| Patents for H01L 23 - Details of semiconductor or other solid state devices (226,155) |
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| 05/19/2004 | CN1498420A Mask sheet for assembling semiconductor device and method for assembling semiconductor device |
| 05/19/2004 | CN1498417A Method for assembling components and antenna in radio frequency identification devices |
| 05/19/2004 | CN1498410A Mounting for electrical circuit in particular electrial breaker |
| 05/19/2004 | CN1498068A High-frequency device |
| 05/19/2004 | CN1498063A Manufacturing method of circuit device |
| 05/19/2004 | CN1498059A Multi-layer structure unit and its manufacturing method |
| 05/19/2004 | CN1497737A Semiconductor device and its manufacturing method |
| 05/19/2004 | CN1497723A Semiconductor integrated circuit and its manufactring method |
| 05/19/2004 | CN1497720A Packing semiconductor device |
| 05/19/2004 | CN1497719A Semiconductor device and its manufacturing method |
| 05/19/2004 | CN1497718A 半导体器件 Semiconductor devices |
| 05/19/2004 | CN1497717A Circuit device and its manufacturing method |
| 05/19/2004 | CN1497716A Package for semiconductor chip and semiconductor device |
| 05/19/2004 | CN1497715A Semiconductor device with improved heat sink structure |
| 05/19/2004 | CN1497714A Flame-retarded epoxy composition for packing semiconductor and semiconductor device |
| 05/19/2004 | CN1497713A Semiconductor device and its manufacturing method |
| 05/19/2004 | CN1497712A Circuit device and its manufacturing method |
| 05/19/2004 | CN1497711A Aluminium-ceramic combined component |
| 05/19/2004 | CN1497710A Circuit substrate, mounting structure of semiconductor element with lug and electrio-optical device |
| 05/19/2004 | CN1497709A Circuit substrate, installing structure of solder ball network display and electro-light device |
| 05/19/2004 | CN1497700A Semiconductor device and its making method |
| 05/19/2004 | CN1497693A Belt for carrying automatic welding |
| 05/19/2004 | CN1497692A Manufacturing method of circuit device |
| 05/19/2004 | CN1497691A Manufacturing method of circuit device |
| 05/19/2004 | CN1497690A Manufacturing method of circuit device |
| 05/19/2004 | CN1497689A Chip on film semiconductor device and its manufacturing method |
| 05/19/2004 | CN1497688A Manufacturing method of circuit device |
| 05/19/2004 | CN1497687A Manufacturing method of circuit device |
| 05/19/2004 | CN1497683A Semiconductor with dielectric film comprising porous structure and manufacturing method thereof |
| 05/19/2004 | CN1497673A Slushing compound filling method and manufacturing method of semiconductor device |
| 05/19/2004 | CN1497669A Semiconductor chip and its manufacturing method |
| 05/19/2004 | CN1497661A Device and method for preventing oxidizing of electronic device |
| 05/19/2004 | CN1497613A Low medium material and preparation method thereof |
| 05/19/2004 | CN1497591A Voice code device and decode device, optical recording medium and voice transmission method |
| 05/19/2004 | CN1497590A Voice code device and decode device, optical recording medium and voice transmission method |
| 05/19/2004 | CN1497589A Voice code device and decode device, optical recording medium and voice transmission method |
| 05/19/2004 | CN1497588A Voice coding device and decoding device, optical recording medium and voice transmission method |
| 05/19/2004 | CN1497587A Voice coding device and decoding device, optical recording medium and voice transmission method |
| 05/19/2004 | CN1497586A Voice coding device and decoding device, optical recording medium and voice transmission method |
| 05/19/2004 | CN1497585A Voice coding device and decoding device, optical recording medium and voice transmission method |
| 05/19/2004 | CN1150676C Electronic element with conductor and lead terminal |
| 05/19/2004 | CN1150637C Electronic component involving 3-terminal tape piezo-electric device |
| 05/19/2004 | CN1150636C Electronic component involving two-terminal type piezo-electric device |
| 05/19/2004 | CN1150622C Electronic component and use of protective structure contained therein |
| 05/19/2004 | CN1150621C Substrate for assembling electronic elements and piezoelectric vibrator with the substrate |
| 05/19/2004 | CN1150619C Copper interconnection structure incorporating metal seed layer |
| 05/19/2004 | CN1150618C Tape carrier and tape carrier device using the same |
| 05/19/2004 | CN1150617C Semiconductor substrate and stackable semiconductor package and fabrication method thereof |
| 05/19/2004 | CN1150616C Semiconductor device, method for manufacturing the same, and method for mounting thd same |
| 05/19/2004 | CN1150615C Semiconductor device and method for manufacturing same |
| 05/19/2004 | CN1150614C Semiconductor encapsulation and its manufacture method |
| 05/19/2004 | CN1150613C Organic chip carriers for wire bond-type chip |
| 05/19/2004 | CN1150606C Method for forming lead hole in fuse structure and metal fuse structure |
| 05/19/2004 | CN1150597C Method for forming washer in submicron hole with large height width ratio and line |
| 05/19/2004 | CN1150399C Fin and method for applying thermal conductive grease on fin |
| 05/19/2004 | CN1150279C Aromatic polysulphone resin composition and its moulded product |
| 05/19/2004 | CN1150258C Thermally conductive composite material |
| 05/18/2004 | US6738263 Stackable ball grid array package |
| 05/18/2004 | US6738258 Power semiconductor module |
| 05/18/2004 | US6738253 Electronic power module and a power component designed to equip such a module |
| 05/18/2004 | US6738249 Universal energy conditioning interposer with circuit architecture |
| 05/18/2004 | US6738123 Drive circuit connection structure including a substrate, circuit board, and semiconductor device, and display apparatus including the connection structure |
| 05/18/2004 | US6738109 Thin film transistor substrate for liquid crystal display panel and manufacturing method thereof |
| 05/18/2004 | US6737890 Switching circuit device |
| 05/18/2004 | US6737882 Method for universal wafer carrier for wafer level die burn-in |
| 05/18/2004 | US6737755 Ball grid array package with improved thermal characteristics |
| 05/18/2004 | US6737754 COF packaged semiconductor |
| 05/18/2004 | US6737750 Structures for improving heat dissipation in stacked semiconductor packages |
| 05/18/2004 | US6737749 Resistive vias for controlling impedance and terminating I/O signals at the package level |
| 05/18/2004 | US6737748 Stacked via with specially designed landing pad for integrated semiconductor structures |
| 05/18/2004 | US6737747 Advanced BEOL interconnect structures with low-k PE CVD cap layer and method thereof |
| 05/18/2004 | US6737746 Semiconductor device containing copper diffusion preventive film of silicon carbide |
| 05/18/2004 | US6737745 Method for relieving bond stress in an under-bond-pad resistor |
| 05/18/2004 | US6737743 Memory chip cut out of wafer including basic chips functioning as memory chip independently from each other, dicing line interposed between and connecting basic chips, and configuring part of memory chip; each basic chip is operated independently |
| 05/18/2004 | US6737741 Process for mounting electronic device and semiconductor device |
| 05/18/2004 | US6737740 High performance silicon contact for flip chip |
| 05/18/2004 | US6737739 Method of vacuum packaging a semiconductor device assembly |
| 05/18/2004 | US6737737 Semiconductor package with chip supporting member |
| 05/18/2004 | US6737736 Semiconductor device |
| 05/18/2004 | US6737735 Semiconductor device wiring lead frame having resin flow control plates |
| 05/18/2004 | US6737734 Structure and method for securing bussing leads |
| 05/18/2004 | US6737733 Sealed semiconductor device and lead frame used for the same |
| 05/18/2004 | US6737726 Resistance variable device, analog memory device, and programmable memory cell |
| 05/18/2004 | US6737720 Packaging structure of image sensor and method for packaging the same |
| 05/18/2004 | US6737714 FET having a gate electrode of a honeycomb structure |
| 05/18/2004 | US6737712 Method of manufacturing semiconductor integrated circuit device having capacitor element |
| 05/18/2004 | US6737698 Shielded capacitor structure |
| 05/18/2004 | US6737697 Having first and second tetraethyl orthosilicate-ozone films formed on protection film through chemical vapor deposition; second film has higher ozone concentration and lower water content as compared to first film |
| 05/18/2004 | US6737590 Tape circuit board and semiconductor chip package including the same |
| 05/18/2004 | US6737524 Activated polyethylene glycol compounds |
| 05/18/2004 | US6737363 Forming a low dielectric constant insulating film including a siloxane bond as main skeleton on a semiconductor structure including a substrate; impregnating insulating film with a surfactant; exposure to water |
| 05/18/2004 | US6737357 Method for manufacturing a semiconductor device |
| 05/18/2004 | US6737355 Thick thermal oxide layers and isolation regions in a silicon-containing substrate for high voltage applications |
| 05/18/2004 | US6737351 Versatile system for diffusion limiting void formation |
| 05/18/2004 | US6737349 Method of forming a copper wiring in a semiconductor device |
| 05/18/2004 | US6737346 Integrated circuit with modified metal features and method of fabrication therefor |
| 05/18/2004 | US6737345 Scheme to define laser fuse in dual damascene CU process |
| 05/18/2004 | US6737326 Method of integrating a thin film resistor in a multi-level metal tungsten-plug interconnect |
| 05/18/2004 | US6737319 Method of manufacturing semiconductor device and semiconductor device |
| 05/18/2004 | US6737315 Method of manufacturing semiconductor device including steps of forming both insulating film and epitaxial semiconductor on substrate |