Patents
Sitemap › H01 - Basic electric elements › H01L - Semiconductor devices; Electric solid state devices not otherwise provided for › H01L 23 - Details of semiconductor or other solid state devices
Patents for H01L 23 - Details of semiconductor or other solid state devices (226,155)
02/2014
02/13/2014DE102012214392A1 Electrical device has housing wall that is provided with closable opening through which the electrically insulating filler enters into the volume
02/13/2014DE102012214325A1 Verfahren zum Herstellen eines optoelektronischen Bauelementes und Verfahren zum Strukturieren eines organischen, optoelektronischen Bauelementes A method for producing an optoelectronic component and method of patterning an organic optoelectronic component
02/13/2014DE102012214248A1 Bauelemente und verfahren zum herstellen eines bauelementes Devices and methods for the manufacture of a component
02/13/2014DE102012214216A1 Organisches Leuchtdiodenmodul und Verfahren zu dessen Herstellung An organic light emitting diode module and method for its production
02/13/2014DE102012214056A1 High temperature change-fixed insertion diode e.g. trench junction barrier schottky diode, for use in motor vehicle-generator system, has isolating plastic layer overlapping radial inner-lying end area of another isolating plastic layer
02/13/2014DE102012211924B4 Halbleitermodul mit einem in einer Anschlusslasche integrierten Shunt-Widerstand und Verfahren zur Ermittlung eines durch einen Lastanschluss eines Halbleitermoduls fließenden Stromes A semiconductor module with a built-in a connecting bracket shunt resistor and method for determining a current flowing through a load terminal of a semiconductor module current
02/13/2014DE102012110654A1 Package-on-Package-Struktur mit geringen Abständen Package-on-package structure at short distances
02/13/2014DE102012107307A1 Cooling device of cooling system for cooling e.g. insulated gate bipolar transistor, has sealing element with metal ring, which is arranged between closing device and housing
02/13/2014DE102009044639B4 Bauelement mit einem Halbleiterchip und Verfahren zur Herstellung eines Moduls mit gestapelten Bauelementen Component having a semiconductor chip and method of manufacturing a module with stacked components
02/13/2014DE102008045614B4 Kontaktierung eines halbleiterbauelements oder halbleitermoduls mit einem vorgespannten drahtbauteil und verfahren zur kontaktierung Contacting a semiconductor component or semiconductor module with a prestressed wire member and method for contacting
02/13/2014DE102008012570B4 Leistungshalbleitermodul-System, Leistungshalbleitermodulanordnung und Verfahren zur Herstellung einer Leistungshalbleitermodulanordnung Power semiconductor module system, the power semiconductor module assembly and method of manufacturing a power semiconductor module assembly
02/13/2014DE102006010761B4 Halbleitermodul Semiconductor module
02/13/2014DE102004030056B4 Ausgeformte Halbleitervorrichtung Lofted semiconductor device
02/12/2014EP2695898A1 Resin material, method for producing same, method for repairing same, and members using same
02/12/2014EP2695795A1 Molded module and electric power steering apparatus
02/12/2014EP2695717A1 Device module and method of manufacturing the device module
02/12/2014EP2695715A1 Device module and method of manufacturing the same
02/12/2014EP2695192A1 Induced thermal gradients
02/12/2014EP2695191A1 Improved matching techniques for wide-bandgap power transistors
02/12/2014EP2695190A2 Voltage switchable dielectric for die-level electrostatic discharge (esd) protection
02/12/2014EP2695189A1 Ceramic printed circuit board comprising an al cooling body
02/12/2014EP2695188A2 High density microelectronics packaging
02/12/2014EP2694699A1 Method for depositing one or more polycrystalline silicon layers on substrate
02/12/2014CN203434161U Small chamfering piece type diode
02/12/2014CN203434158U Layout of static random-access memory (SRAM) cell
02/12/2014CN203434154U 方形整流桥 Square rectifier bridge
02/12/2014CN203434153U Capacitor assembly/chip-integrated radio frequency chip encapsulation structure
02/12/2014CN203434152U Capacitor structure of panel integrated scanning drive circuit
02/12/2014CN203434151U 半导体器件 Semiconductor devices
02/12/2014CN203434150U 组合式框架 Modular framework
02/12/2014CN203434149U Cylindrical salient-point packaging structure having FeNi alloy or FeNiP alloy-based reaction interface layer
02/12/2014CN203434148U 半导体装置 Semiconductor device
02/12/2014CN203434147U CPU chip cooling strusture
02/12/2014CN203434146U Radiating structure of semiconductor device
02/12/2014CN203434145U Fastening device for flat-type silicon controlled rectifier
02/12/2014CN203434144U IGBT element radiator
02/12/2014CN203434143U High hot-fluid density heat dissipation gilled radiator
02/12/2014CN203434142U Radiating device
02/12/2014CN203434141U Wafer-level-packaging structure of image sensor
02/12/2014CN203434140U Igbt module
02/12/2014CN203434139U Flip-chip filter packaging structure
02/12/2014CN103583087A Circuit board and electronic device provided with same
02/12/2014CN103582946A Package-on-package assembly with wire bond to encapsulation surface
02/12/2014CN103582945A 半导体器件 Semiconductor devices
02/12/2014CN103582942A Method for forming a vertical electrical connection in a layered semiconductor structure
02/12/2014CN103582939A 氮化物半导体装置 The nitride semiconductor device
02/12/2014CN103579374A High intensity temperature change-resistant crimping diode
02/12/2014CN103579354A Thin film transistor substrate and display device provided with thin film transistor substrate
02/12/2014CN103579322A IGBT device capable of improving switch-on and switch-off speed and switch-on and switch-off uniformity and manufacturing method thereof
02/12/2014CN103579288A Pixel control structure and array and method of manufacturing thereof, display and backplane thereof
02/12/2014CN103579278A Imaging sensor packaging structure and method based on glass substrate
02/12/2014CN103579269A 半导体装置及其制造方法 Semiconductor device and manufacturing method
02/12/2014CN103579222A Capacitor topological structure and integrated circuit
02/12/2014CN103579209A Alternative 3D stacking scheme for DRAMs atop GPUs
02/12/2014CN103579208A Three-dimensional integrated circuits and fabrication thereof
02/12/2014CN103579207A Stacked packaging device and manufacturing method thereof
02/12/2014CN103579206A Stacked packaging device and manufacturing method thereof
02/12/2014CN103579205A Integrated system and method of making the integrated system
02/12/2014CN103579204A Package structures including capacitor and methods of forming the same
02/12/2014CN103579203A High-efficiency silicon controlled rectifier
02/12/2014CN103579202A Semiconductor device electromagnetic shielding structure comprising organic substrate and production method
02/12/2014CN103579201A Semiconductor device electromagnetic shielding structure made with electric conduction packaging material and manufacturing method
02/12/2014CN103579200A Metal channel noise reduction structure and manufacturing method thereof
02/12/2014CN103579199A Double seal ring
02/12/2014CN103579198A Chip encapsulation structure and guide line frame
02/12/2014CN103579197A Electromagnetic-interference (EMI)-shielding semiconductor element
02/12/2014CN103579196A Wafers and chips comprising test structures
02/12/2014CN103579195A Integrated circuit and display device including same
02/12/2014CN103579194A Semiconductor device and display device having alignment mark
02/12/2014CN103579193A Electricity leakage test structure and test method of semiconductor element
02/12/2014CN103579192A Novel through hole chain testing structure and testing method thereof
02/12/2014CN103579191A Semiconductor testing structure for testing leakage current of 6T-SRAM
02/12/2014CN103579190A Chip package and method for manufacturing same
02/12/2014CN103579189A Chip package and a method for manufacturing a chip package
02/12/2014CN103579188A Embedded integrated circuit package and method for manufacturing an embedded integrated circuit package
02/12/2014CN103579187A Method of reducing contact resistance of a metal
02/12/2014CN103579186A Connecting through vias to devices
02/12/2014CN103579185A Metal wiring of semiconductor device and method for manufacturing thereof
02/12/2014CN103579184A Ternary tungsten boride nitride films and methods for forming same
02/12/2014CN103579183A Interposer system and method
02/12/2014CN103579182A Method for electrically connecting vertically positioned substrates
02/12/2014CN103579181A Hybrid interconnect scheme and methods for forming the same
02/12/2014CN103579180A 半导体结构及其形成方法 And a method for forming a semiconductor structure
02/12/2014CN103579179A Capacitor arrangements and method for manufacturing a capacitor arrangement
02/12/2014CN103579178A Capacitors positioned at the device level in an integrated circuit product and methods of making such capacitors
02/12/2014CN103579177A Semiconductor device and method of manufacturing the same
02/12/2014CN103579176A Contact structure of semiconductor device
02/12/2014CN103579175A Copper contact plugs with barrier layers
02/12/2014CN103579174A Process-compatible decoupling capacitor and method for making the same
02/12/2014CN103579173A Semiconductor packaging member and production method thereof
02/12/2014CN103579172A 功率用半导体装置模块 Power semiconductor device module
02/12/2014CN103579171A Semiconductor packaging piece and manufacturing method thereof
02/12/2014CN103579170A Production of adhesion structures in dielectric layers using photoprocess technology and devices incorporating adhesion structures
02/12/2014CN103579169A Semiconductor package and method for fabricating base for semiconductor package
02/12/2014CN103579168A Substrate structure and packaging member provided with the same
02/12/2014CN103579167A Semiconductor wrapper and manufacturing method thereof
02/12/2014CN103579166A Pad structure
02/12/2014CN103579165A Full-pressure-welding power device
02/12/2014CN103579164A 连接结构体 Connection structure
02/12/2014CN103579163A System and method for mechanical and electrical package substrate issue mitigation
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