| Patents for H01L 23 - Details of semiconductor or other solid state devices (226,155) |
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| 06/17/2004 | DE10335118A1 Halbleitervorrichtung Semiconductor device |
| 06/17/2004 | DE10327618A1 Verfahren zur Ausbildung von Aluminiummetallverdrahtungen Process for the formation of aluminum metal wirings |
| 06/17/2004 | DE10318297A1 Keramisches Multilayersubstrat und Verfahren zu dessen Herstellung A ceramic multilayer substrate and process for its preparation |
| 06/17/2004 | DE10317675A1 Keramisches Multilayersubstrat und Verfahren zu seiner Herstellung A ceramic multilayer substrate and process for its preparation |
| 06/17/2004 | DE10317101A1 On-Chip-Rauschunterdrückungssystem und ein Verfahren, dieses herzustellen On-chip noise reduction system and method of producing this |
| 06/17/2004 | DE10257032A1 Production process for sensor chips in standard plastic housings, involves packing chip with sensor element into the housing and exposing sensor element using a laser |
| 06/17/2004 | DE10256945A1 Elektronisches Bauelement mit mehreren Chips und Verfahren zur Herstellung An electronic component having a plurality of chips and processes for making |
| 06/17/2004 | DE10255862B3 Semiconductor element arrangement incorporating protection device for suppression of electromagnetic interference signals |
| 06/17/2004 | DE10255835A1 Microelectronic component e.g. FET for high density memory, has low ohmic tungsten nitride barrier layer |
| 06/17/2004 | DE10255520A1 Production of conductor strips for electronic components comprises forming a liquid film with a liquid having electrically conducting particles on the upper surfaces of a circuit carrier or electronic component, and further processing |
| 06/17/2004 | DE10255462A1 Electric device, e.g. for opto-electronic field, such as laser and photodetector, with appropriate housing, a support with at least one conductive track, on which is secured electric component coupled to conductive track |
| 06/17/2004 | DE10255427A1 Method of manufacture antifuse in substrate, e.g. integrated circuit, for permanent storage of adjust values by application of programming voltage, using deposition of two conductive tracks with dielectric layer in between |
| 06/17/2004 | DE10255425A1 Production of an anti-fuse structure in a substrate used in integrated circuits comprises forming a conducting region and a non-conducting region in the substrate to form an edge of the conducting region, and depositing a dielectric layer |
| 06/17/2004 | DE10255289A1 Elektronisches Bauteil mit gestapelten Halbleiterchips in paralleler Anordnung und Verfahren zu dessen Herstellung An electronic part having stacked semiconductor chips in parallel arrangement and method for its production |
| 06/16/2004 | EP1429590A1 Thin film circuit board device and its manufacturing method |
| 06/16/2004 | EP1429389A1 Compact circuit module having high mounting accuracy and method of manufacturing the same |
| 06/16/2004 | EP1429388A1 High performance vias for vertical IC packaging |
| 06/16/2004 | EP1429387A2 Electronic device capable of preventing electromagnetic wave from being radiated |
| 06/16/2004 | EP1429386A2 Tape carrier for tab and method for producing the same |
| 06/16/2004 | EP1429385A1 Housing for power semiconductor modules |
| 06/16/2004 | EP1429384A1 Circuit for semiconductor devices and method for producing the same |
| 06/16/2004 | EP1429383A2 Method of forming a semiconductor device with silicon-carbon-oxygen dielectric having improved metal barrier adhesion |
| 06/16/2004 | EP1429377A2 Method of reflowing conductive terminals |
| 06/16/2004 | EP1429376A1 Method and apparatus for processing organosiloxane film |
| 06/16/2004 | EP1429168A2 Image sensing device and portable terminal |
| 06/16/2004 | EP1428996A1 Liquid/coolant system including boiling sensor |
| 06/16/2004 | EP1428906A1 Low dielectric constant material and method of processing by CVD |
| 06/16/2004 | EP1428418A1 Surface mounting package |
| 06/16/2004 | EP1428293A2 Structure and method for fabrication of a leadless chip carrier with embedded antenna |
| 06/16/2004 | EP1428260A2 Non-conductive substrate forming a strip or a panel, on which a plurality of carrier elements are configured |
| 06/16/2004 | EP1428259A2 Semiconductor module |
| 06/16/2004 | EP1428258A1 Thin electronic label and method for making same |
| 06/16/2004 | EP1428257A2 Apparatus with compliant electrical terminals, and methods for forming same |
| 06/16/2004 | EP1428256A2 Semiconductor device with compliant electrical terminals, apparatus including the semiconductor device, and methods for forming same |
| 06/16/2004 | EP1428254A2 Ic-chip with protective structure |
| 06/16/2004 | EP1428246A1 Wafer level underfill and interconnect process |
| 06/16/2004 | EP1428244A2 Integrated circuit having an energy-absorbing structure |
| 06/16/2004 | EP1428242A2 Real-time evaluation of stress fields and properties in line features formed on substrates |
| 06/16/2004 | EP1427971A2 Modular capillary pumped loop cooling system |
| 06/16/2004 | EP1427792A1 Thermoconductive composition |
| 06/16/2004 | EP0806056B1 Glass bonding layer for a ceramic circuit board support substrate |
| 06/16/2004 | CN2620928Y Heat sink module |
| 06/16/2004 | CN2620927Y Heat conduction superconduit structure capable of long-distance transfer heat quantity |
| 06/16/2004 | CN2620926Y Fixed fastener for radiator component |
| 06/16/2004 | CN1505919A Pin grid array package socket |
| 06/16/2004 | CN1505839A Semiconductor device |
| 06/16/2004 | CN1505838A System on a package fabricated on a semiconductor or dielectric wafer |
| 06/16/2004 | CN1505834A Low-k interconnect structure comprised of a multilayer of spin-on porous dielectrics |
| 06/16/2004 | CN1505468A Driving apparatus for high acceleration revolution axis and application method thereof |
| 06/16/2004 | CN1505445A Matrix substrate, electronic apparatus, electro-optic apparatus, and electronic unit |
| 06/16/2004 | CN1505442A Packaging structure of organic electroluminescent cell and making process thereof |
| 06/16/2004 | CN1505169A Semiconductor device with SOI region and bulk region and method of manufacture thereof |
| 06/16/2004 | CN1505163A Method for forming an image sensor having concave-shaped micro-lenses |
| 06/16/2004 | CN1505157A Semiconductor device and its manufacturing method |
| 06/16/2004 | CN1505150A Semiconductor device and method of manufacturing the same |
| 06/16/2004 | CN1505147A Electronic parts packaging structure and method of manufacturing the same |
| 06/16/2004 | CN1505146A Multiple chip module |
| 06/16/2004 | CN1505145A 半导体装置 Semiconductor device |
| 06/16/2004 | CN1505144A Power supply bus static discharge protection device and process |
| 06/16/2004 | CN1505143A Static discharge protection element for integrated circuit input |
| 06/16/2004 | CN1505142A Chip possessing noise elimination system and method for making same |
| 06/16/2004 | CN1505141A Structure comprising a barrier layer of a tungsten alloy and manufacturing method thereof |
| 06/16/2004 | CN1505140A Gasket area arrangement |
| 06/16/2004 | CN1505139A Semiconductor device including interconnects formed by damascene process and manufacturing method thereof |
| 06/16/2004 | CN1505138A Semiconductor device and method of manufacturing the same |
| 06/16/2004 | CN1505137A Semiconductor device |
| 06/16/2004 | CN1505136A Semiconductor integrated circuit device and semiconductor integrated circuit chip thereof |
| 06/16/2004 | CN1505135A Laminated electronic component |
| 06/16/2004 | CN1505134A Manufacturing method of flash memory device |
| 06/16/2004 | CN1505126A Method for manufacturing integrated circuit having re-connecting component and corresponding integrated circuit |
| 06/16/2004 | CN1505124A Method for manufacturing circuit device |
| 06/16/2004 | CN1505123A Method for manufacturing circuit device |
| 06/16/2004 | CN1505106A Cleaning solution and method for selectively removing layer in a silicidation process |
| 06/16/2004 | CN1505105A Electrodes for semiconductor device and method for manufacturing the same |
| 06/16/2004 | CN1504978A Electronic installation, manufacturing method thereof and electronic equipment |
| 06/16/2004 | CN1504592A Paste for electroless plating and method of producing metallic structured body, micrometallic component, and conductor circuit using the paste |
| 06/16/2004 | CN1154403C Printed wiring board, method of producing the same and electronic equipment |
| 06/16/2004 | CN1154187C Ball array package for reducing electric stray signals |
| 06/16/2004 | CN1154186C Metallization in semiconductor devices |
| 06/16/2004 | CN1154185C Miltilayer wiring structure and producing method thereof |
| 06/16/2004 | CN1154184C Semiconductor device packaged by resin |
| 06/16/2004 | CN1154183C Composite Ag-Sn LED lead frame |
| 06/16/2004 | CN1154182C Semiconductor device |
| 06/16/2004 | CN1154181C Gold alloy wire for wedge bonding and use thereof in wedge bonding |
| 06/16/2004 | CN1154180C Method and apparatus for cooling semiconductor die |
| 06/16/2004 | CN1154179C Wafer package assembling with film substrate |
| 06/16/2004 | CN1154178C Semiconductor device and method for manufacturing same, circuit substrate, and electronic device |
| 06/16/2004 | CN1154177C Semiconductor package and method for manufacturing the same |
| 06/16/2004 | CN1154176C Electronic component, semiconductor device, mfg method therefor, circuit board and electronic equipment |
| 06/16/2004 | CN1154171C Semiconductor device and making method thereof |
| 06/16/2004 | CN1154170C Semiconductor device and manufacturing method thereof |
| 06/16/2004 | CN1154169C Semiconductor device and producing method thereof |
| 06/16/2004 | CN1154158C Method for manufacturing semiconductor device in which etching end point is monitored and multi-layer wiring structure formed by the same |
| 06/16/2004 | CN1154125C EMI preventive part and active device with the same |
| 06/16/2004 | CN1153806C Latency catalyst and use thereof |
| 06/15/2004 | US6751150 Circuits and method to protect a gate dielectric antifuse |
| 06/15/2004 | US6751101 Electronic component and method of producing the same |
| 06/15/2004 | US6751099 Integrated circuit packages; heat spreader coupling to die; overcoating with protective coating |
| 06/15/2004 | US6751095 Cooling unit including radiator for radiating heat of heat generating component, and electronic apparatus including the cooling unit |
| 06/15/2004 | US6750924 Electro-optical device with conductive interlayer having a role of a capacitor electrode, method for making the same, and electronic apparatus |