| Patents for H01L 23 - Details of semiconductor or other solid state devices (226,155) |
|---|
| 05/20/2004 | US20040096992 Method for producing and testing a corrosion-resistant channel in a silicon device |
| 05/20/2004 | US20040096755 Mask-making member and its production method, mask and its making method, exposure process, and fabrication method of semiconductor device |
| 05/20/2004 | US20040096676 Wet etchable laminated body, insulation film, and electronic circuit part using the laminated body and the film |
| 05/20/2004 | US20040096634 Wiring board and process of producing the same |
| 05/20/2004 | US20040096633 Adhesive film for underfill and semiconductor device using the same |
| 05/20/2004 | US20040096591 Dielectric layer with aperture; scanning, discharging drops of polymeric etching barrier; hardening |
| 05/20/2004 | US20040096398 Prepared by hydrolyzing and polycondensing a cyclic siloxane compound, and two silane compounds having three hydrolysable functional groups and one of which has an alkoxyalkyl or haloalkyl heat-labile functional group |
| 05/20/2004 | US20040095829 Ruggedised solid-state storage device |
| 05/20/2004 | US20040095736 Multi-chip package having increased reliabilty |
| 05/20/2004 | US20040095734 High capacitance package substrate |
| 05/20/2004 | US20040095730 Heat dissipation system for semiconductor device |
| 05/20/2004 | US20040095728 System and method for mounting a heat sink |
| 05/20/2004 | US20040095727 Thermal heat spreaders designed for lower cost manufacturability, lower mass and increased thermal performance |
| 05/20/2004 | US20040095726 Heat sink and combinations |
| 05/20/2004 | US20040095725 Cooling device capable of reducing thickness of electronic apparatus |
| 05/20/2004 | US20040095723 Internal heat sink construction for CPU cabinet |
| 05/20/2004 | US20040095722 Apparatus and method for heat sink |
| 05/20/2004 | US20040095721 Frame level partial cooling boost for drawer and/or node level processors |
| 05/20/2004 | US20040095714 Snapping mechanism for CPU cooler |
| 05/20/2004 | US20040095710 Circuit module |
| 05/20/2004 | US20040095707 Method of forming a low inductance high capacitance capacitor |
| 05/20/2004 | US20040095693 LGA package socket |
| 05/20/2004 | US20040095172 Semiconductor device having identification number, manufacturing method thereof and electronic device |
| 05/20/2004 | US20040094847 Multi-layered semiconductor structure |
| 05/20/2004 | US20040094846 Semiconductor device mounting method, semiconductor device mounting structure, ellectro-optical device, electro-optical device manufacturing method and electronic device |
| 05/20/2004 | US20040094845 Semiconductor device |
| 05/20/2004 | US20040094844 Multichip module and multichip shutdown method |
| 05/20/2004 | US20040094842 Flip chip C4 extension structure and process |
| 05/20/2004 | US20040094841 Wiring structure on semiconductor substrate and method of fabricating the same |
| 05/20/2004 | US20040094840 Integrated circuit structure |
| 05/20/2004 | US20040094839 Reliable low-k interconnect structure with hybrid dielectric |
| 05/20/2004 | US20040094838 Improved step coverage, so as to improve a metal deposition rate on inner walls of a recess region within the semiconductor as compared a rate outside of the region |
| 05/20/2004 | US20040094837 Semiconductor device and method of formation |
| 05/20/2004 | US20040094836 Forming a cap above a metal layer |
| 05/20/2004 | US20040094835 Silicone metalization |
| 05/20/2004 | US20040094834 Ceramic multilayer substrate and method for manufacturing the same |
| 05/20/2004 | US20040094833 Semiconductor package |
| 05/20/2004 | US20040094832 Semiconductor package and manufacturing method thereof |
| 05/20/2004 | US20040094831 Semiconductor device, method for manufacturing semiconductor device and electronic equipment |
| 05/20/2004 | US20040094830 Integrated core microelectronic package |
| 05/20/2004 | US20040094829 Leadframe, resin-molded semiconductor device including the leadframe, method of making the leadframe and method for manufacturing the device |
| 05/20/2004 | US20040094828 Double-sided multi-chip circuit component |
| 05/20/2004 | US20040094827 Leadframe for semiconductor device, method for manufacturing semiconductor device using the same, semiconductor device using the same, and electronic equipment |
| 05/20/2004 | US20040094826 Leadframe pakaging apparatus and packaging method thereof |
| 05/20/2004 | US20040094821 Air gap for dual damascene applications |
| 05/20/2004 | US20040094820 Semiconductor integrated circuit device and method for designing the same |
| 05/20/2004 | US20040094818 Molecular device, molecule array, rectifier device, rectifying method, sensor device, switching device, circuit device, logical circuit device, operational device and information processing device |
| 05/20/2004 | US20040094817 Photo-interrupter and semiconductor device using the same |
| 05/20/2004 | US20040094762 Extraction method of defect density and size distributions |
| 05/20/2004 | US20040094537 Heat dissipation member for electronic apparatus and method for producing the same |
| 05/20/2004 | US20040094322 Electronic part with a lead frame |
| 05/20/2004 | US20040094320 Lid for use in packaging an electronic device and method of manufacturing the lid |
| 05/20/2004 | US20040094293 Heat radiating member |
| 05/20/2004 | US20040094290 Cooler for electronic devices |
| 05/20/2004 | US20040093887 Thermal management device |
| 05/19/2004 | EP1420458A2 Semiconductor device package and method of manufacture |
| 05/19/2004 | EP1420449A1 Device manufacturing method with reversed alignment markers |
| 05/19/2004 | EP1420448A1 Test structure to determine the electrical stability of contacts |
| 05/19/2004 | EP1420447A1 Isolation material for layers in intergrated circuits with damascene archtitecture, comprising molecules having atoms at the surface only, like for example fullerenes |
| 05/19/2004 | EP1420446A1 Heat conduction device |
| 05/19/2004 | EP1420445A1 Radiation plate and power semiconductor module; ic package |
| 05/19/2004 | EP1420444A2 Thermal and mechanical protection of discrete components in a circuit module |
| 05/19/2004 | EP1420443A2 Electrical connection device between two conductive layers of an integrated circuit |
| 05/19/2004 | EP1420441A1 Semiconductor device and method for manufacturing the same |
| 05/19/2004 | EP1420035A1 Filled epoxy resin composition for semiconductor encapsulation and semiconductor using same |
| 05/19/2004 | EP1419679A1 Low cost, large scale rf hybrid package for simple assembly onto mixed signal printed wiring boards |
| 05/19/2004 | EP1419534A2 Method for producing contacts and printed circuit packages |
| 05/19/2004 | EP1419528A2 Interconnect module with reduced power distribution impedance |
| 05/19/2004 | EP1419526A2 Through-via vertical interconnects, through-via heat sinks and associated fabrication methods |
| 05/19/2004 | EP1419525A2 Strip conductor arrangement and method for producing a strip conductor arrangement |
| 05/19/2004 | EP1419523A1 Dummy structures to reduce metal recess in electropolishing process |
| 05/19/2004 | EP1419522A2 Improvement of titanium disilicide resistance in narrow active regions of semiconductor devices |
| 05/19/2004 | EP1419289A1 Device for continuous electrodeposition and electrical or electronic components manufactured in strip comprising a plated layer by electrodeposition |
| 05/19/2004 | EP1321015B1 Microfluidic devices for heat transfer |
| 05/19/2004 | EP1295335B1 Miniature microdevice package and process for making same |
| 05/19/2004 | EP0764352B1 Microelectronic contacts and assemblies |
| 05/19/2004 | DE202004003783U1 Heat sink for a computer processor, has an arrangement of heat conducting pipes and heat dissipating walls and adapters that provide very efficient heat removal |
| 05/19/2004 | DE10350137A1 Halbleitereinrichtung Semiconductor device |
| 05/19/2004 | DE10261343A1 Verfahren zur Konstruktion einer Halbleitervorrichtung A process for the construction of a semiconductor device |
| 05/19/2004 | DE10252556B3 Production of an electronic component having external contact elements comprises preparing a metal plate having several component positions, forming recesses in one upper side of the plate, and further processing |
| 05/19/2004 | DE10251527A1 Manufacturing stack arrangement for FBGA memory module, by severing bond between bond pad and landing pad and bonding free ends to contact pads on carrier substrate |
| 05/19/2004 | DE10251446A1 Cooling arrangement for a photovoltaic light concentrating unit has heat pipe attached to the heat transmitting surfaces of the device or devices |
| 05/19/2004 | DE10250621A1 Process for producing encapsulated chips, involves separates chipping with contacts from a wafer and spray coating to encapsulate and applying wiring structure |
| 05/19/2004 | DE10250619A1 Semiconductor element with electrostatic discharge structure and production process for signal input and output has guard ring around the esd structure |
| 05/19/2004 | DE10250604A1 Integriertes Schaltungssystem mit Latentwärmespeichermodul An integrated circuit system with a latent heat storage module |
| 05/19/2004 | DE10250538A1 Electronic component with two or more semiconductor chips, has circuit carrier flush with active surface of chips, forming fine wiring plane with contact terminals at edges |
| 05/19/2004 | DE10229542B4 Elektronisches Bauteil mit mehrschichtiger Umverdrahtungsplatte und Verfahren zur Herstellung desselben The same electronic device having multilayer rewiring and methods for preparing |
| 05/19/2004 | DE10153315B4 Halbleiterbauelement Semiconductor device |
| 05/19/2004 | CN2617037Y Semiconductor overvoltage protection device |
| 05/19/2004 | CN2617036Y Heat-tube radiator for high-power electric-power semiconductor device |
| 05/19/2004 | CN2617035Y 散热片 Fins |
| 05/19/2004 | CN2617034Y Material-saving radiating fin group |
| 05/19/2004 | CN2617033Y Flip-chip packaging structure |
| 05/19/2004 | CN2617032Y Semiconductor and diode packaging structure |
| 05/19/2004 | CN2616941Y Cpu散热器 Cpu radiator |
| 05/19/2004 | CN1498522A Electronic module with cooling substrate with fluid dissociation electrodes and related method |
| 05/19/2004 | CN1498520A Method of manufacturing electronic part and electronic part obtained by the method |
| 05/19/2004 | CN1498423A Mixed analog and digital inegrated circits |
| 05/19/2004 | CN1498422A Power semiconductor module |
| 05/19/2004 | CN1498421A Substrate for high-frequency module and high-frequency module |