| Patents for H01L 23 - Details of semiconductor or other solid state devices (226,155) |
|---|
| 05/13/2004 | US20040089935 Electronic component having a semiconductor chip and method for populating a circuit carrier during the production of the electronic component |
| 05/13/2004 | US20040089933 Isolated bifunctional surrogates, strands and stabilization strands, nucleotides and domains |
| 05/13/2004 | US20040089932 Methods and apparatuses relating to block configurations and fluidic self-assembly processes |
| 05/13/2004 | US20040089931 Power semiconductor device |
| 05/13/2004 | US20040089930 Simplified stacked chip assemblies |
| 05/13/2004 | US20040089929 Semiconductor package structure and method for manufacturing the same |
| 05/13/2004 | US20040089928 Mold resin-sealed power semiconductor device having insulating resin layer fixed on bottom surface of heat sink and metal layer on the resin layer |
| 05/13/2004 | US20040089927 Modularized image sensor |
| 05/13/2004 | US20040089926 Ultra thin semiconductor device |
| 05/13/2004 | US20040089925 Semiconductor device having radiation structure |
| 05/13/2004 | US20040089924 Electronic device and method for fabricating the same |
| 05/13/2004 | US20040089923 Semiconductor device and its manufacturing method |
| 05/13/2004 | US20040089922 Semiconductor device and method therefor |
| 05/13/2004 | US20040089921 Lead frame and method of producing the same, and resin-encapsulated semiconductor device and method of producing the same |
| 05/13/2004 | US20040089920 Stacked memory cell and process of fabricating same |
| 05/13/2004 | US20040089916 Microelectronic fabrication having edge passivated bond pad integrated with option selection device access aperture |
| 05/13/2004 | US20040089915 Semiconductor device with fuses |
| 05/13/2004 | US20040089912 Semiconductor device |
| 05/13/2004 | US20040089911 Semiconductor integrated circuit and method of manufacturing the same |
| 05/13/2004 | US20040089909 Integrated circuit having improved esd protection |
| 05/13/2004 | US20040089898 An optoelectronic component having a basic housing or frame and at least one semiconductor chip, specifically a radiation-emitting or -receiving semiconductor chip, in a cavity of the basic housing. In order to increase the |
| 05/13/2004 | US20040089897 RF power LDMOS transistor |
| 05/13/2004 | US20040089891 Semiconductor device including electrode or the like having opening closed and method of manufacturing the same |
| 05/13/2004 | US20040089880 Methods for providing an integrated circuit package with an alignment mechanism |
| 05/13/2004 | US20040089879 Flip chip package |
| 05/13/2004 | US20040089859 Integrated circuit device installed structure and installation method |
| 05/13/2004 | US20040089700 Preconditioning via plug material for a via-in-pad ball grid array package |
| 05/13/2004 | US20040089555 Continuous metal plating and supplemental processing in one housing; substrate stage between cassette stage and pre-treatment unit; cleaning with pure water; drying |
| 05/13/2004 | US20040089472 Multilayer ceramic substrate, its production method, and apparatus used for its production |
| 05/13/2004 | US20040089470 Printed circuit board, semiconductor package, base insulating film, and manufacturing method for interconnect substrate |
| 05/13/2004 | US20040089464 Semiconductor device having packaging structure |
| 05/13/2004 | US20040089442 Electroosmotic microchannel cooling system |
| 05/13/2004 | US20040089282 Method for sawing wafers employing multiple indexing techniques for multiple die dimensions and dicing apparatus |
| 05/13/2004 | US20040089008 Spray cooling system |
| 05/13/2004 | US20040088855 Substrate having a coefficient of thermal expansion the same as that of the semiconductor of the chip-scale package and including apertures formed at locations corresponding to bond pads of the semiconductor device |
| 05/13/2004 | US20040088853 Method and system for assembling a printed circuit board using a land grid array |
| 05/13/2004 | DE202004004016U1 Heat exchanger tube for cooling electronic components in personal computers, has a vaporizer and a condenser both linked by a refrigerant vapor pipe |
| 05/13/2004 | DE19939933B4 Elektronische Leistungs-Moduleinheit Electronic power module unit |
| 05/13/2004 | DE19835266B4 Verfahren zum Erfassen der Betriebstemperatur von Halbleiterbauelementen und dessen Verwendung A method for detecting the operating temperature of semiconductor devices and the use thereof |
| 05/13/2004 | DE10340837A1 Einheit geringer Ausdehnung, Herstellungsverfahren dafür und damit versehener Halbleiter Low expansion unit, manufacturing method thereof and provided therewith Semiconductors |
| 05/13/2004 | DE10334539A1 Elektronisches Bauelement und Verfahren zum Herstellen desselben The same electronic device and methods for making |
| 05/13/2004 | DE10334422A1 Verfahren zur Herstellung eines Materials mit geringer Ausdehnung sowie das Material mit geringer Ausdehnung verwendende Halbleitervorrichtung A method for producing a material with low expansion and the low expansion material semiconductor device using |
| 05/13/2004 | DE10325020A1 Verfahren zum Versiegeln eines Halbleiterbauelements und eine Vorrichtung, die das Verfahren ausführt A method of sealing a semiconductor device and an apparatus that executes the method |
| 05/13/2004 | DE10251411A1 Vorrichtung Device |
| 05/13/2004 | DE10250658A1 Air intake with noise-attenuating effect for personal computer fan, has cowl with openings and fins arranged in defined azimuth direction to axis of fan |
| 05/13/2004 | DE10249855A1 Material for feeding current to semiconducting component is compound material of at least one conducting material and at least one material that is non-conducting or conducts relatively poorly |
| 05/13/2004 | DE10249854A1 Power semiconductor component group for AC motor control, using mounting layer with parallel conductor regions for contacting power semiconductors |
| 05/13/2004 | DE10249331A1 Heat sink device for electrical component, has one-piece heat sink body with Cu contact element and metal cooling element |
| 05/13/2004 | DE10249192A1 Elektronisches Bauelement mit integriertem passiven elektronischen Bauelement und Verfahren zu dessen Herstellung An electronic component with an integrated passive electronic component and method for its production |
| 05/13/2004 | DE10248224A1 Verfahren zur Justage und zur Belichtung eines Halbleiterwafers A method for adjustment and for exposure of a semiconductor wafer |
| 05/12/2004 | EP1418797A2 Wiring board and process of producing the same |
| 05/12/2004 | EP1418622A1 Encapsulation of multiple integrated circuits |
| 05/12/2004 | EP1418619A1 Semiconductor device and production method therefor, and plating solution |
| 05/12/2004 | EP1418618A2 Method of forming cavites between multilayered wirings |
| 05/12/2004 | EP1418617A2 Semiconductor device and method of manufacturing the same |
| 05/12/2004 | EP1418616A1 Electronic parts packaging structure and method of manufacturing the same |
| 05/12/2004 | EP1418161A2 Method for the production of an aluminium nitride substrate |
| 05/12/2004 | EP1418154A2 Method and apparatus for vacuum-mounting a micro electro mechanical system on a substrate |
| 05/12/2004 | EP1417873A1 Electronics cooling subassembly |
| 05/12/2004 | EP1417712A1 Integrated arrays of modulators and lasers on electronics |
| 05/12/2004 | EP1417710A2 A method and apparatus for die stacking |
| 05/12/2004 | EP1417709A1 High voltage semiconductor device housing with increased clearance between housing can and die for improved flux flushing |
| 05/12/2004 | EP1417708A2 Heat removal system |
| 05/12/2004 | EP1417691A1 Planar inductive component and a planar transformer |
| 05/12/2004 | EP1417152A2 Mems and method of manufacturing mems |
| 05/12/2004 | EP1417093A1 A high solids hbn slurry hbn paste spherical hbn powder, and methods of making and using them |
| 05/12/2004 | EP0792463B1 Mounting spring elements on semiconductor devices |
| 05/12/2004 | CN2615869Y Improvement of luminous diode support |
| 05/12/2004 | CN2615866Y 改进的散热器装置 Improved heat sink means |
| 05/12/2004 | CN2615865Y Apparatus for spraying heat conduction |
| 05/12/2004 | CN2615864Y Central geometrical varying heat radiator |
| 05/12/2004 | CN2615863Y Central geometrical varying heat radiator |
| 05/12/2004 | CN2615862Y Central geometrical changing heat radiator |
| 05/12/2004 | CN2615861Y Support mechanism of CPU radiator |
| 05/12/2004 | CN2615860Y Radiator capable of eliminating thermal energy of integrated circuit |
| 05/12/2004 | CN2615831Y Surface mounting integrated circuit protector |
| 05/12/2004 | CN2615734Y Combined computer microprocessor cooling device |
| 05/12/2004 | CN1496526A Extraction method of defect density and size distributions |
| 05/12/2004 | CN1496468A Improved efficiency thermoelectrics utilizing thermal isolation |
| 05/12/2004 | CN1496218A Power miniature assembly and its mfg. method |
| 05/12/2004 | CN1496217A Envelope for covering electronic element and display device containing said envelope |
| 05/12/2004 | CN1496212A Circuit board with pin made of resin |
| 05/12/2004 | CN1495999A Acoustic wave device and its making method |
| 05/12/2004 | CN1495996A Electronic component mfg. method and device, and driving methof for said making device |
| 05/12/2004 | CN1495970A Contact structure of card connector |
| 05/12/2004 | CN1495908A Molecular device and array, rectifier and method, sensor and relative device |
| 05/12/2004 | CN1495901A Power amplifier with base stripe and collector stripe |
| 05/12/2004 | CN1495900A 半导体器件 Semiconductor devices |
| 05/12/2004 | CN1495898A Inductor for radio-frequency integrated circuit |
| 05/12/2004 | CN1495893A Semiconductor device and its aking method |
| 05/12/2004 | CN1495892A Distribution-containing structure and forming method thereof |
| 05/12/2004 | CN1495891A 集成电路装置与电子装置 The integrated circuit device and the electronic device |
| 05/12/2004 | CN1495890A Assebly of seiconductor radiator |
| 05/12/2004 | CN1495889A High property passive cooling device with conduit |
| 05/12/2004 | CN1495882A Power supply path structure for integrated circuit design |
| 05/12/2004 | CN1495881A Method for making semiconductor equipment with conical flat-top side-wall film |
| 05/12/2004 | CN1495880A Microstructure production method and microstructure arrangement |
| 05/12/2004 | CN1495879A Method for making dual daascence interconnection of microelectronic device |
| 05/12/2004 | CN1495877A FOrmation of air-gap |
| 05/12/2004 | CN1495872A Direct chip connecting structure and method |