| Patents for H01L 23 - Details of semiconductor or other solid state devices (226,155) |
|---|
| 05/18/2004 | US6737310 Self-aligned process for a stacked gate RF MOSFET device |
| 05/18/2004 | US6737301 Power semiconductor switching devices, power converters, integrated circuit assemblies, integrated circuitry, power current switching methods, methods of forming a power semiconductor switching device, power conversion methods, power semiconductor switching device packaging methods, and methods of forming a power transistor |
| 05/18/2004 | US6737299 Thermally conductive adhesive tape for semiconductor devices and method for using the same |
| 05/18/2004 | US6737298 Heat spreader anchoring & grounding method & thermally enhanced PBGA package using the same |
| 05/18/2004 | US6737297 Process for making fine pitch connections between devices and structure made by the process |
| 05/18/2004 | US6737296 Method to reduce number of wire-bond loop heights versus the total quantity of power and signal rings |
| 05/18/2004 | US6737295 Chip scale package with flip chip interconnect |
| 05/18/2004 | US6737292 Method of fabricating an image sensor module at the wafer level and mounting on circuit board |
| 05/18/2004 | US6737285 Semiconductor device manufacturing method |
| 05/18/2004 | US6737173 Pretreating method before plating and composites having a plated coat |
| 05/18/2004 | US6737168 Ceramic and semi-metal (silicon); high in thermal conductivity, lightweight, high compatibility in coefficient of thermal expansion; silicon carbide |
| 05/18/2004 | US6737153 Circuit board and method for manufacturing the same, and electronic apparatus comprising it |
| 05/18/2004 | US6737108 Microcapsulating conductive metal particles with polymerized monomers |
| 05/18/2004 | US6736947 Sputtering target, A1 interconnection film, and electronic component |
| 05/18/2004 | US6736665 Contact structure production method |
| 05/18/2004 | US6736306 Semiconductor chip package comprising enhanced pads |
| 05/18/2004 | US6736192 CPU cooler |
| 05/18/2004 | US6735972 Apparatus and method to substantially minimize low-cycle fatigue of electrical connections |
| 05/18/2004 | US6735864 Heatsink method of manufacturing the same and cooling apparatus using the same |
| 05/18/2004 | US6735860 Heat transfer material for an improved die edge contacting socket |
| 05/18/2004 | US6735859 Method of manufacturing chip scale package |
| 05/18/2004 | US6735857 Method of mounting a BGA |
| 05/13/2004 | WO2004040952A1 Graphics card apparatus with improved heat dissipation |
| 05/13/2004 | WO2004040659A1 Image sensor device |
| 05/13/2004 | WO2004040646A1 Electronic component with an integrated passive electronic component and method for production thereof |
| 05/13/2004 | WO2004040645A1 Microfluidic heat exchanger for locatized temperature control |
| 05/13/2004 | WO2004040642A1 Oxygen bridge structures and methods |
| 05/13/2004 | WO2004040634A1 Process monitor and system for producing semiconductor |
| 05/13/2004 | WO2004040622A2 Nickel silicide with reduced interface roughness |
| 05/13/2004 | WO2004040618A2 Feedthrough design and method for a hermetically sealed microdevice |
| 05/13/2004 | WO2004040596A1 Solid state inducting device |
| 05/13/2004 | WO2004040357A2 Power management for spatial power combiners |
| 05/13/2004 | WO2004040044A1 Metal plating structure and method for production thereof |
| 05/13/2004 | WO2004013911A3 Thermal management system having porous fluid transfer element |
| 05/13/2004 | WO2003092071A3 Integrated circuit comprising several sensors for detecting a manipulation |
| 05/13/2004 | WO2003084861A3 Method of manufacturing an electronic device in a cavity with a cover |
| 05/13/2004 | WO2003079437A3 Semiconductor device having a bond pad and method therefor |
| 05/13/2004 | WO2003069969A3 High density 3-d integrated circuit package |
| 05/13/2004 | WO2003041127B1 Process for forming metallized contacts to periphery transistors |
| 05/13/2004 | WO2002001638A3 Microelectronic packages including reactive components, and methods of fabricating the same |
| 05/13/2004 | US20040093577 Single metal programmability in a customizable integrated circuit device |
| 05/13/2004 | US20040093575 Chemically synthesized and assembled electronic devices |
| 05/13/2004 | US20040092668 Resin composition for optical-semiconductor encapsulation |
| 05/13/2004 | US20040092147 Connector for automotive bridge rectifier assembly |
| 05/13/2004 | US20040092141 Electronic system modules and method of fabrication |
| 05/13/2004 | US20040092130 Method of manufacturing semiconductor device having metal alloy interconnection that has excellent EM lifetime |
| 05/13/2004 | US20040092129 Method for manufacturing circuit devices |
| 05/13/2004 | US20040092127 Method of forming cavity between multilayered wirings |
| 05/13/2004 | US20040092124 Method of manufacturing a semiconductor integrated circuit device having a plurality of wiring layers and mask-pattern generation method |
| 05/13/2004 | US20040092117 Method for fabricating a through-hole interconnection substrate and a through-hole interconnection substrate |
| 05/13/2004 | US20040092111 Method of dry etching organic SOG film |
| 05/13/2004 | US20040092099 Semiconductor device and manufacturing method therefor, circuit board, and electronic equipment |
| 05/13/2004 | US20040092097 Multilayer wiring structure of semiconductor device, method of producing said multilayer wiring structure and semiconductor device to be used for reliability evaluation |
| 05/13/2004 | US20040092096 Oxygen bridge structures and methods to form oxygen bridge structures |
| 05/13/2004 | US20040092094 Integrated device technology using a buried power buss for major device and circuit advantages |
| 05/13/2004 | US20040092093 Method for producing an integrated circuit having at least one metalicized surface |
| 05/13/2004 | US20040092092 Semiconductor device with under bump metallurgy and method for fabricating the same |
| 05/13/2004 | US20040092091 Process for forming fusible links |
| 05/13/2004 | US20040092089 Polysilicon processing using an anti-reflective dual layer hardmask for 193 nm lithography |
| 05/13/2004 | US20040092086 Film forming method and film forming device |
| 05/13/2004 | US20040092081 Method of manufacturing alignment mark and aligning method using the same |
| 05/13/2004 | US20040092080 Marks and method for multi-layer alignment |
| 05/13/2004 | US20040092072 Arrangements having increased on-die capacitance |
| 05/13/2004 | US20040091719 For use in cellular phone |
| 05/13/2004 | US20040091625 Methods of filling a feature on a substrate with copper nanocrystals |
| 05/13/2004 | US20040091419 Zeolite sol and method for preparing the same, composition for forming porous film, porous film and method for forming the same, interlevel insulator film, and semiconductor device |
| 05/13/2004 | US20040091311 Clip for pressing a heat sink tightly against a CPU surrounded by a stationary enclosure |
| 05/13/2004 | US20040090843 Large line conductive pads for interconnection of stackable circuitry |
| 05/13/2004 | US20040090834 Based pad layout for reducing parasitic base-collector capacitance and method of fabricating HBT using the same |
| 05/13/2004 | US20040090829 Memory card and its manufacturing method |
| 05/13/2004 | US20040090760 Electrical connecting element and method of fabricating the same |
| 05/13/2004 | US20040090759 Multi-package stack module |
| 05/13/2004 | US20040090758 Multi-layered semiconductor device and method of manufacturing same |
| 05/13/2004 | US20040090756 Chip packaging structure and manufacturing process thereof |
| 05/13/2004 | US20040090753 Component mounting circuit board with resin-molded section covering circuit pattern and inner components |
| 05/13/2004 | US20040090746 Cooling device for a computer |
| 05/13/2004 | US20040090745 Cooling a microchip on a circuit board |
| 05/13/2004 | US20040090732 Plated terminations |
| 05/13/2004 | US20040090261 Self-timed and self-tested fuse blow |
| 05/13/2004 | US20040089958 Conductor wafer and substrate |
| 05/13/2004 | US20040089957 Semiconductor device with improved design freedom of external terminal |
| 05/13/2004 | US20040089956 Chip is attached to a baseplate, a conductive layer that is at least as high as the chip is attached to the baseplate. A cover plate, provided with electrically conductive surfaces, is arranged on this conductive layer, which is both |
| 05/13/2004 | US20040089955 A first integrated circuit affixed to a substrate; an electronic circuit component affixed to the substrate; a first encapsulation structure encasing the first integrated circuit; a second integrated circuit affixed to the first |
| 05/13/2004 | US20040089954 Semiconductor component having redistribution conductors and bumped contacts on selected portions thereof |
| 05/13/2004 | US20040089953 Via construction |
| 05/13/2004 | US20040089952 Structure and method for charge sensitive electrical devices |
| 05/13/2004 | US20040089951 Post passivation interconnection schemes on top of the IC chips |
| 05/13/2004 | US20040089950 Semiconductor device with dummy structure |
| 05/13/2004 | US20040089949 Semiconductor device with an improved transmission line |
| 05/13/2004 | US20040089948 Technology for fabrication of packaging interface substrate wafers with fully metallized vias through the substrate wafer |
| 05/13/2004 | US20040089947 Semiconductor device with multilayer conductive structure formed on a semiconductor substrate |
| 05/13/2004 | US20040089946 Chip size semiconductor package structure |
| 05/13/2004 | US20040089945 Semiconductor device |
| 05/13/2004 | US20040089944 Semiconductor device with improved design freedom of external terminal |
| 05/13/2004 | US20040089943 First and second ceramic substrates housed in a case. The first ceramic substrate has electronic components including a semiconductor component mounted on its surface. The second ceramic substrate is fixed to the top face of the |
| 05/13/2004 | US20040089942 Semiconductor device having radiation structure |
| 05/13/2004 | US20040089941 Two semiconductor chips that are interposed between a pair of radiation members, and thermally and electrically connected to the radiation members. One of the radiation members has two protruding portions and front ends of the protruding portions |
| 05/13/2004 | US20040089940 Two semiconductor chips that are interposed between a pair of radiation members, and thermally and electrically connected to the radiation members. One of the radiation members has two protruding portions and front ends of protruding portions are |
| 05/13/2004 | US20040089938 Bonding pad design |
| 05/13/2004 | US20040089936 Semiconductor device |