Patents
Sitemap › H01 - Basic electric elements › H01L - Semiconductor devices; Electric solid state devices not otherwise provided for › H01L 23 - Details of semiconductor or other solid state devices
Patents for H01L 23 - Details of semiconductor or other solid state devices (226,155)
02/2014
02/18/2014US8653541 Semiconductor device
02/18/2014US8653383 Electric device and production method therefor
02/18/2014US8653205 Resin composition for encapsulating semiconductor and semiconductor device
02/18/2014US8653160 Inclusion complex containing epoxy resin composition for semiconductor encapsulation
02/18/2014US8652971 Cavity process etch undercut monitor
02/18/2014US8652969 High aspect ratio and reduced undercut trench etch process for a semiconductor substrate
02/18/2014US8652950 C-rich carbon boron nitride dielectric films for use in electronic devices
02/18/2014US8652883 Methods of manufacture of bottom port surface mount silicon condenser microphone packages
02/18/2014US8652882 Chip package structure and chip packaging method
02/18/2014US8652881 Integrated circuit package system with anti-peel contact pads
02/18/2014US8652866 Sensor device and method
02/18/2014US8652855 Low resistance stacked annular contact
02/18/2014CA2560410C Heat sink material, manufacturing method for the same, and semiconductor laser device
02/17/2014DE202014000066U1 Kühlvorrichtung für ein elektronisches Mobilgerät Cooling device for an electronic mobile device
02/13/2014WO2014026034A1 Methods of making packages using thin cu foil supported by carrier cu foil
02/13/2014WO2014026011A1 A reliable physical unclonable function for device authentication
02/13/2014WO2014025844A1 Variable capacitor comprising mems devices for radio frequency applications
02/13/2014WO2014025074A1 Apparatus for dissipating heat through heat sink
02/13/2014WO2014024786A1 Heat-diffusing sound insulation sheet and heat-diffusing sound insulation structure
02/13/2014WO2014024754A1 Circuit board for semiconductor package and method for producing same
02/13/2014WO2014024361A1 Cooling structure and power conversion device
02/13/2014WO2014024338A1 Method and system for manufacturing substrate having component mounted thereon
02/13/2014WO2014024250A1 Wiring board, method for manufacturing same, and semiconductor device
02/13/2014WO2014023320A1 Method for producing a hermetically sealed housing
02/13/2014WO2014023287A2 Contact bump connection and contact bump and method for producing a contact bump connection
02/13/2014WO2014023113A1 Quad flat non-leaded package and packaging method thereof
02/13/2014WO2013009871A8 Memory module in a package
02/13/2014US20140046014 Siloxane compound and cured product thereof
02/13/2014US20140045327 Double Solid Metal Pad with Reduced Area
02/13/2014US20140045326 Method of making a semiconductor device having a post-passivation interconnect structure
02/13/2014US20140045320 Semiconductor integrated circuit device and process for manufacturing the same
02/13/2014US20140045302 Manufacturing Method of Submount
02/13/2014US20140045301 Through silicon via dies and packages
02/13/2014US20140043782 Compliant core peripheral lead semiconductor socket
02/13/2014US20140043067 Semiconductor structure and manufacturing method and operating method of the same
02/13/2014US20140043063 Semiconductor device
02/13/2014US20140042645 Resin sheet for sealing electronic component, resin-sealed type semiconductor device and method for producing resin-sealed type semiconductor device
02/13/2014US20140042643 Interposer System and Method
02/13/2014US20140042642 Conductive line of semiconductor device and method of fabricating the same
02/13/2014US20140042641 Middle-of-the-line constructs using diffusion contact structures
02/13/2014US20140042640 Dummy patterns and method for generating dummy patterns
02/13/2014US20140042639 Apparatus, system, and method for wireless connection in integrated circuit packages
02/13/2014US20140042638 Semiconductor package and method of fabricating the same
02/13/2014US20140042636 Dummy patterns and method for generating dummy patterns
02/13/2014US20140042635 Semiconductor device
02/13/2014US20140042634 Methods of making compliant semiconductor chip packages
02/13/2014US20140042633 Semiconductor devices including a non-planar conductive pattern, and methods of forming semiconductor devices including a non-planar conductive pattern
02/13/2014US20140042632 Semiconductor device and method for manufacturing the same
02/13/2014US20140042631 Semiconductor component comprising copper metallizations
02/13/2014US20140042630 Controlled collapse chip connection (c4) structure and methods of forming
02/13/2014US20140042629 Semiconducting multi-layer structure and method for manufacturing the same
02/13/2014US20140042628 Structure with sub-lithographic random conductors as a physical unclonable function
02/13/2014US20140042627 Electronic structure containing a via array as a physical unclonable function
02/13/2014US20140042626 Method of fabricating semiconductor device and the semiconductor device
02/13/2014US20140042625 Bonding layer structure and method for wafer to wafer bonding
02/13/2014US20140042624 Power MOSFET Having Selectively Silvered Pads for Clip and Bond Wire Attach
02/13/2014US20140042623 System in package and method of fabricating same
02/13/2014US20140042622 Fine Pitch Package-on-Package Structure
02/13/2014US20140042621 Package on Package Devices and Methods of Forming Same
02/13/2014US20140042620 Stacked multilayer structure and manufacturing method thereof
02/13/2014US20140042619 Semiconductor device having under-bump metallization (ubm) structure and method of forming the same
02/13/2014US20140042618 Methods for forming a semiconductor structure and related structures
02/13/2014US20140042617 Semiconductor device having penetration electrode
02/13/2014US20140042616 Semiconductor device
02/13/2014US20140042615 Flip-chip package
02/13/2014US20140042614 Underfill
02/13/2014US20140042613 Semiconductor device and method of manufacturing the same
02/13/2014US20140042612 Semiconductor Devices and Methods of Manufacture Thereof
02/13/2014US20140042611 Power converter
02/13/2014US20140042610 Package structure and the method to fabricate thereof
02/13/2014US20140042609 Semiconductor device and method of manufacturing the same
02/13/2014US20140042608 Semiconductor package and method of manufacturing the same
02/13/2014US20140042607 Microbump seal
02/13/2014US20140042606 Low Loss Nano-aperture
02/13/2014US20140042605 Lead frame package and method for manufacturing the same
02/13/2014US20140042604 Three-dimensional (3d) semiconductor package
02/13/2014US20140042603 Electronic Device and Method of Fabricating an Electronic Device
02/13/2014US20140042602 Wiring board and method for manufacturing wiring board
02/13/2014US20140042600 Semiconductor Package and Manufacturing Method Thereof
02/13/2014US20140042599 Multi-chip module power clip
02/13/2014US20140042589 Semiconductor device
02/13/2014US20140042564 Integrated-circuit switch
02/13/2014US20140042557 Device-Manufacturing Scheme for Increasing the Density of Metal Patterns in Inter-Layer Dielectrics
02/13/2014US20140042533 Segmented Pillar Layout for a High-Voltage Vertical Transistor
02/13/2014US20140042500 Contact structure of semiconductor device
02/13/2014US20140042461 Silicon carbide semiconductor device and method for manufactuing same
02/13/2014US20140042442 Reliable physical unclonable function for device authentication
02/13/2014US20140042110 Pole assembly
02/13/2014US20140041911 Flat dam and method for manufacturing chip package using the same
02/13/2014US20140041173 Transformer with bypass capacitor
02/13/2014DE10331096B4 Integrierte Halbleiteranordnung und Verfahren Integrated semiconductor device and method
02/13/2014DE10238037B4 Halbleitereinrichtung mit Gehäuse und Halterung A semiconductor device comprising housing and bracket
02/13/2014DE102013222004A1 Optical coupler of electronic control system, has transparent encapsulating to encapsulate each of portions of optical emitters, optical receiver, lens layer, and insulating tape
02/13/2014DE102013221822A1 Method for manufacturing chips, involves providing back metal stack on laser absorption layer, irradiating laser absorption layer with laser light along dividing lines, and separating chips along dividing lines using covered division
02/13/2014DE102013215818A1 Integrierter Chip mit Heizelement und Referenzschaltung, Testschaltung und Verfahren Integrated chip with heating element and reference circuit, test circuit and method
02/13/2014DE102013214441A1 Verfahren zur Verringerung der Benetzbarkeit von Verbindungsmaterial an Eckberührungsflächen und eine gemäß dem Verfahren hergestellte Vorrichtung A method of reducing the wettability of bonding material to Eckberührungsflächen and a device produced according to the method
02/13/2014DE102013214440A1 Reparieren von anomal festen Säulenhöckern Repair of anomalous solid pillars bumps
02/13/2014DE102013108473A1 Halbleitervorrichtung mit einem graben in einem halbleitersubstrat und verfahren zur herstellung einer halbleitervorrichtung A semiconductor device comprising a trench in a semiconductor substrate and process for producing a semiconductor device
02/13/2014DE102013108354A1 Elektronikbauelement und Verfahren zum Herstellen eines Elektronikbauelements An electronics device and method for manufacturing an electronic device
02/13/2014DE102013103572A1 Electronic package module for optoelectronic component, has circuit board comprising bearing area on which electronic parts are mounted, and molding material arranged at area and partially covering one of parts and not covering other part
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