| Patents for H01L 23 - Details of semiconductor or other solid state devices (226,155) |
|---|
| 06/10/2004 | US20040110010 Reworkable b-stageable adhesive and use in waferlevel underfill |
| 06/10/2004 | US20040109301 Cooling device for an integrated circuit |
| 06/10/2004 | US20040109292 Reversible heat sink packaging assembly for an integrated circuit |
| 06/10/2004 | US20040109291 System and method for information handling system heat sink retention |
| 06/10/2004 | US20040109290 High-power multi-device liquid cooling |
| 06/10/2004 | US20040109289 Combination structure of heat sink and cooling fan |
| 06/10/2004 | US20040109283 Integrated circuit chip package with formable intermediate 3D wiring structure |
| 06/10/2004 | US20040109281 Semiconductor device having relief circuit for relieving defective portion |
| 06/10/2004 | US20040109165 Automated overlay metrology system |
| 06/10/2004 | US20040109128 Semiconductor device, electro-optical device substrate, liquid crystal device substrate and manufacturing method therefor, liquid crystal device, and projection liquid crystal display device and electronic apparatus using the liquid crystal device |
| 06/10/2004 | US20040108935 On-chip differential multi-layer inductor |
| 06/10/2004 | US20040108922 Microwave monolithic integrated circuit (mmic) carrier interface |
| 06/10/2004 | US20040108811 active component covered with a alkaline earth metal getter layer to seal and absorb surrounding moisture and gases |
| 06/10/2004 | US20040108602 Resin-sealed semiconductor device |
| 06/10/2004 | US20040108601 Mold cap anchoring method for molded flex BGA packages |
| 06/10/2004 | US20040108600 Method and apparatus for flip chip device assembly by radiant heating |
| 06/10/2004 | US20040108596 Selectable decoupling capacitors for integrated circuit and methods of use |
| 06/10/2004 | US20040108595 forming conductive bodies on a die with bonding pads, forming a protective layer and an encapsulant and forming conductive bumps |
| 06/10/2004 | US20040108594 Semiconductor device |
| 06/10/2004 | US20040108592 Slot design for metal interconnects |
| 06/10/2004 | US20040108591 Enhanced connectivity for electronic substrates, modules and systems using a novel edge flower terminal array |
| 06/10/2004 | US20040108589 Power semiconductor module |
| 06/10/2004 | US20040108588 Package for microchips |
| 06/10/2004 | US20040108587 High density chip carrier with integrated passive devices |
| 06/10/2004 | US20040108586 Structure and method of high performance two layer ball grid array substrate |
| 06/10/2004 | US20040108585 Electronic component having stacked semiconductor chips in parallel, and a method for producing the component |
| 06/10/2004 | US20040108580 Leadless semiconductor packaging structure with inverted flip chip and methods of manufacture |
| 06/10/2004 | US20040108579 Multilayer semiconductor chips; stress relieving interface |
| 06/10/2004 | US20040108578 Leadframe and method for manufacturing the same |
| 06/10/2004 | US20040108577 Semiconductor integrated circuit device and method for fabricating the same |
| 06/10/2004 | US20040108573 Use in semiconductor devices of dielectric antifuses grown on silicide |
| 06/10/2004 | US20040108572 Fuse arrangement and integrated circuit device using the same |
| 06/10/2004 | US20040108560 Multilayer; substrate, connected electrode pads |
| 06/10/2004 | US20040108556 Semiconductor device |
| 06/10/2004 | US20040108555 Dual work function semiconductor structure with borderless contact and method of fabricating the same |
| 06/10/2004 | US20040108552 Semiconductor device with SOI region and bulk region and method of manufacture thereof |
| 06/10/2004 | US20040108539 Semiconductor device having one-time programmable ROM and method of fabricating the same |
| 06/10/2004 | US20040108486 Various strength of anisotropic magnetic fields; soft magentic powder in binder |
| 06/10/2004 | US20040108367 Structure and method for lead free solder electronic package interconnections |
| 06/10/2004 | US20040108364 Multi-chip sack and method of fabrication utilizing self-aligning electrical contact array |
| 06/10/2004 | US20040108362 Method of thermosonic wire bonding process for copper connection in a chip |
| 06/10/2004 | US20040108136 Structure comprising a barrier layer of a tungsten alloy comprising cobalt and/or nickel |
| 06/10/2004 | US20040108135 Circuit board, mounting structure of ball grid array, electro-optic device and electronic device |
| 06/10/2004 | US20040108133 Electrolytic cell; contacting electrode with projections; mixture of electroconductive filler and polymer |
| 06/10/2004 | US20040108104 Axial heat-dissipating device |
| 06/10/2004 | US20040108102 Heat sink fan |
| 06/10/2004 | US20040108101 Inside-out heat sink |
| 06/10/2004 | US20040108100 Heat dissipator |
| 06/10/2004 | US20040107718 Method, system and apparatus for cooling high power density devices |
| 06/10/2004 | US20040107570 Singulation methods and substrates for use with same |
| 06/10/2004 | US20040107569 Metal core substrate packaging |
| 06/10/2004 | CA2506367A1 Copper flake powder, method for producing copper flake powder, and conductive paste using copper flake powder |
| 06/09/2004 | EP1427032A2 Method of producing a piezoelectric part and piezoelectric part |
| 06/09/2004 | EP1427022A2 Method for making a metal-insulator-metal (mim) capacitor and metal resistor for a copper back-end-of-line (beol) technology |
| 06/09/2004 | EP1427016A2 Semiconductor device and circuit board mounted with the same |
| 06/09/2004 | EP1427015A2 Semiconductor integrated circuit device and method for fabricating the same |
| 06/09/2004 | EP1427014A2 Integrated circuit identification |
| 06/09/2004 | EP1427013A2 Control device, particularly for use in automotive engineering |
| 06/09/2004 | EP1427012A2 Methods for forming single Damascene via or trench cavities and for forming dual Damascene via cavities |
| 06/09/2004 | EP1427007A2 Electrodes for semiconductor device and method for manufacturing the same |
| 06/09/2004 | EP1427006A1 Electronic parts packaging structure and method of manufacturing the same |
| 06/09/2004 | EP1426983A1 Multi-track integrated spiral inductor |
| 06/09/2004 | EP1426394A1 Resin composition for optical-semiconductor encapsulation |
| 06/09/2004 | EP1425946A1 An electronic assembly and a method of constructing an electronic assembly |
| 06/09/2004 | EP1425800A2 Image sensor with recessed planarizing layers and method for making same |
| 06/09/2004 | EP1425799A1 Pressure-contactable power semiconductor module |
| 06/09/2004 | EP1425798A2 Microelectronic system with integral cyrocooler, and its fabrication and use |
| 06/09/2004 | EP1425797A2 Electronic assemblies with high capacity heat sinks and methods of manufacture |
| 06/09/2004 | EP1425794A1 Integrated circuit comprising dram memory cells and the production method therefor |
| 06/09/2004 | EP1425793A2 Process for making a mim capacitor |
| 06/09/2004 | EP1425792A2 Intermediate support for electronic components and method for solder contacting such an intermediate support |
| 06/09/2004 | EP1425781A1 Silicone resins and porous materials produced therefrom |
| 06/09/2004 | EP1425765A1 Magnetic component |
| 06/09/2004 | EP1425435A2 Metal nitride deposition by ald using gettering reactant |
| 06/09/2004 | EP1425364A2 Dry thermal interface material |
| 06/09/2004 | EP1425241A2 Method for the production of a membrane |
| 06/09/2004 | EP1425109A1 Electro-optical component including a fluorinated poly (phenylene ether ketone) protective coating and related methods |
| 06/09/2004 | EP1015836B1 Heat sink including pedestal |
| 06/09/2004 | DE10343300A1 Semiconductor component such as a sensor housing has semiconductor section in a recess in a substrate connected to the upper face of a circuit board |
| 06/09/2004 | DE10337256A1 Integrated circuit and production process especially for chip cards has active circuit on substrate surface and deep doped layer to protect against rear interrogation |
| 06/09/2004 | DE10331335A1 Leistungs-Halbleitervorrichtung Power semiconductor device |
| 06/09/2004 | DE10254648A1 Semiconductor chip carrier structure has venting structure allowing escape of air from bonding channel during encapsulation |
| 06/09/2004 | CN2620454Y Base plate for sealing, display device and electronic apparatus |
| 06/09/2004 | CN1504068A Inteconnect |
| 06/09/2004 | CN1503989A Heat sink |
| 06/09/2004 | CN1503988A Bumpless semiconductor device |
| 06/09/2004 | CN1503729A Wet etchable laminated body insulation film, and electronic circuit part using the laminated body and the film |
| 06/09/2004 | CN1503616A Multilayer ceramic substrate and mfg method thereof |
| 06/09/2004 | CN1503414A Electric device and method for making same |
| 06/09/2004 | CN1503370A Image sensor with concave microlens |
| 06/09/2004 | CN1503369A Miniaturization packaged video image taking chip module |
| 06/09/2004 | CN1503361A Electrostatic discharge protective element for high voltage input pad |
| 06/09/2004 | CN1503360A Electrostatic discharge protector adapted for overhigh or overlow input voltage threshold |
| 06/09/2004 | CN1503359A Electronic parts packaging structure and method of manufacturing the same |
| 06/09/2004 | CN1503358A Resin-sealed-type semiconductor device, and production process for producing such semiconductor device |
| 06/09/2004 | CN1503357A Colling mechanism for electronic equipment |
| 06/09/2004 | CN1503356A Central type flow guiding heat radiation device |
| 06/09/2004 | CN1503355A Multi-layer ceramic package device and mfg method thereof |
| 06/09/2004 | CN1503354A Ceramic multi-layer substrate and mfg method thereof |
| 06/09/2004 | CN1503353A Circuit board capable of preventing heat deformation and mfg method thereof |