN1149668C Epoxy resin composition to seal semiconductors and resin-sealed semiconductor device |
| 05/12/2004 | CN1149667C High thermal conductivity silicon nitride circuit substrat, and semiconductor device using the same |
| 05/12/2004 | CN1149666C Silicon nitride ceramic circuit substrate and semiconductor device using the same |
| 05/12/2004 | CN1149665C Semiconductive ceramic |
| 05/12/2004 | CN1149664C Band with automatic linkage, integrated circuit device |
| 05/12/2004 | CN1149654C Method and structrue for contact to copper metallization in insulating via on semiconductor |
| 05/12/2004 | CN1149653C Copper stud structure with refractory metal liner |
| 05/12/2004 | CN1149649C Producing method of relay base plate for installation of semi-conductor elements |
| 05/12/2004 | CN1149643C Pattern drawing method using charged particle beams and apparatus therefor |
| 05/12/2004 | CN1149642C Method for forming pattern conductin layer on semiconductor chip and semiconductor device |
| 05/11/2004 | US6735651 Multi-chip module having chips coupled in a ring |
| 05/11/2004 | US6735499 Method and apparatus for controlling cooling fan |
| 05/11/2004 | US6735429 Methods and systems to substantially prevent fraudulent use of a wireless unit roaming in a visited system |
| 05/11/2004 | US6735085 Foldable retention device for land grid array connector assembly |
| 05/11/2004 | US6735084 Heat sink for electronic devices, and circuit board and plasma display panel assembly each equipped with the heat sink |
| 05/11/2004 | US6735083 Porous CPU cooler |
| 05/11/2004 | US6735082 Heatsink with improved heat dissipation capability |
| 05/11/2004 | US6735077 Thermal diffuser and radiator |
| 05/11/2004 | US6735076 Radiation apparatus |
| 05/11/2004 | US6735065 Semiconductor module |
| 05/11/2004 | US6734940 Semiconductor device, electro-optical device substrate, liquid crystal device substrate and manufacturing method therefor, liquid crystal device, and projection liquid crystal display device and electronic apparatus using the liquid crystal device |
| 05/11/2004 | US6734728 RF power transistor with internal bias feed |
| 05/11/2004 | US6734572 Pad structure for bonding pad and probe pad and manufacturing method thereof |
| 05/11/2004 | US6734571 Semiconductor assembly encapsulation mold |
| 05/11/2004 | US6734570 Solder bumped substrate for a fine pitch flip-chip integrated circuit package |
| 05/11/2004 | US6734568 Semiconductor device and method of manufacturing the same |
| 05/11/2004 | US6734567 Flip-chip device strengthened by substrate metal ring |
| 05/11/2004 | US6734566 Recyclable flip-chip semiconductor device |
| 05/11/2004 | US6734565 Contact structure for an integrated semiconductor device |
| 05/11/2004 | US6734564 Specially shaped contact via and integrated circuit therewith |
| 05/11/2004 | US6734563 Post passivation interconnection schemes on top of the IC chips |
| 05/11/2004 | US6734561 Comprises silicon oxynitride antireflective coating interposed between dielectric layers for etching prevention |
| 05/11/2004 | US6734559 Channel in dielectric lined with metallic barrier and filled with conductor where recess is etched |
| 05/11/2004 | US6734557 Semiconductor device |
| 05/11/2004 | US6734556 Semiconductor device with chip-on-chip construction joined via a low-melting point metal layer |
| 05/11/2004 | US6734555 Integrated circuit package and printed circuit board arrangement |
| 05/11/2004 | US6734554 Semiconductor wafer with bumps of uniform height |
| 05/11/2004 | US6734553 Semiconductor device |
| 05/11/2004 | US6734552 Enhanced thermal dissipation integrated circuit package |
| 05/11/2004 | US6734551 Semiconductor device |
| 05/11/2004 | US6734550 In-situ cap and method of fabricating same for an integrated circuit device |
| 05/11/2004 | US6734547 Semiconductor wiring structure having divided power lines and ground lines on the same layer |
| 05/11/2004 | US6734546 Micro grid array semiconductor die package |
| 05/11/2004 | US6734545 BGA type semiconductor device and electronic equipment using the same |
| 05/11/2004 | US6734544 Integrated circuit package |
| 05/11/2004 | US6734542 Component built-in module and method for producing the same |
| 05/11/2004 | US6734540 Semiconductor package with stress inhibiting intermediate mounting substrate |
| 05/11/2004 | US6734539 Stacked module package |
| 05/11/2004 | US6734536 Surface-mounting semiconductor device and method of making the same |
| 05/11/2004 | US6734535 Semiconductor device, method of manufacture thereof, circuit board, and electronic instrument |
| 05/11/2004 | US6734534 Microelectronic substrate with integrated devices |
| 05/11/2004 | US6734532 Back side coating of semiconductor wafers |
| 05/11/2004 | US6734529 Vertically mountable interposer and assembly |
| 05/11/2004 | US6734525 Low stress integrated circuit fusible link |
| 05/11/2004 | US6734513 Cap wafer bonded to top surface of base wafer with glass frit interposed in between; hermetic sealing |
| 05/11/2004 | US6734504 Method of providing HBM protection with a decoupled HBM structure |
| 05/11/2004 | US6734489 Semiconductor element and MIM-type capacitor formed in different layers of a semiconductor device |
| 05/11/2004 | US6734486 Recessed plug semiconductor device and manufacturing method thereof |
| 05/11/2004 | US6734481 Semiconductor device having a monitor pattern |
| 05/11/2004 | US6734477 Fabricating an embedded ferroelectric memory cell |
| 05/11/2004 | US6734474 Integrated semiconductor circuit having contact points and configuration having at least two such circuits |
| 05/11/2004 | US6734473 Method of integrated circuit construction with port alignment and timing signal buffering within a common area |
| 05/11/2004 | US6734472 Power and ground shield mesh to remove both capacitive and inductive signal coupling effects of routing in integrated circuit device |
| 05/11/2004 | US6734468 Devices related to electrode pads for p-type group III nitride compound semiconductors |
| 05/11/2004 | US6734458 Test pattern for measuring contact resistance and method of manufacturing the same |
| 05/11/2004 | US6734372 Gate area relief strip for a molded I/C package |
| 05/11/2004 | US6734371 Soldered heat sink anchor and method of use |
| 05/11/2004 | US6734370 Multilayer modules with flexible substrates |
| 05/11/2004 | US6734363 Lightweight electronic equipment conductor with coolant permeable support |
| 05/11/2004 | US6734258 Protective coating composition for dual damascene process |
| 05/11/2004 | US6734104 Method of manufacturing a semiconductor device and a semiconductor device |
| 05/11/2004 | US6734096 Fine-pitch device lithography using a sacrificial hardmask |
| 05/11/2004 | US6734095 Method for producing cavities with submicrometer patterns in a semiconductor device using a freezing process liquid |
| 05/11/2004 | US6734093 Method for placing active circuits beneath active bonding pads |
| 05/11/2004 | US6734092 Semiconductor device and manufacturing method thereof |
| 05/11/2004 | US6734084 Method of manufacturing a semiconductor device with recesses using anodic oxide |
| 05/11/2004 | US6734076 Method for thin film resistor integration in dual damascene structure |
| 05/11/2004 | US6734060 Semiconductor integrated circuit device and process for manufacturing |
| 05/11/2004 | US6734047 Thinning of fuse passivation after C4 formation |
| 05/11/2004 | US6734046 Method of customizing and using maps in generating the padring layout design |
| 05/11/2004 | US6734045 Lossy RF shield for integrated circuits |
| 05/11/2004 | US6734044 Multiple leadframe laminated IC package |
| 05/11/2004 | US6734043 Pressure-bonded heat sink method |