| Patents for H01L 23 - Details of semiconductor or other solid state devices (226,155) |
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| 05/27/2004 | US20040102023 Semiconductor device and method of relaxing thermal stress |
| 05/27/2004 | US20040102022 Methods of fabricating integrated circuitry |
| 05/27/2004 | US20040102019 Split manufacturing method for advanced semiconductor circuits |
| 05/27/2004 | US20040102014 Method for generating alignment marks for manufacturing mim capacitors |
| 05/27/2004 | US20040102000 Photon-blocking layer |
| 05/27/2004 | US20040101996 Interconnection structure and method for designing the same |
| 05/27/2004 | US20040101995 Method for manufacturing circuit devices |
| 05/27/2004 | US20040101994 Reducing line to line capacitance using oriented dielectric films |
| 05/27/2004 | US20040101993 Component connections using bumps and wells |
| 05/27/2004 | US20040101992 Chips with wafer scale caps formed by molding |
| 05/27/2004 | US20040101991 Microelectronic device packages and methods for controlling the disposition of non-conductive materials in such packages |
| 05/27/2004 | US20040101985 Die testing using top surface test pads |
| 05/27/2004 | US20040101707 Composite structural material, and method of producing the same |
| 05/27/2004 | US20040101688 Curable epoxy compositions, methods and articles made therefrom |
| 05/27/2004 | US20040101663 Stacked via-stud with improved reliability in copper metallurgy |
| 05/27/2004 | US20040101631 Molding printed circuit boards; electronics |
| 05/27/2004 | US20040101003 Peltier cooler and semiconductor laser module |
| 05/27/2004 | US20040100850 Non-volatile memory element integratable with standard cmos circuitry and related programming methods and embedded memories |
| 05/27/2004 | US20040100848 Method of utilizing voltage gradients to guide dielectric breakdowns for non-volatile memory elements and related embedded memories |
| 05/27/2004 | US20040100832 Magnetic memory device |
| 05/27/2004 | US20040100778 Power converter package and thermal management |
| 05/27/2004 | US20040100771 Heat-dissipating device |
| 05/27/2004 | US20040100769 Cooling device for light valve |
| 05/27/2004 | US20040100768 Heat dissipating assembly with air guide device |
| 05/27/2004 | US20040100754 Enhanced high-frequency via interconnection for improved reliability |
| 05/27/2004 | US20040100608 Circuit substrate, manufacturing method thereof, electro-optical device, and electronic apparatus |
| 05/27/2004 | US20040100293 Test structure for determining the stability of electronic devices comprising connected substrates |
| 05/27/2004 | US20040099965 Integrated circuits having self-aligned metal contact structures |
| 05/27/2004 | US20040099963 Process-robust alignment mark structure for semiconductor wafers |
| 05/27/2004 | US20040099962 Flip chip electrical test yields by countering substrate die area coplanarity |
| 05/27/2004 | US20040099961 Semiconductor package substrate having bonding pads with plated layer thereon and process of manufacturing the same |
| 05/27/2004 | US20040099960 Economical high density chip carrier |
| 05/27/2004 | US20040099959 Conductive bump structure |
| 05/27/2004 | US20040099958 Crack resistant interconnect module |
| 05/27/2004 | US20040099957 Integrated circuit devices including low dielectric side wall spacers and methods of forming same |
| 05/27/2004 | US20040099956 Wiring structure in a semiconductor device |
| 05/27/2004 | US20040099955 Semiconductor device with improved design freedom of external terminal |
| 05/27/2004 | US20040099953 Redundancy structure in self-aligned contact process |
| 05/27/2004 | US20040099952 Multilayer dielectric structure; porosity matrix; decomposition, forming voids using carbon dioxide |
| 05/27/2004 | US20040099951 Air gap interconnect structure and method |
| 05/27/2004 | US20040099950 Semiconductor device |
| 05/27/2004 | US20040099949 Semiconductor device and fabrication method thereof |
| 05/27/2004 | US20040099948 Power semiconductor module with improved insulation strength |
| 05/27/2004 | US20040099947 Interconnection method and structure |
| 05/27/2004 | US20040099946 High density electronic cooling triangular shaped microchannel device |
| 05/27/2004 | US20040099945 IC package for a multi-chip module |
| 05/27/2004 | US20040099944 Semiconductor device |
| 05/27/2004 | US20040099943 Substrate sheet material for a semiconductor device and a manufacturing method thereof, a molding method using a substrate sheet material, a manufacturing method of semiconductor devices |
| 05/27/2004 | US20040099942 Ceramic multilayer substrate and method for manufacturing the same |
| 05/27/2004 | US20040099941 Flip-chip device having conductive connectors |
| 05/27/2004 | US20040099940 Semiconductor device having clips for connecting to external elements |
| 05/27/2004 | US20040099939 Semiconductor chip carrier; multilayer dielectric coverings; high density plating through aperture; connecting structure |
| 05/27/2004 | US20040099938 Assemblies having stacked semiconductor chips and methods of making same |
| 05/27/2004 | US20040099937 Semiconductor device, manufacturing method for semiconductor device and mounting method for the same |
| 05/27/2004 | US20040099936 Partially captured oriented interconnections for BGA packages and a method of forming the interconnections |
| 05/27/2004 | US20040099935 Electronic package with snap-on perimeter wall |
| 05/27/2004 | US20040099934 Noise eliminating system on chip and method of making same |
| 05/27/2004 | US20040099933 Heat spreading; encapsulated in molding materials |
| 05/27/2004 | US20040099932 Thin GaAs die with copper back-metal structure |
| 05/27/2004 | US20040099931 Semiconductor package with chip supporting structure |
| 05/27/2004 | US20040099927 Method of decontaminating process chambers, methods of reducing defects in anti-reflective coatings, and resulting semiconductor structures |
| 05/27/2004 | US20040099912 Use of silicon block process step to camouflage a false transistor |
| 05/27/2004 | US20040099910 Multilayer stacks; support substrates, etching barriers, semiconductor; reduced leakage current |
| 05/27/2004 | US20040099907 Semiconductor device equipped with fuel cell and method for producing the same |
| 05/27/2004 | US20040099897 Semiconductor device and method for fabricating the same |
| 05/27/2004 | US20040099884 Thick metal top layer |
| 05/27/2004 | US20040099877 Healing of micro-cracks in an on-chip dielectric |
| 05/27/2004 | US20040099867 Photon-blocking layer |
| 05/27/2004 | US20040099716 Solder joint reliability by changing solder pad surface from flat to convex shape |
| 05/27/2004 | US20040099638 Ion beam for target recovery |
| 05/27/2004 | US20040099632 Thinning of fuse passivation after C4 formation |
| 05/27/2004 | US20040099441 Printed circuit board,its manufacturing method and csp manufacturing method |
| 05/27/2004 | US20040099410 Decreasing thermal contact resistance at a material interface |
| 05/27/2004 | US20040099407 Stacked low profile cooling system and method for making same |
| 05/27/2004 | US20040099404 Cooling mechanism for an electronic device |
| 05/27/2004 | US20040099364 Method of producing a composite sheet and method of producing a laminate by using the composite sheet |
| 05/27/2004 | DE29924634U1 Electrical control circuit arrangement for control module, has circuit carrier substrate having printed circuit formed crossing electrically conductive path formed by bonding wire and another printed circuit |
| 05/27/2004 | DE19920505B4 Umrichter mit Temperatursymmetrierung Inverter with Temperatursymmetrierung |
| 05/27/2004 | DE19627630B4 Verfahren zur Herstellung eines Halbleiterbauelements oder Speicherbauelements mit einer Siliziumoxidschicht mit annähernd planarer Oberflächenform und Speicherbauelement mit einer Siliziumoxidschicht mit annähernd planarer Oberflächenform A process for producing a semiconductor device or memory device with a silicon oxide layer with approximately planar surface and shape memory device with a silicon oxide layer with approximately planar surface shape |
| 05/27/2004 | DE10351389A1 Halbleiterwafer und Substrat Semiconductor wafer and substrate |
| 05/27/2004 | DE10350510A1 Integrated circuit arrangement comprises an integrated circuit substrate having a secure zone, a window layer formed on the substrate, a buffer pattern formed between the substrate and the window layer, and a secure pattern |
| 05/27/2004 | DE10331857A1 Gießharzversiegelte Leistungshalbleitervorrichtung und Verfahren zu deren Herstellung Gießharzversiegelte power semiconductor device and process for their preparation |
| 05/27/2004 | DE10331819A1 Verfahren zum Bilden einer Substratdurchgangsverbindung A method of forming a substrate through connection |
| 05/27/2004 | DE10330081A1 Abschlüsse für abgeschirmte Übertragungsleitungen, die auf einem Substrat hergestellt sind Accounts for shielded transmission lines fabricated on a substrate |
| 05/27/2004 | DE10326732A1 Halbleitervorrichtung Semiconductor device |
| 05/27/2004 | DE10253163A1 Component used in microelectronics comprises a sandwich structure, a rear-side metallization extending over the rear side of the chip up to the boundary surfaces of the sandwich structure, lower side contacts, and through-contacts |
| 05/27/2004 | DE10252755A1 Thermischer und mechanischer Schutz von diskreten Bauelementen in einem Schaltungsmodul Thermal and mechanical protection of discrete components in a circuit module |
| 05/27/2004 | DE10252058A1 Semiconducting arrangement has lines of first or second type running from inner to outer region, lines of the other type running around inner region so as to enclose it, auxiliary area in inner region |
| 05/27/2004 | DE10128269B4 Eine Chipflächen-Justierstruktur A chip surface alignment structure |
| 05/27/2004 | DE10121970B4 Leistungshalbleitermodul in Druckkontaktierung Power semiconductor module in pressure contact |
| 05/27/2004 | CA2800957A1 Semiconductor substrate having copper/diamond composite material and method of making same |
| 05/27/2004 | CA2505593A1 Semiconductor substrate having copper/diamond composite material and method of making same |
| 05/26/2004 | EP1422984A2 Electrically isolated module |
| 05/26/2004 | EP1422982A2 Snap-in heat sink semiconductor mounting |
| 05/26/2004 | EP1422981A2 Packaging and thermal management in electronic apparatus |
| 05/26/2004 | EP1422757A1 Semiconductor radiating substrate and production method therefor and package |
| 05/26/2004 | EP1422756A1 Composite structural material, and method of producing the same |
| 05/26/2004 | EP1422534A1 Vehicle-mounted millimeter wave radar device, millimeter wave radar module, and manufacturing method thereof |
| 05/26/2004 | EP1422266A1 Thermosetting resin composition |
| 05/26/2004 | EP1422251A2 Unsaturated compounds containing silane, electron donor and electron acceptor functionality |