| Patents for H01L 23 - Details of semiconductor or other solid state devices (226,155) |
|---|
| 06/15/2004 | US6750753 Fuse structure window |
| 06/15/2004 | US6750751 Integrated magnetic signal isolator with feedback |
| 06/15/2004 | US6750607 Display device |
| 06/15/2004 | US6750554 Mark configuration, wafer with at least one mark configuration and method for the fabrication of at least one mark configuration |
| 06/15/2004 | US6750553 Semiconductor device which minimizes package-shift effects in integrated circuits by using a thick metallic overcoat |
| 06/15/2004 | US6750552 Integrated circuit package with solder bumps |
| 06/15/2004 | US6750549 Variable pad diameter on the land side for improving the co-planarity of ball grid array packages |
| 06/15/2004 | US6750548 Mask repattern process |
| 06/15/2004 | US6750547 Package comprising first microelectronic substrate coupled to second microelectronic substrate to form assembly, and conformal conductive link coupled between first and second connection sites and conforming to contour of assembly |
| 06/15/2004 | US6750546 Flip-chip leadframe package |
| 06/15/2004 | US6750545 Semiconductor package capable of die stacking |
| 06/15/2004 | US6750544 Metallization system for use in a semiconductor component |
| 06/15/2004 | US6750543 Semiconductor device with fully self-aligned local interconnects, and method for fabricating the device |
| 06/15/2004 | US6750541 Semiconductor device |
| 06/15/2004 | US6750539 Joining semiconductor units with bonding material |
| 06/15/2004 | US6750538 Heat transfer of solid-state devices |
| 06/15/2004 | US6750536 Current supply and support system for a thin package |
| 06/15/2004 | US6750535 Package for enclosing a laser diode module |
| 06/15/2004 | US6750534 Heat spreader hole pin 1 identifier |
| 06/15/2004 | US6750533 Substrate with dam bar structure for smooth flow of encapsulating resin |
| 06/15/2004 | US6750531 Semiconductor device having polycrystalline silicon film resistor and manufacturing method therefor |
| 06/15/2004 | US6750530 Semiconductor antifuse with heating element |
| 06/15/2004 | US6750529 Semiconductor devices including fuses and multiple insulation layers |
| 06/15/2004 | US6750517 Device layout to improve ESD robustness in deep submicron CMOS technology |
| 06/15/2004 | US6750516 Systems and methods for electrically isolating portions of wafers |
| 06/15/2004 | US6750494 Semiconductor buried contact with a removable spacer |
| 06/15/2004 | US6750479 Semiconductor component and a method for identifying a semiconductor component |
| 06/15/2004 | US6750476 Substrate device manufacturing method and substrate device, electrooptical device manufacturing method and electrooptical device and electronic unit |
| 06/15/2004 | US6750405 Two signal one power plane circuit board |
| 06/15/2004 | US6750397 Thermally enhanced semiconductor build-up package |
| 06/15/2004 | US6750396 I-channel surface-mount connector |
| 06/15/2004 | US6750152 Method and apparatus for electrically testing and characterizing formation of microelectric features |
| 06/15/2004 | US6750142 Semiconductor device and method for manufacturing the same |
| 06/15/2004 | US6750138 Multilayer wires laminated to integrated circuit chip; applying electrode, dielectric; pressurization |
| 06/15/2004 | US6750137 Method and apparatus for forming an interlayer insulating film and semiconductor device |
| 06/15/2004 | US6750136 Contact structure production method |
| 06/15/2004 | US6750135 Method for forming chip scale package |
| 06/15/2004 | US6750133 Selective ball-limiting metallurgy etching processes for fabrication of electroplated tin bumps |
| 06/15/2004 | US6750132 Flip chip package, circuit board thereof and packaging method thereof |
| 06/15/2004 | US6750129 Process for forming fusible links |
| 06/15/2004 | US6750128 Methods of polishing, interconnect-fabrication, and producing semiconductor devices |
| 06/15/2004 | US6750125 Semiconductor device and method for manufacturing the same, semiconductor wafer and semiconductor device manufactured thereby |
| 06/15/2004 | US6750115 Method for generating alignment marks for manufacturing MIM capacitors |
| 06/15/2004 | US6750114 One-mask metal-insulator-metal capacitor and method for forming same |
| 06/15/2004 | US6750113 Metal-insulator-metal capacitor in copper |
| 06/15/2004 | US6750108 Method for manufacturing a semiconductor device |
| 06/15/2004 | US6750084 Method of mounting a leadless package and structure therefor |
| 06/15/2004 | US6750083 Method of masking microelectronic semiconductor chips with protective caps |
| 06/15/2004 | US6750082 Method of assembling a package with an exposed die backside with and without a heatsink for flip-chip |
| 06/15/2004 | US6750080 Semiconductor device and process for manufacturing the same |
| 06/15/2004 | US6749944 Stacked film, method for the formation of stacked film, insulating film, and substrate for semiconductor |
| 06/15/2004 | US6749927 Dielectric resin composition and multilayer circuit board comprising dielectric layers formed therefrom |
| 06/15/2004 | US6749890 Terminal electrode forming method in chip-style electronic component and apparatus therefor |
| 06/15/2004 | US6749711 Apparatus and methods for coverlay removal and adhesive application |
| 06/15/2004 | US6749699 Stress resistant alloy |
| 06/15/2004 | US6749439 Circuit board riser |
| 06/15/2004 | US6749013 Heat sink |
| 06/15/2004 | US6749012 Liquid cooling system for processors |
| 06/15/2004 | US6749011 Heat sink |
| 06/15/2004 | US6749010 Composite heat sink with metal base and graphite fins |
| 06/15/2004 | US6749009 Folded fin on edge heat sink |
| 06/15/2004 | US6748758 Cooling device, method of manufacturing the same and portable equipment |
| 06/15/2004 | US6748755 Refrigeration system utilizing incomplete evaporation of refrigerant in evaporator |
| 06/15/2004 | US6748746 Device and method for controlling temperature of semiconductor module |
| 06/15/2004 | US6748715 Safety unit |
| 06/15/2004 | US6748656 Folded-fin heatsink manufacturing method and apparatus |
| 06/10/2004 | WO2004049443A2 Camouflaged circuit structure |
| 06/10/2004 | WO2004049439A1 Semiconductor device |
| 06/10/2004 | WO2004049438A2 Method for producing a calibration wafer |
| 06/10/2004 | WO2004049437A1 Crack resistant interconnect module |
| 06/10/2004 | WO2004049436A1 Semiconductor device having a bond pad and method for its fabrication |
| 06/10/2004 | WO2004049435A1 Semiconductor device having clips for connecting to external elements |
| 06/10/2004 | WO2004049434A2 Decreasing thermal contact resistance at a material interface |
| 06/10/2004 | WO2004049433A1 Power semiconductor module |
| 06/10/2004 | WO2004049432A2 Sealing porous structures |
| 06/10/2004 | WO2004049426A1 Film carrier tape for mounting of electronic part |
| 06/10/2004 | WO2004049425A1 Gold alloy bonding wire for semiconductor device and process for producing the same |
| 06/10/2004 | WO2004049424A2 Microelectronic packaging and components |
| 06/10/2004 | WO2004049407A2 Plate through mask for generating alignment marks of mim capacitors |
| 06/10/2004 | WO2004049400A2 Methods for applying thermally conductive compounds utilizing piezo electric jet deposition |
| 06/10/2004 | WO2004049394A2 Digital and rf system and method therefor |
| 06/10/2004 | WO2004048457A1 Curable epoxy compositions, methods and articles made therefrom |
| 06/10/2004 | WO2004048017A1 Copper flake powder, method for producing copper flake powder, and conductive paste using copper flake powder |
| 06/10/2004 | WO2004038800A3 Multilayered integrated circuit with non functional conductive traces |
| 06/10/2004 | WO2004038318A3 Vapor escape microchannel heat exchanger |
| 06/10/2004 | WO2003065926A3 Wearable biomonitor with flexible thinned integrated circuit |
| 06/10/2004 | US20040110394 Method and apparatus for controlling coating thickness |
| 06/10/2004 | US20040110369 Methods for forming single damascene via or trench cavities and for forming dual damascene via cavities |
| 06/10/2004 | US20040110367 Semiconductor device and manufacturing method thereof |
| 06/10/2004 | US20040110365 Method of forming a planarized bond pad structure |
| 06/10/2004 | US20040110364 Method for making UBM pads and bumps on wafer |
| 06/10/2004 | US20040110355 Embedded MIM capacitor and zigzag inductor scheme |
| 06/10/2004 | US20040110334 Effective Vcc TO Vss power ESD protection device |
| 06/10/2004 | US20040110323 Method for producing encapsulated chips |
| 06/10/2004 | US20040110319 Fabrication process of semiconductor package and semiconductor package |
| 06/10/2004 | US20040110316 Semiconductor device and method of manufacturing the same |
| 06/10/2004 | US20040110315 Apparatus for evaluating amount of charge, method for fabricating the same, and method for evaluating amount of charge |
| 06/10/2004 | US20040110313 Integrated circuit identification |
| 06/10/2004 | US20040110163 Preparing molecular conductive wire comprising nucleic acids forming a central canal composed of linearly arranged metal ions within the canal and an electron-rich external surface |
| 06/10/2004 | US20040110024 a polyimide film and an electro-conductive metal film in which the metal film is attached to the polyimide film using neither heat curing adhesive nor thermoplastic adhesive; good for manufacturing a flexible printed circuit board (FPC). |