| Patents for H01L 23 - Details of semiconductor or other solid state devices (226,155) |
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| 05/25/2004 | US6740957 Shallow trench antifuse and methods of making and using same |
| 05/25/2004 | US6740956 Metal trace with reduced RF impedance resulting from the skin effect |
| 05/25/2004 | US6740952 High withstand voltage semiconductor device |
| 05/25/2004 | US6740950 Eliminates air gap between glass and die |
| 05/25/2004 | US6740942 Permanently on transistor implemented using a double polysilicon layer CMOS process with buried contact |
| 05/25/2004 | US6740940 Semiconductor memory devices having dummy active regions |
| 05/25/2004 | US6740934 ESD protection scheme for outputs with resistor loading |
| 05/25/2004 | US6740924 Semiconductor integrated circuit device and the method of producing the same |
| 05/25/2004 | US6740914 FET circuit block with reduced self-heating |
| 05/25/2004 | US6740902 Semiconductor package for series-connected diodes |
| 05/25/2004 | US6740823 Solder bonding method, and electronic device and process for fabricating the same |
| 05/25/2004 | US6740821 Selectively configurable circuit board |
| 05/25/2004 | US6740811 Electric terminal for an electronic device |
| 05/25/2004 | US6740685 A thermosetting resin contains an acetylenic oligomer or polymer with multi-phenyl adamantane ring, and bonded with porogen which can decompose to form pore; use as dielectric substrate in microchips, circuit boards |
| 05/25/2004 | US6740613 Dielectric ceramic composition |
| 05/25/2004 | US6740603 Control of Vmin transient voltage drift by maintaining a temperature less than or equal to 350° C. after the protective overcoat level |
| 05/25/2004 | US6740600 Enhanced interface thermoelectric coolers with all-metals tips |
| 05/25/2004 | US6740599 Method of fabricating contact holes in a semiconductor device |
| 05/25/2004 | US6740587 Semiconductor device having a metal silicide layer and method for manufacturing the same |
| 05/25/2004 | US6740584 Semiconductor device and method of fabricating the same |
| 05/25/2004 | US6740582 Integrated circuits and methods for their fabrication |
| 05/25/2004 | US6740580 Method to form copper interconnects by adding an aluminum layer to the copper diffusion barrier |
| 05/25/2004 | US6740577 Method of forming a small pitch torch bump for mounting high-performance flip-flop devices |
| 05/25/2004 | US6740576 Method of making a contact terminal with a plated metal peripheral sidewall portion for a semiconductor chip assembly |
| 05/25/2004 | US6740575 Method for forming an antifuse |
| 05/25/2004 | US6740573 Method for forming an integrated circuit interconnect using a dual poly process |
| 05/25/2004 | US6740567 Laminating method for forming integrated circuit microelectronic fabrication |
| 05/25/2004 | US6740564 Method for manufacturing a semiconductor device |
| 05/25/2004 | US6740551 Method of manufacturing a semiconductor integrated circuit |
| 05/25/2004 | US6740550 Methods of manufacturing semiconductor devices having chamfered silicide layers therein |
| 05/25/2004 | US6740548 Method of manufacture of silicon on insulator device with improved heat removal |
| 05/25/2004 | US6740546 Packaged microelectronic devices and methods for assembling microelectronic devices |
| 05/25/2004 | US6740545 Adhesion enhanced semiconductor die for mold compound packaging |
| 05/25/2004 | US6740543 Method and apparatus for encapsulating articles by stencil printing |
| 05/25/2004 | US6740541 Unmolded package for a semiconductor device |
| 05/25/2004 | US6740539 Carbon-graded layer for improved adhesion of low-k dielectrics to silicon substrates |
| 05/25/2004 | US6740430 Comprising anode and cathode, and at least one organic compound layer disposed between anode and cathode, hermetic sealing housing enclosing organic luminescence lamination structure, drying agent |
| 05/25/2004 | US6740411 Embedding resin, wiring substrate using same and process for producing wiring substrate using same |
| 05/25/2004 | US6740392 Surface barriers for copper and silver interconnects produced by a damascene process |
| 05/25/2004 | US6740352 Method for forming bonding pads |
| 05/25/2004 | US6740252 Potassium hypochlorite, hydrofluoric acid and deionized water |
| 05/25/2004 | US6740242 For forming an interconnection by embedding copper in fine interconnection groove defined in surface of semiconductor substrate through copper sulfate plating |
| 05/25/2004 | US6740221 Positioning substrate in an electroplating bath; forming doped copper layer on substrate; wherein the doped copper layer comprises an amount of non-metal that is controlled for increasing electromigration resistance in doped copper layer |
| 05/25/2004 | US6740145 Desiccants and desiccant packages for highly moisture-sensitive electronic devices |
| 05/25/2004 | US6739202 Method and apparatus for non-destructive testing of leaded packages |
| 05/25/2004 | US6739047 Low temperature co-fired ceramic circuit boards with metal support substrates; patterning the metal support to provide openings prior to mounting one or more high power modules, and applying solder pads to both sides |
| 05/25/2004 | US6739046 Method for producing dendrite interconnect for planarization |
| 05/25/2004 | US6739039 Manufacturing method of printed circuit board using dry film resist |
| 05/25/2004 | CA2115303C High-power component cooling device |
| 05/25/2004 | CA2083103C Binder composition and its use for the production of coating or sealing compositions |
| 05/21/2004 | WO2004043120A1 Method for manufacturing resin substrate, method for manufacturing multilayer resin substrate, and resin substrate |
| 05/21/2004 | WO2004042868A1 Integrated circuit package including miniature antenna |
| 05/21/2004 | WO2004042828A2 Cooling assembly for light concentrator photovoltaic systems |
| 05/21/2004 | WO2004042820A1 Shielding for electronic components and/or circuits that are sensitive to electromagnetic interference (emi) |
| 05/21/2004 | WO2004042819A1 Device comprising circuit elements connected by bonding bump structure |
| 05/21/2004 | WO2004042818A1 Integrated circuit with at least one bump |
| 05/21/2004 | WO2004042817A1 Method and structure to enhance temperature/humidity/bias performance of semiconductor devices by surface modification |
| 05/21/2004 | WO2004042815A1 Forming a copper diffusion barrier |
| 05/21/2004 | WO2004042814A1 Film carrier tape for mounting electronic component |
| 05/21/2004 | WO2004042800A2 Semiconductor arrangement |
| 05/21/2004 | WO2004042791A2 Method and apparatus for monitoring integrated circuit fabrication |
| 05/21/2004 | WO2004042780A2 Flexible semiconductor device and method of manufacturing the same |
| 05/21/2004 | WO2004042313A1 Method and apparatus for flexible fluid delivery for cooling desired hot spots in a heat producing device |
| 05/21/2004 | WO2004042307A2 Methods and apparatuses for electronics cooling |
| 05/21/2004 | WO2004042306A2 Method and apparatus for achieving temperature uniformity and hot spot cooling in a heat producing device |
| 05/21/2004 | WO2004042305A2 Optimal spreader system, device and method for fluid cooled micro-scaled heat exchange |
| 05/21/2004 | WO2004042304A2 Method and apparatus for efficient vertical fluid delivery for cooling a heat producing device |
| 05/21/2004 | WO2004042303A2 Interwoven manifolds for pressure drop reduction in microchannel heat exchangers |
| 05/21/2004 | WO2004042302A2 Channeled flat plate fin heat exchange system, device and method |
| 05/21/2004 | WO2004042297A2 Method and apparatus for efficient vertical fluid delivery for cooling a heat producing device |
| 05/21/2004 | WO2004041972A2 Gas layer formation materials |
| 05/21/2004 | WO2004041938A1 Heat conductive silicone composition |
| 05/21/2004 | WO2004041306A2 Emi shielding including a lossy medium |
| 05/21/2004 | WO2004027823A3 Semiconductor multi-package module having wire bond interconnection between stacked packages |
| 05/21/2004 | WO2004001904A8 Stabilized wire bonded electrical connections and method of making same |
| 05/21/2004 | WO2003105186A3 Integrated circuit and method for manufacturing same |
| 05/21/2004 | WO2003100829A3 Forming a multi segment integrated circuit with isolated substrates |
| 05/21/2004 | WO2003079439A3 Chip stack with intermediate cavity |
| 05/21/2004 | WO2003073503A3 Fuse structure programming by electromigration of silicide enhanced by creating temperature gradient |
| 05/21/2004 | WO2003044850A8 Apparatus for molding a semiconductor wafer and process therefor |
| 05/21/2004 | WO2003023821A3 Hermetic seal |
| 05/21/2004 | WO2002099164A3 Electroless-plating solution and semiconductor device |
| 05/20/2004 | US20040098216 Method and apparatus for monitoring integrated circuit fabrication |
| 05/20/2004 | US20040097651 Unsaturated compounds containing silane, electron donor and electron acceptor functionality |
| 05/20/2004 | US20040097635 Thermal interface material and method for making same |
| 05/20/2004 | US20040097632 Containing phenolic resin and inorganic filler; preventing short circuiting in devices having reduced pitch distance between interconnection electrodes or wires |
| 05/20/2004 | US20040097094 Package of semiconductor device and its manufacturing method |
| 05/20/2004 | US20040097086 Method for manufacturing circuit devices |
| 05/20/2004 | US20040097082 Semiconductor device having radiation structure |
| 05/20/2004 | US20040097081 Method for manufacturing circuit devices |
| 05/20/2004 | US20040097075 Copper silicide passivation for improved reliability |
| 05/20/2004 | US20040097070 Method of producing metal film |
| 05/20/2004 | US20040097068 Semiconductor device and method for fabricating the same |
| 05/20/2004 | US20040097067 Methods of fabricating integrated circuit devices providing improved short prevention |
| 05/20/2004 | US20040097024 Interconnections including multi-layer metal film stack for improving corrosion and heat resistances |
| 05/20/2004 | US20040097017 Method of manufacturing a semiconductor device |
| 05/20/2004 | US20040097016 Semiconductor package and method of making leadframe having lead locks to secure leads to encapsulant |
| 05/20/2004 | US20040097013 Air gap structure and formation method for reducing undesired capacitive coupling between interconnects in an integrated circuit device |
| 05/20/2004 | US20040097011 Circuit substrates, semiconductor packages, and ball grid arrays |
| 05/20/2004 | US20040096995 Test structure |