| Patents for H01L 23 - Details of semiconductor or other solid state devices (226,155) |
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| 06/03/2004 | WO2004047133A2 Thermal switch, methods of use and manufacturing methods for same |
| 06/03/2004 | WO2004036645A3 Conformal heat spreader |
| 06/03/2004 | WO2004030030A3 Taped lead frames and methods of making and using the same in semiconductor packaging |
| 06/03/2004 | WO2004027824A3 Nitride and polysilicon interface with titanium layer |
| 06/03/2004 | WO2004021398A3 Wafer-level seal for non-silicon-based devices |
| 06/03/2004 | WO2004010467A3 Low temperature dielectric deposition using aminosilane and ozone |
| 06/03/2004 | WO2003105213A3 Method of manufacturing an electronic device |
| 06/03/2004 | WO2003105187A3 Optimization methods for on-chip interconnect geometries suitable for ultra deep sub-micron processes |
| 06/03/2004 | WO2003103020A3 Layered components, materials, methods of production and uses thereof |
| 06/03/2004 | WO2003096416A3 Reactive solder material |
| 06/03/2004 | WO2003073474A3 Modular semiconductor die package and method of manufacturing thereof |
| 06/03/2004 | WO2003063205A3 Poly(organosiloxane) materials and methods for hybrid organic-inorganic dielectrics for integrated circuit applications |
| 06/03/2004 | WO2003034486B1 Thin metal package and manufacturing method thereof |
| 06/03/2004 | WO2002092897A9 Thermal management material, devices and methods therefor |
| 06/03/2004 | US20040107411 Adaptive power routing and shield sharing to reduce shield count |
| 06/03/2004 | US20040106860 Analyte monitoring device and methods of use |
| 06/03/2004 | US20040106859 Analyte monitoring device and methods of use |
| 06/03/2004 | US20040106858 Analyte monitoring device and methods of use |
| 06/03/2004 | US20040106770 Anhydride polymers for use as curing agents in epoxy resin-based underfill material |
| 06/03/2004 | US20040106335 Semiconductor device and method of manufacturing the same |
| 06/03/2004 | US20040106307 Socket for electrical parts |
| 06/03/2004 | US20040106297 Etching method, semiconductor and fabricating method for the same |
| 06/03/2004 | US20040106294 Side-bonding method of flip-chip semiconductor device, MEMS device package and package method using the same |
| 06/03/2004 | US20040106291 Thermally enhanced wafer-level chip scale package and method of fabricating the same |
| 06/03/2004 | US20040106288 Method for manufacturing circuit devices |
| 06/03/2004 | US20040106276 Method and structure for reducing contact aspect ratios |
| 06/03/2004 | US20040106273 Interconnect structure and method for manufacturing the same |
| 06/03/2004 | US20040106255 Manufacturing method of flash memory device |
| 06/03/2004 | US20040106254 Semiconductor device and its manufacturing method |
| 06/03/2004 | US20040106250 Method of fabricating semiconductor integrated circuit device |
| 06/03/2004 | US20040106247 Method for forming semiconductor device |
| 06/03/2004 | US20040106238 [pixel structure and fabricating method thereof] |
| 06/03/2004 | US20040106235 Method for manufacturing circuit devices |
| 06/03/2004 | US20040106234 Electrical leadframes, surface mountable semiconductor components, leadframe strips, and their method of manufacture |
| 06/03/2004 | US20040106231 Compact electronic device and process of manufacturing the same |
| 06/03/2004 | US20040106229 Methods for assembling multiple semiconductor devices |
| 06/03/2004 | US20040106228 Substrate based ESD network protection method for flip chip design |
| 06/03/2004 | US20040106223 Optical component and manufacturing method thereof, microlens substrate and manufacturing method thereof, display device, and imaging device |
| 06/03/2004 | US20040106001 electroconductive metal layer for electromagnetic interference (emi) shielding on surfaces of an interconnect frame, titanium layer for absorbing and chemically binding hydrogen and palladium to prevent titanium from oxidizing |
| 06/03/2004 | US20040105986 excels in dielectric properties, adhesion, film consistency, mechanical strength, easily thinned; made from an amorphous polymer made by hydrolyzing and condensing an silane compoundl, and and a zeolite sol made with a quaternary ammonium hydroxide |
| 06/03/2004 | US20040105968 Interconnect structure and method for manufacturing the same |
| 06/03/2004 | US20040105244 Lead assemblies with offset portions and microelectronic assemblies with leads having offset portions |
| 06/03/2004 | US20040105242 Stackable module |
| 06/03/2004 | US20040105241 Stiffener design |
| 06/03/2004 | US20040105237 CVD diamond enhanced microprocessor cooling system |
| 06/03/2004 | US20040105236 Heat sink assembly with retention module and clip |
| 06/03/2004 | US20040105234 Cooling device with multiple compliant elements |
| 06/03/2004 | US20040105223 Method of manufacturing electronic part and electronic part obtained by the method |
| 06/03/2004 | US20040105207 Via programmable gate array interconnect architecture |
| 06/03/2004 | US20040105202 Electrostatic discharge protection device and method using depletion switch |
| 06/03/2004 | US20040104846 Method of machining glass substrate and method of fabricating high-frequency circuit |
| 06/03/2004 | US20040104791 Acoustic wave device and method of producing the same |
| 06/03/2004 | US20040104754 Radiation protection in integrated circuits |
| 06/03/2004 | US20040104643 Piezoelectric device and cover sealing method and apparatus therefor, cellular phone apparatus using piezoelectric device and electronic apparatus using piezoelectric device |
| 06/03/2004 | US20040104490 Semiconductor device and a method of manufacturing the same |
| 06/03/2004 | US20040104489 Direct fet device for high frequency application |
| 06/03/2004 | US20040104488 Optical component package and packaging method thereof |
| 06/03/2004 | US20040104487 Semiconductor device, wiring board and method of making same |
| 06/03/2004 | US20040104485 Semiconductor device having interconnection layer with multiply layered sidewall insulation film |
| 06/03/2004 | US20040104484 between bonding pad of a chip and solder bump (flip chip) for reducing the growth rate of nickel/tin/vanadium intermetallic |
| 06/03/2004 | US20040104482 Semiconductor integrated circuit device having multilevel interconnection |
| 06/03/2004 | US20040104481 Method for recrystallizing metal in features of a semiconductor chip |
| 06/03/2004 | US20040104480 Method of producing an ultra thin electrically conducting film with very low electrical resistance |
| 06/03/2004 | US20040104478 Semiconductor device |
| 06/03/2004 | US20040104476 Method of manufacturing semiconductor chip having supporting member and semiconductor package having the semiconductor chip |
| 06/03/2004 | US20040104474 Semiconductor package and package stack made thereof |
| 06/03/2004 | US20040104473 Semiconductor component having conductors with wire bondable metalization layers |
| 06/03/2004 | US20040104470 Microelectronic packages with self-aligning features |
| 06/03/2004 | US20040104468 Semiconductor integrated circuit device and semiconductor integrated circuit chip thereof |
| 06/03/2004 | US20040104467 Thermal design for minimizing interface in a multi-site thermal contact condition |
| 06/03/2004 | US20040104465 Wiring board and a packaging assembly using the same |
| 06/03/2004 | US20040104464 Plating tail design for IC packages |
| 06/03/2004 | US20040104463 Crack resistant interconnect module |
| 06/03/2004 | US20040104462 Semiconductor package |
| 06/03/2004 | US20040104460 Wafer-level hermetic micro-device packages |
| 06/03/2004 | US20040104459 Electronic device with external contact elements and method for producing a plurality of the devices |
| 06/03/2004 | US20040104458 Sealing resin having recess, so that part of surface of semiconductor element is exposed; releasable protective device with shape corresponding to recess |
| 06/03/2004 | US20040104457 Integrated circuit chip is coupled to face of die pad through adhesive layer and to plurality of interior leads through second adhesive layer; wires linkthe interior and exterior connectors |
| 06/03/2004 | US20040104456 Semiconductor package includes inter-digitated input and output bond wires configured to increase negative mutual inductive coupling; microelectronics |
| 06/03/2004 | US20040104455 Semiconductor device |
| 06/03/2004 | US20040104454 Semiconductor device and method of producing the same |
| 06/03/2004 | US20040104452 Semiconductor device with improved radiation property |
| 06/03/2004 | US20040104451 Capacitor and manufacturing method thereof, semiconductor device and substrate for a semiconductor device |
| 06/03/2004 | US20040104449 Filling spaces with metallic layer; removing three-dimensional sacrificial mold; radio and optical telecommunications |
| 06/03/2004 | US20040104446 Semiconductor module and power conversion device |
| 06/03/2004 | US20040104436 Diode coupled for providing bias signal; cathode coupled to pad and anode to substrate; transistor with drain terminal; electrostatic discharges; metal oxide field semiconductor field effect transistors |
| 06/03/2004 | US20040104408 Stackable ceramic FBGA for high thermal applications |
| 06/03/2004 | US20040104361 Semiconductor wafer edge marking |
| 06/03/2004 | US20040104261 Method and apparatus for improving an integrated circuit device |
| 06/03/2004 | US20040104202 Laser scanning method and system for marking articles such as printed circuit boards, integrated circuits and the like |
| 06/03/2004 | US20040104200 Methods for finishing microelectronic device packages |
| 06/03/2004 | US20040104113 External electrode connector |
| 06/03/2004 | US20040104044 [printed circuit board design] |
| 06/03/2004 | US20040104043 Compactness, low profile, and light-weight properties |
| 06/03/2004 | US20040104022 Method and apparatus for flexible fluid delivery for cooling desired hot spots in a heat producing device |
| 06/03/2004 | US20040104014 Diamond heat spreading and cooling technique for integrated circuits |
| 06/03/2004 | US20040104013 Engaging structure for heat sink |
| 06/03/2004 | US20040104012 Vapor escape microchannel heat exchanger |
| 06/03/2004 | US20040104010 Interwoven manifolds for pressure drop reduction in microchannel heat exchangers |
| 06/03/2004 | US20040103919 Single wafer cleaning with ozone |