| Patents for H01L 23 - Details of semiconductor or other solid state devices (226,155) |
|---|
| 06/01/2004 | US6744128 Integrated circuit package capable of improving signal quality |
| 06/01/2004 | US6744126 Multichip semiconductor package device |
| 06/01/2004 | US6744125 Super thin/super thermal ball grid array package |
| 06/01/2004 | US6744124 Semiconductor die package including cup-shaped leadframe |
| 06/01/2004 | US6744123 Film carrier tape for mounting electronic devices thereon and method of manufacturing the same |
| 06/01/2004 | US6744122 Semiconductor device, method of manufacture thereof, circuit board, and electronic device |
| 06/01/2004 | US6744121 Multi-chip package |
| 06/01/2004 | US6744120 Flexible interconnect substrate of a tape-shaped semiconductor device, semiconductor device and circuit board |
| 06/01/2004 | US6744119 Leadframe having slots in a die pad |
| 06/01/2004 | US6744118 Frame for semiconductor package |
| 06/01/2004 | US6744114 Package with integrated inductor and/or capacitor |
| 06/01/2004 | US6744112 Multiple chip guard rings for integrated circuit and chip guard ring interconnect |
| 06/01/2004 | US6744107 ESD protection circuit with self-triggered technique |
| 06/01/2004 | US6744100 Semiconductor apparatus with improved ESD withstanding voltage |
| 06/01/2004 | US6744092 Semiconductor memory device capable of preventing oxidation of plug and method for fabricating the same |
| 06/01/2004 | US6744090 Damascene capacitor formed in metal interconnection layer |
| 06/01/2004 | US6744081 Interleaved termination ring |
| 06/01/2004 | US6744072 Substrates having increased thermal conductivity for semiconductor structures |
| 06/01/2004 | US6744067 Wafer-level testing apparatus and method |
| 06/01/2004 | US6744021 Microprocessor controlled heater/cooler system |
| 06/01/2004 | US6743982 Stretchable interconnects using stress gradient films |
| 06/01/2004 | US6743979 Bonding pad isolation |
| 06/01/2004 | US6743975 Low profile non-electrically-conductive component cover for encasing circuit board components to prevent direct contact of a conformal EMI shield |
| 06/01/2004 | US6743972 Heat sink/spreader structures which utilize thermoelectric effects to dissipate thermal energy from electronics (integrated circuits) |
| 06/01/2004 | US6743856 Synthesis of siloxane resins |
| 06/01/2004 | US6743849 Thermoplastic resin composition |
| 06/01/2004 | US6743735 Photoresist removal from alignment marks through wafer edge exposure |
| 06/01/2004 | US6743731 Method for making a radio frequency component and component produced thereby |
| 06/01/2004 | US6743719 Method for forming a conductive copper structure |
| 06/01/2004 | US6743716 Forming insulator layer having substance, forming inhibiting layer on insulator layer, wherein forming inhibiting layer includes depositing second substance on insulator layer, forming a copper metallization layer on the inhibiting layer |
| 06/01/2004 | US6743710 Stacked fill structures for support of dielectric layers |
| 06/01/2004 | US6743707 Bump fabrication process |
| 06/01/2004 | US6743706 Integrated circuit package configuration having an encapsulating body with a flanged portion and an encapsulating mold for molding the encapsulating body |
| 06/01/2004 | US6743699 Method of fabricating semiconductor components |
| 06/01/2004 | US6743696 Apparatus and method for leadless packaging of semiconductor devices |
| 06/01/2004 | US6743694 Method of wafer marking for multi-layer metal processes |
| 06/01/2004 | US6743671 Metal-on-metal capacitor with conductive plate for preventing parasitic capacitance and method of making the same |
| 06/01/2004 | US6743664 Flip-chip on flex for high performance packaging applications |
| 06/01/2004 | US6743661 Method of fabricating an integrated circuit package utilizing an interposer surrounded by a flexible dielectric material with conductive posts |
| 06/01/2004 | US6743660 Method of making a wafer level chip scale package |
| 06/01/2004 | US6743658 Methods of packaging an integrated circuit |
| 06/01/2004 | US6743656 MEMS wafer level package |
| 06/01/2004 | US6743647 Semiconductor memory device manufacturing method |
| 06/01/2004 | US6743646 Balancing planarization of layers and the effect of underlying structure on the metrology signal |
| 06/01/2004 | US6743644 Method of making a metallization line layout |
| 06/01/2004 | US6743643 Stacked memory cell having diffusion barriers |
| 06/01/2004 | US6743534 Multilayer stacks; low temperature firing |
| 06/01/2004 | US6743524 Barrier layer for an article and method of making said barrier layer by expanding thermal plasma |
| 06/01/2004 | US6743499 Metal filling method and member with filled metal sections |
| 06/01/2004 | US6743471 Preparing a porous interlayer insulating film having low dielectric constant containing pores with a size of a few nanometers or less. |
| 06/01/2004 | US6743034 Socket for electrical parts |
| 06/01/2004 | US6742581 Heat sink and fin module |
| 06/01/2004 | US6742575 Boiling and condensing apparatus |
| 06/01/2004 | US6742574 Cooling apparatus |
| 06/01/2004 | US6742573 Heat sink including a heat dissipating fin and method for fixing the heat dissipating fin |
| 06/01/2004 | US6742561 Apparatus for die bonding |
| 06/01/2004 | US6742249 Method of manufacture of ceramic composite wiring structures for semiconductor devices |
| 06/01/2004 | US6742247 Process for manufacturing laminated high layer count printed circuit boards |
| 05/27/2004 | WO2004045262A1 Multi-layer circuit assembly and process for preparing the same |
| 05/27/2004 | WO2004045259A1 Metalization layer on silicone body |
| 05/27/2004 | WO2004045016A2 Method and structures for enhanced temperature control of high power components on multilayer ltcc and ltcc-m boards |
| 05/27/2004 | WO2004044985A2 Folded-flex bondwire-less multichip power package |
| 05/27/2004 | WO2004044984A2 Chip-scale schottky device |
| 05/27/2004 | WO2004044983A1 Semiconductor device and method therefor |
| 05/27/2004 | WO2004044982A1 Packaging structure |
| 05/27/2004 | WO2004044981A1 Semiconductor integrated device and method for manufacturing same |
| 05/27/2004 | WO2004044980A2 Hermetically encapsulated component and waferscale method for the production thereof |
| 05/27/2004 | WO2004044978A1 Reliable low-k interconnect structure with hybrid dielectric |
| 05/27/2004 | WO2004044972A1 Composition for porous film formation, porous films, process for production of the films, interlayer dielectrics, and semiconductor devices |
| 05/27/2004 | WO2004044960A2 Thermal interface composite structure and method of making same |
| 05/27/2004 | WO2004044950A2 Semiconductor substrate having copper/diamond composite material and method of making same |
| 05/27/2004 | WO2004044946A2 Process for forming fusible links |
| 05/27/2004 | WO2004044934A1 Thin film capacitor for reducing power supply noise |
| 05/27/2004 | WO2004044834A1 Data carrier with a module with a reinforcement strip |
| 05/27/2004 | WO2004044074A1 Composition for porous film formation, porous film, process for producing the same, interlayer insulation film and semiconductor device |
| 05/27/2004 | WO2004044073A1 Composition for porous film formation, porous film, process for producing the same, interlayer insulation film and semiconductor device |
| 05/27/2004 | WO2004044072A1 Composition for porous film formation, porous film, process for producing the same, interlayer insulation film and semiconductor device |
| 05/27/2004 | WO2004044053A1 Toughened epoxy/polyanhydride no- flow underfill encapsulant composition |
| 05/27/2004 | WO2004043130A2 Mechanically enhanced package and method of making same |
| 05/27/2004 | WO2004001844A3 Thermal interface materials and methods for their preparation and use |
| 05/27/2004 | WO2003098706A3 Method for fixing a semiconductor chip in a plastic housing body, optoelectronic semiconductor component |
| 05/27/2004 | WO2003092073A3 Electrical contacts for flexible displays |
| 05/27/2004 | WO2003088340A3 Method for the production of structured layers on substrates |
| 05/27/2004 | WO2003063241A8 Method and apparatus for high heat flux heat transfer |
| 05/27/2004 | WO2003049178A3 Semiconductor power device metal structure and method of formation |
| 05/27/2004 | WO2003030214A3 Method of manufacturing an integrated circuit, integrated circuit obtained in accordance with said method, wafer provided with an integrated circuit obtained in accordance with the method, and system comprising an integrated circuit obtained by means of the method |
| 05/27/2004 | WO2003001595A3 Electronic device |
| 05/27/2004 | US20040103385 Method of ITO layout to make IC bear the high-volt electrostatic discharge |
| 05/27/2004 | US20040102915 Failure analysis vehicle |
| 05/27/2004 | US20040102601 Curable resin, curable resin material, curable film, and insulator |
| 05/27/2004 | US20040102597 For conducting heat generated by electronic components or the like |
| 05/27/2004 | US20040102074 Contact for PGA and PGA socket |
| 05/27/2004 | US20040102064 Interconnect for microelectronic structures with enhanced spring characteristics |
| 05/27/2004 | US20040102037 Semiconductor device production method and semiconductor device |
| 05/27/2004 | US20040102035 Semiconductor devices and methods for fabricating the same |
| 05/27/2004 | US20040102034 Semiconductor device, method of generating pattern for semiconductor device, method of manufacturing semiconductor device and device for generating pattern used for semiconductor device |
| 05/27/2004 | US20040102033 Method for forming a ternary diffusion barrier layer |
| 05/27/2004 | US20040102031 Low-K dielectric structure and method |
| 05/27/2004 | US20040102029 Method for solder crack deflection |
| 05/27/2004 | US20040102024 Semiconductor device, method of manufacturing the same, circuit board, and electronic instrument |