| Patents for H01L 23 - Details of semiconductor or other solid state devices (226,155) |
|---|
| 05/26/2004 | EP1421837A1 Electrically isolated module |
| 05/26/2004 | EP1421630A2 Method of depositing an oxide layer on a substrate and a photovoltaic cell using said substrate |
| 05/26/2004 | EP1421625A1 Method for making a colour image sensor with support substrate welded connection-on-connection |
| 05/26/2004 | EP1421620A2 Technique to minimize crosstalk in electronic packages |
| 05/26/2004 | EP1421619A2 Connecting the emitter contacts of a semiconductor device |
| 05/26/2004 | EP1421618A2 Power electronics component |
| 05/26/2004 | EP1421617A2 Power electronics component |
| 05/26/2004 | EP1421616A2 Method for fixing an electrical element and a module with an electrical element fixed thus |
| 05/26/2004 | EP1421609A1 Process and apparatus for treating a workpiece such as a semiconductor wafer |
| 05/26/2004 | EP1354237A4 Fat conductor |
| 05/26/2004 | EP1127387A4 Non-circular micro-via |
| 05/26/2004 | CN2618410Y Fitting mechanism |
| 05/26/2004 | CN2618302Y Improved semiconductor integrated circuit lead wire frame |
| 05/26/2004 | CN2618301Y TO-220 lead wrie frame with reinforced combining intensity structure and shape |
| 05/26/2004 | CN2618300Y Heat pipe radiator |
| 05/26/2004 | CN2618299Y 散热器结构 Radiator structure |
| 05/26/2004 | CN2618298Y Rapid-assembled radiative fin connecting structure |
| 05/26/2004 | CN2618297Y Radiator assembly |
| 05/26/2004 | CN2618296Y High-efficient radiating silicon rectifier bridge |
| 05/26/2004 | CN2618295Y Radiator |
| 05/26/2004 | CN2618294Y Radiator |
| 05/26/2004 | CN2618293Y Radiator buckle |
| 05/26/2004 | CN2618208Y Radiating module |
| 05/26/2004 | CN2618207Y Stack radiator |
| 05/26/2004 | CN2618206Y Radiating mould set of computer |
| 05/26/2004 | CN1499913A Wiring board and its mfg. method |
| 05/26/2004 | CN1499637A Non-volatile semiconductor storage |
| 05/26/2004 | CN1499630A Modularized device of stackable semiconductor package and preparing method |
| 05/26/2004 | CN1499629A 半导体装置 Semiconductor device |
| 05/26/2004 | CN1499628A Integrated circuit element with fuse structure including buffering layer, and mfg. method thereof |
| 05/26/2004 | CN1499627A Semiconductor device with fuse |
| 05/26/2004 | CN1499626A Semiconductor device and its mfg. method |
| 05/26/2004 | CN1499625A Soldering pad with dual copper inlaid interconnection wire and preparation method |
| 05/26/2004 | CN1499624A Semiconductor device with fraud structure |
| 05/26/2004 | CN1499623A Lead frame, resin sealed semiconductor device and its mfg. method |
| 05/26/2004 | CN1499622A Lead frame, its mfg. method and resin sealed semiconductor device and its mfg. method |
| 05/26/2004 | CN1499621A Semiconductor intergrated circuit device |
| 05/26/2004 | CN1499620A Radiator and semiconductor element using such radiator and semiconductor packing body |
| 05/26/2004 | CN1499619A Moulded resin encapsulated power semiconductor device and its mfg. method |
| 05/26/2004 | CN1499618A Epoxy compsn. for semiconductor package and semiconductor device using same |
| 05/26/2004 | CN1499617A Semiconductor device and its mfg. method |
| 05/26/2004 | CN1499616A Mfg. tech. of packaged interface substrate wafer having wholly metallized through hole |
| 05/26/2004 | CN1499614A Base plate for encapsulating semiconductor and semiconductor device |
| 05/26/2004 | CN1499613A Base plate for encapsulating semiconductor and semiconductor device |
| 05/26/2004 | CN1499608A 半导体装置 Semiconductor device |
| 05/26/2004 | CN1499607A Interconnection method of forming through lining |
| 05/26/2004 | CN1499596A Mfg. method of assembly set with electronic component and mfg. method for related products |
| 05/26/2004 | CN1499595A Semiconductor device and its mfg. method |
| 05/26/2004 | CN1499594A Method for mfg. electronic packaging, and electronic package |
| 05/26/2004 | CN1499592A Structure of jointed pads and preparation method |
| 05/26/2004 | CN1499591A Encapsulation structure of electronic component and its mfg. method |
| 05/26/2004 | CN1499590A Semiconductor device and its mfg. method |
| 05/26/2004 | CN1499544A Flat capacitor and IC socket using same, making method of such capacitor |
| 05/26/2004 | CN1499295A Positive light-sensitive compsn. |
| 05/26/2004 | CN1499273A Circuit substrate, its mfg. method, electrooptical device and electronic appliance |
| 05/26/2004 | CN1499166A Method for filling up slots between heat conductive parts as well as structure of part |
| 05/26/2004 | CN1498878A Method for preparing composite material of aluminium silicon carbide and structural piece |
| 05/26/2004 | CN1151558C Integrated circuit device and process for its manufacture |
| 05/26/2004 | CN1151555C Semiconductor device and lead frame for semiconductor device |
| 05/26/2004 | CN1151554C Semiconductor device, making method and composition type semiconductor device |
| 05/26/2004 | CN1151553C Base plate connection sheet for sphere grid several-group type chip pakcaging structure |
| 05/26/2004 | CN1151549C Semiconductor integrated circuit and its making method |
| 05/26/2004 | CN1151547C Semiconductor device fabrication method |
| 05/26/2004 | CN1151542C Electronic device and and its mfg. method |
| 05/26/2004 | CN1151009C Fabricating interconnects and tips using sacrificial substrates |
| 05/26/2004 | CN1151008C High-strength welding head |
| 05/25/2004 | US6741480 Integrated power delivery with flex circuit interconnection for high density power circuits for integrated circuits and systems |
| 05/25/2004 | US6741470 Reusable thermal solution attachment mechanism and methods of using same |
| 05/25/2004 | US6741469 Refrigeration cooling assisted MEMS-based micro-channel cooling system |
| 05/25/2004 | US6741468 Heat dissipating assembly |
| 05/25/2004 | US6741448 Composite electronic components |
| 05/25/2004 | US6741297 Control signal part and liquid crystal display including the control signal |
| 05/25/2004 | US6741144 High-frequency semiconductor device |
| 05/25/2004 | US6741142 High-frequency circuit element having means for interrupting higher order modes |
| 05/25/2004 | US6741114 Apparatus for adjusting input capacitance of semiconductor device and fabricating method |
| 05/25/2004 | US6741085 Contact carriers (tiles) for populating larger substrates with spring contacts |
| 05/25/2004 | US6741029 Light emission apparatus and method of fabricating the same |
| 05/25/2004 | US6740985 Structure for bonding pad and method for its fabrication |
| 05/25/2004 | US6740984 Ball grid array chip packages having improved testing and stacking characteristics |
| 05/25/2004 | US6740983 Efficient burn in |
| 05/25/2004 | US6740981 Semiconductor device including memory unit and semiconductor module including memory units |
| 05/25/2004 | US6740979 Semiconductor device and LSI defect analyzing method using the same |
| 05/25/2004 | US6740978 Chip package capable of reducing moisture penetration |
| 05/25/2004 | US6740977 Insulating layers in semiconductor devices having a multi-layer nanolaminate structure of SiNx thin film and BN thin film and methods for forming the same |
| 05/25/2004 | US6740976 Semiconductor device including via contact plug with a discontinuous barrier layer |
| 05/25/2004 | US6740974 Semiconductor device having capacitors provided with protective insulating film |
| 05/25/2004 | US6740973 Stacked structure for an image sensor |
| 05/25/2004 | US6740972 Electronic device having fibrous interface |
| 05/25/2004 | US6740971 Cavity ball grid array apparatus having improved inductance characteristics |
| 05/25/2004 | US6740970 Semiconductor device with stack of semiconductor chips |
| 05/25/2004 | US6740969 Electronic device |
| 05/25/2004 | US6740968 Power source unit for driving magnetron and heatsink to be mounted on printed circuit board thereof |
| 05/25/2004 | US6740967 Image sensor having an improved package structure |
| 05/25/2004 | US6740966 Bendable; no removal required |
| 05/25/2004 | US6740965 Flip-chip package substrate |
| 05/25/2004 | US6740964 Semiconductor package for three-dimensional mounting, fabrication method thereof, and semiconductor device |
| 05/25/2004 | US6740962 Tape stiffener, semiconductor device component assemblies including same, and stereolithographic methods for fabricating same |
| 05/25/2004 | US6740961 Lead frame design for chip scale package |
| 05/25/2004 | US6740960 Semiconductor package including flex circuit, interconnects and dense array external contacts |
| 05/25/2004 | US6740959 EMI shielding for semiconductor chip carriers |