| Patents for H01L 23 - Details of semiconductor or other solid state devices (226,155) |
|---|
| 06/09/2004 | CN1503344A Method for forming aluminium lead wire |
| 06/09/2004 | CN1503341A Method for checking distribution of semiconductor |
| 06/09/2004 | CN1503339A Method of resin encapsulation, apparatus for resin encapsulation, method of manufacturing semiconductor device and resin material |
| 06/09/2004 | CN1503337A Semiconductor device production method and semiconductor device |
| 06/09/2004 | CN1503330A Method for manufacturing semiconductor device and multi-layer wiring structure formed by the same |
| 06/09/2004 | CN1503278A Chip shape electronic component and mfg method thereof |
| 06/09/2004 | CN1503256A Voice encoding device and voice decoding device, optical recording medium and voice transmission method |
| 06/09/2004 | CN1502669A Decreasing thermal contact resistance at a material interface |
| 06/09/2004 | CN1153292C Capacitor and its manufacture process |
| 06/09/2004 | CN1153291C Electrostatic protector of integrated circuit |
| 06/09/2004 | CN1153290C Arrangement method with uniformly distributed current for preventing electrostatic discharge |
| 06/09/2004 | CN1153289C Static discharge protective circuit of low leakage current |
| 06/09/2004 | CN1153288C Interconnection mechanism for semiconductor packages |
| 06/09/2004 | CN1153287C Semiconductor package with built-in heat dissipating block |
| 06/09/2004 | CN1153286C Heat radiator with special strcuture and semiconductor device with it |
| 06/09/2004 | CN1153285C Semiconductor package with heat dissipating structure |
| 06/09/2004 | CN1153284C Substrate provided with spherical grate array type circuit portion, and installation method therefor |
| 06/09/2004 | CN1153268C Base board lay-out method and structure to reduce cross-talk of adjacent signals |
| 06/09/2004 | CN1153267C Semiconductor device and process for producing the same |
| 06/09/2004 | CN1153174C 芯片模块 Chip Module |
| 06/08/2004 | US6748576 Active trace rerouting |
| 06/08/2004 | US6748350 Method to compensate for stress between heat spreader and thermal interface material |
| 06/08/2004 | US6747873 Channeled heat dissipation device and a method of fabrication |
| 06/08/2004 | US6747870 Electromagnetic interference reduction air duct |
| 06/08/2004 | US6747865 Heat sink for electronic components |
| 06/08/2004 | US6747861 Electrostatic discharge protection for a mixed-voltage device using a stacked-transistor-triggered silicon controlled rectifier |
| 06/08/2004 | US6747820 Cooling opto-electronic packages |
| 06/08/2004 | US6747509 Semiconductor integrated circuit |
| 06/08/2004 | US6747501 Dual-triggered electrostatic discharge protection circuit |
| 06/08/2004 | US6747445 Stress migration test structure and method therefor |
| 06/08/2004 | US6747362 Perimeter matrix ball grid array circuit package with a populated center |
| 06/08/2004 | US6747361 Semiconductor device and packaging method thereof |
| 06/08/2004 | US6747360 Conductive hardening resin for a semiconductor device and semiconductor device using the same |
| 06/08/2004 | US6747358 Self-aligned alloy capping layers for copper interconnect structures |
| 06/08/2004 | US6747356 Multilayer circuit board; reducing the variation in the characteristic impedance of the wirings with high accuracy. |
| 06/08/2004 | US6747355 Semiconductor device and method for manufacturing the same |
| 06/08/2004 | US6747354 Semiconductor devices having multilevel interconnections and methods for manufacturing the same |
| 06/08/2004 | US6747353 Barrier layer for copper metallization in integrated circuit fabrication |
| 06/08/2004 | US6747352 Integrated circuit having multiple power/ground connections to a single external terminal |
| 06/08/2004 | US6747351 Semiconductor device and method of manufacturing of the same |
| 06/08/2004 | US6747350 Flip chip package structure |
| 06/08/2004 | US6747349 Termination ring for integrated circuit |
| 06/08/2004 | US6747348 Apparatus and method for leadless packaging of semiconductor devices |
| 06/08/2004 | US6747347 Multi-chip electronic package and cooling system |
| 06/08/2004 | US6747346 Container for semiconductor sensor, manufacturing method therefor, and semiconductor sensor device |
| 06/08/2004 | US6747345 Exposed die molding apparatus |
| 06/08/2004 | US6747344 Lead frame assemblies with voltage reference plane and IC packages including same |
| 06/08/2004 | US6747343 Aluminum leadframes with two nickel layers |
| 06/08/2004 | US6747342 Power enhancement mode junction field effect transistor (jfet) die;semiconductor die mounted between an x-lead frame and a support structure without bonding wires or straps |
| 06/08/2004 | US6747341 Integrated circuit and laminated leadframe package |
| 06/08/2004 | US6747340 Multi-level shielded multi-conductor interconnect bus for MEMS |
| 06/08/2004 | US6747339 Integrated circuit having reduced soft errors and reduced penetration of alkali impurities into the substrate |
| 06/08/2004 | US6747337 Semiconductor wafer with a dicing line overlapping a defect |
| 06/08/2004 | US6747331 Method and packaging structure for optimizing warpage of flip chip organic packages |
| 06/08/2004 | US6747325 LDD structure of thin film transistor and process for producing same |
| 06/08/2004 | US6747307 Combined transistor-capacitor structure in deep sub-micron CMOS for power amplifiers |
| 06/08/2004 | US6747304 Method for forming a bit line for a semiconductor device |
| 06/08/2004 | US6747303 Charge detector semiconductor component, system comprising a charge detector semiconductor component and a reference semiconductor component, wafer, use of a wafer, and method for the qualitative and quantitative measurement of charging of a wafer |
| 06/08/2004 | US6747299 Monolithic microwave integrated circuit in which a waveguide for high frequency signals is used |
| 06/08/2004 | US6747293 Light emitting device |
| 06/08/2004 | US6747292 Multi-layer structure for reducing capacitance and manufacturing method thereof |
| 06/08/2004 | US6747261 Image sensor having shortened wires |
| 06/08/2004 | US6747215 Fat conductor |
| 06/08/2004 | US6746966 Method to solve alignment mark blinded issues and a technology for application of semiconductor etching at a tiny area |
| 06/08/2004 | US6746963 Method for processing coating film and method for manufacturing semiconductor element with use of the same method |
| 06/08/2004 | US6746962 Method for fabricating a semi-conductor device having a tungsten film-filled via hole |
| 06/08/2004 | US6746957 Manufacture of semiconductor device with copper wiring |
| 06/08/2004 | US6746955 Method of manufacturing a semiconductor device including a heat treatment procedure |
| 06/08/2004 | US6746953 Method of forming backside bus vias |
| 06/08/2004 | US6746952 Borane doped titanium nitride |
| 06/08/2004 | US6746951 Bond pad of semiconductor device and method of fabricating the same |
| 06/08/2004 | US6746949 A stronger mechanical connection between a semiconductor device and the device package by adding one or more bumps to the gate connection without adding more gate pad area; added bumps are not electrically connected to either the |
| 06/08/2004 | US6746947 Post-fuse blow corrosion prevention structure for copper fuses |
| 06/08/2004 | US6746938 Manufacturing method for semiconductor device using photo sensitive polyimide etching mask to form viaholes |
| 06/08/2004 | US6746912 MIM capacitor and manufacturing method therefor |
| 06/08/2004 | US6746899 Tape stiffener, semiconductor device component assemblies including same, and stereolithographic methods for fabricating same |
| 06/08/2004 | US6746898 Integrated chip package structure using silicon substrate and method of manufacturing the same |
| 06/08/2004 | US6746897 Fabrication process of semiconductor package and semiconductor package |
| 06/08/2004 | US6746895 Method for encapsulating a multi-chip substrate array |
| 06/08/2004 | US6746894 Ball grid array interposer, packages and methods |
| 06/08/2004 | US6746891 Trilayered beam MEMS device and related methods |
| 06/08/2004 | US6746770 Visual display apparatus including light transmitting substrate transparent to predetermined optical wavelengths, having surface layer comprising mixture of abrasion resistant material and electrically conductive polymeric composition |
| 06/08/2004 | US6746768 Thermal interface material |
| 06/08/2004 | US6746270 Spring-loaded heat sink assembly for a circuit assembly |
| 06/08/2004 | US6745930 Method of attaching a body made of metal matrix composite (MMC) material or copper to a ceramic member |
| 06/08/2004 | US6745825 Plate type heat pipe |
| 06/08/2004 | US6745824 Heat dissipation device |
| 06/08/2004 | US6745823 Heat exchanger for electronic/electrical components |
| 06/08/2004 | CA2291540C Device for compensating process and operating parameter variations in cmos integrated circuits |
| 06/03/2004 | WO2004047177A1 Semiconductor integrated device and method for manufacturing same |
| 06/03/2004 | WO2004047174A1 Semiconductor integrated circuit device having high q inductance |
| 06/03/2004 | WO2004047173A1 Semiconductor package and laminated semiconductor package |
| 06/03/2004 | WO2004047172A1 Electronic memory component with protection against light attack |
| 06/03/2004 | WO2004047171A1 Forming a cap above a metal layer |
| 06/03/2004 | WO2004047170A1 System and method for mounting a heat sink |
| 06/03/2004 | WO2004047169A1 High frequency signal transmission structure |
| 06/03/2004 | WO2004047168A1 Electronic device |
| 06/03/2004 | WO2004047167A1 Semiconductor device, wiring substrate, and method for manufacturing wiring substrate |
| 06/03/2004 | WO2004047163A1 Semiconductor device |
| 06/03/2004 | WO2004047148A2 Method for producing and testing a corrosion-resistant channel in a silicon device |