| Patents for H01L 23 - Details of semiconductor or other solid state devices (226,155) |
|---|
| 06/03/2004 | US20040103813 catalytic nickel powder is coated palladium; disperse tin coated nickel powder in palladium chloride solution; forming metallic film on substrate with catalytic paste as underlayer; conductor circuits; reduce the cost catalytic metal |
| 06/03/2004 | US20040103530 Manufacturing method for magnetic sensor and lead frame therefor |
| 06/03/2004 | US20040103509 Hollowed out locally; batch processed; made on piezoelectric substrate by interdigitated electrodes; printed circuit comprises external conductive contacts and via holes |
| 06/03/2004 | US20040103504 Fastener for a CPU radiator |
| 06/03/2004 | DE4332115B4 Anordnung zur Kühlung mindestens einen Kühlkörper aufweisenden Leiterplatte Arrangement for cooling at least one heat sink having PCB |
| 06/03/2004 | DE202004005102U1 Heat conducting body e.g. for computer, has heat removal body with visible outer surface applied with thermo-chromic color |
| 06/03/2004 | DE202004001501U1 Fastener for fluid cooler in housing of e.g. computer for cooling processor or components on substrate, has ends or middle part of cooler arranged in or on adaptor system |
| 06/03/2004 | DE202004001499U1 Cooling system for electronics, covers thermal dissipation systems comprising adapters, conductors and internal surfaces of heat sinks, with thermal insulation |
| 06/03/2004 | DE10350343A1 Chip-like electronic device used as varistor comprises element body having zinc oxide material layers and inner electrode layers |
| 06/03/2004 | DE10348902A1 Metal-insulator-metal capacitor for use in dynamic RAM, has damascene wiring layers coupled to bottom of lower electrode which is separated from upper electrode by dielectric layer |
| 06/03/2004 | DE10255098A1 Verfahren zum Herstellen eines Kalibrationswafers A process for producing a calibration wafer |
| 06/03/2004 | DE10254325A1 Elektronisches Speicherbauteil An electronic memory device |
| 06/03/2004 | DE10253855A1 Isolationsschichtmaterial für integrierte Schaltkreise in Damascene-Architektur Insulation layer material for integrated circuits in damascene architecture |
| 06/03/2004 | DE10253626A1 Teststruktur zur Bestimmung der elektrischen Belastbarkeit von Kontakten Test structure for determining the electrical loadability of contacts |
| 06/03/2004 | DE10250889A1 Verbesserte Barrierenschicht für eine Kupfermetallisierungsschicht mit einem Dielektrikum mit kleinem ε Improved barrier layer for receiving a copper with a dielectric with small ε |
| 06/03/2004 | DE10243026B3 Vorrichtung zur lokalen Kühlung oder Erwärmung eines Gegenstandes Apparatus for local heating or cooling of an object |
| 06/03/2004 | DE10143968B4 Verfahren zum Herstellen eines Vakuumbehälters A method of manufacturing a vacuum vessel |
| 06/03/2004 | DE10139166B4 Oberflächenwellenbauelement Surface acoustic wave device |
| 06/03/2004 | CA2506584A1 Thermal switch, methods of use and manufacturing methods for same |
| 06/03/2004 | CA2505619A1 System and method for mounting a heat sink |
| 06/02/2004 | EP1424748A2 Microelectronic contacts and assemblies |
| 06/02/2004 | EP1424731A2 Electronic parts packaging structure and method of manufacturing the same |
| 06/02/2004 | EP1424730A1 Semiconductor device with contact pads and arrangement of such a semiconductor chip on a substrate |
| 06/02/2004 | EP1424729A2 Heatsink and fabrication method thereof |
| 06/02/2004 | EP1424728A1 Power semiconductor module |
| 06/02/2004 | EP1424723A2 Ion beam for target recovery |
| 06/02/2004 | EP1424383A1 Thermally-conductive epoxy resin molded article and method of manufacturing the same |
| 06/02/2004 | EP1423995A2 Sheet material and its use in circuit boards |
| 06/02/2004 | EP1423898A1 An arrangement for esd protection of an integrated circuit |
| 06/02/2004 | EP1423878A2 Integrated circuit device with bump bridges and method for making the same |
| 06/02/2004 | EP1423877A2 Structure and method for fabrication of a leadless chip carrier with embedded inductor |
| 06/02/2004 | EP1423876A1 Semiconductor device and voltage regulator |
| 06/02/2004 | EP1329144B1 Module support for electrical/electronic components |
| 06/02/2004 | CN2619367Y High frequency IC conductor frame |
| 06/02/2004 | CN2619366Y Double layer centrifugal fan heat radiation module |
| 06/02/2004 | CN1502209A Wireless local loop antenna |
| 06/02/2004 | CN1502157A Predetermined symmetrically balanced amalgam with complementary paired portions comprising shielding electrodes and shielded electrodes and other predetermined element portions for symmetrically balan |
| 06/02/2004 | CN1502132A Electromigration test structure for detecting the reliability of wiring |
| 06/02/2004 | CN1502131A Self-passivating Cu laster fuse |
| 06/02/2004 | CN1502130A Electronic device using evaporative micro-cooling and associated methods |
| 06/02/2004 | CN1502129A Electronic part with a lead frame |
| 06/02/2004 | CN1502126A Structure and method for determining edges of regions in a semiconductor wafer |
| 06/02/2004 | CN1502125A Package of semiconductor device and its manufacturing method |
| 06/02/2004 | CN1501765A Plane mounting circuit module |
| 06/02/2004 | CN1501757A Electrostatic protection circuit using grid coupling metal-oxide half field effect transistor |
| 06/02/2004 | CN1501697A Cloche for solid camera element |
| 06/02/2004 | CN1501696A Image pickup device and portable terminal equipped therewith |
| 06/02/2004 | CN1501500A Semiconductor devices |
| 06/02/2004 | CN1501496A Semiconductor integrated circuit capable of facilitating layout modification |
| 06/02/2004 | CN1501495A Tin indium oxide wiring method for electrostatic discharging of integrated circuit bearable high-voltage |
| 06/02/2004 | CN1501494A Electrostatic discharge protecting component and method for manufacturing the same |
| 06/02/2004 | CN1501492A Integrated circuit structure with air gap and manufacturing method thereof |
| 06/02/2004 | CN1501491A Polysilicon self-aligning contact plug and polysilicon sharing source electrode wire and method for making the same |
| 06/02/2004 | CN1501490A 电路装置及其制造方法 Circuit device and manufacturing method thereof |
| 06/02/2004 | CN1501489A Semiconductor packaging element with wire-holder as chip carrier and making method thereof |
| 06/02/2004 | CN1501488A Windowing ball grid array semiconductor packaging element with wire-holder as carrier and making method thereof |
| 06/02/2004 | CN1501487A Semiconductor device and method of fabricating same |
| 06/02/2004 | CN1501486A Leadframe for semiconductor device, method for manufacturing semiconductor device using the same, semiconductor device using the same, and electronic equipment |
| 06/02/2004 | CN1501485A 电子器件 Electronic devices |
| 06/02/2004 | CN1501484A Power semiconductor device |
| 06/02/2004 | CN1501483A A thermal interfacial material and method for manufacturing same |
| 06/02/2004 | CN1501482A Small setting of photovoltaic assembly |
| 06/02/2004 | CN1501481A Printed circuit board, semiconductor package, base insulating film, and manufacturing method for interconnect substrate |
| 06/02/2004 | CN1501474A Interconnections including multi-layer metal film stack for improving corrosion and heat resistances |
| 06/02/2004 | CN1501473A Self-timed and self-tested fuse blow |
| 06/02/2004 | CN1501472A Semiconductor apparatus and method of fabricating the same |
| 06/02/2004 | CN1501471A Interconnection structure and method for forming the same |
| 06/02/2004 | CN1501462A Method of fabricating semiconductor device |
| 06/02/2004 | CN1501455A Method of fabricating semiconductor device |
| 06/02/2004 | CN1501454A Composition for forming porous film, porous film and method for forming the same, interlevel insulator film, and semiconductor device |
| 06/02/2004 | CN1501388A Head retracting method/apparatus, and head actuator control circuit |
| 06/02/2004 | CN1501242A Semiconductor integrated circuit, method of manufacturing semiconductor integrated circuit, charge pump circuit, layout designing apparatus, and layout designing program |
| 06/02/2004 | CN1501213A Semiconductor integrated circuit device and method for designing the same |
| 06/02/2004 | CN1501153A Thin film transistor array panel and producing method thereof |
| 06/02/2004 | CN1152436C Insulator base silicon field effect resistor and forming technology thereof and insulator base silicon network |
| 06/02/2004 | CN1152430C Manufacture of wire holder in double electroplating mold |
| 06/02/2004 | CN1152429C Packaged video sensing chip and packaging method |
| 06/02/2004 | CN1152428C Solderable transistor clip and combined device of clip and heat radiator |
| 06/02/2004 | CN1152427C Packaged IC substrate and making method |
| 06/02/2004 | CN1152418C Inactivation method of gallium arsenide chip for plastic packaging |
| 06/01/2004 | US6745378 Wiring designing method |
| 06/01/2004 | US6744660 High voltage switch circuitry |
| 06/01/2004 | US6744640 Board-level EMI shield with enhanced thermal dissipation |
| 06/01/2004 | US6744630 Variable length and directional cooling duct |
| 06/01/2004 | US6744273 Semiconductor device capable of reducing noise to signal line |
| 06/01/2004 | US6744144 Method and apparatus for marking microelectronic dies and microelectronic devices |
| 06/01/2004 | US6744143 Semiconductor device having test mark |
| 06/01/2004 | US6744142 Flip chip interconnection structure and process of making the same |
| 06/01/2004 | US6744141 Stacked chip-size package type semiconductor device capable of being decreased in size |
| 06/01/2004 | US6744140 Semiconductor chip and method of producing the same |
| 06/01/2004 | US6744139 Semiconductor device |
| 06/01/2004 | US6744138 RuSixOy-containing barrier layers for high-k dielectrics |
| 06/01/2004 | US6744137 Bumped die and wire bonded board-on-chip package |
| 06/01/2004 | US6744136 Sealed liquid cooled electronic device |
| 06/01/2004 | US6744135 Electronic apparatus |
| 06/01/2004 | US6744134 Use of a reference fiducial on a semiconductor package to monitor and control a singulation method |
| 06/01/2004 | US6744133 Adhesive film for semiconductor, lead frame and semiconductor device using the same |
| 06/01/2004 | US6744132 Module with adhesively attached heat sink |
| 06/01/2004 | US6744131 Flip chip integrated circuit packages accommodating exposed chip capacitors while providing structural rigidity |
| 06/01/2004 | US6744130 Isolated stripline structure |