| Patents for H01L 23 - Details of semiconductor or other solid state devices (226,155) |
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| 06/17/2004 | US20040115873 Bilayer HDP CVD/PE CVD cap in advanced BEOL interconnect structures and method thereof |
| 06/17/2004 | US20040115868 Production method for manufacturing a plurality of chip-size packages |
| 06/17/2004 | US20040115867 Semiconductor device and method for manufacturing same |
| 06/17/2004 | US20040115866 Methods of making microelectronic packages including folded substrates |
| 06/17/2004 | US20040115865 Method for fabricating semiconductor component with on board capacitor |
| 06/17/2004 | US20040115864 Manufacturing method for electronic component-mounted component, manufacturing method for electronic component-mounted completed product with the electronic component-mounted component, and electronic component-mounted completed product |
| 06/17/2004 | US20040115862 [process and structure for semiconductor package] |
| 06/17/2004 | US20040115856 Method and apparatus for vacuum-mounting a micro electro mechanical system on a substrate |
| 06/17/2004 | US20040115409 Interconnection designs and materials having improved strength and fatigue life |
| 06/17/2004 | US20040115408 Low temperature bumping process |
| 06/17/2004 | US20040115407 Diffusion barrier with low dielectric constant and semiconductor device containing same |
| 06/17/2004 | US20040115349 Film forming method and film forming device |
| 06/17/2004 | US20040115340 Depositing particles comprising at least one coating on a substrate; andreflowing the particles to at least partially melt the coating, thereby forming a substantially continuous solidified solder material |
| 06/17/2004 | US20040114765 Extraction of a private datum to authenticate an integrated circuit |
| 06/17/2004 | US20040114426 Quad flat no-lead (QFN) grid array package, method of making and memory module and computer system including same |
| 06/17/2004 | US20040114332 Heat sink clip assembly with cammed clip handles |
| 06/17/2004 | US20040114329 CPU heatsink fastener |
| 06/17/2004 | US20040114328 Heat dissipation device for electronic component |
| 06/17/2004 | US20040114327 Active heat sink for high power microprocessors |
| 06/17/2004 | US20040114324 Electronic apparatus having a plurality of radiators in which liquid coolant flows |
| 06/17/2004 | US20040114322 Method and arrangement for enhancing the cooling capacity of portable computers |
| 06/17/2004 | US20040114294 [structure for preventing burnt fuse pad from further electrical connection] |
| 06/17/2004 | US20040114143 Marker structure for optical alignment of a substrate, a substrate including such a marker structure, an alignment method for aligning to such a marker structure, and a lithographic projection apparatus |
| 06/17/2004 | US20040114088 Electro-optical device |
| 06/17/2004 | US20040113752 Method for the implementation of electronic components in via-holes of a multi-layer multi-chip module |
| 06/17/2004 | US20040113737 Inductors and transformers in integrated circuits |
| 06/17/2004 | US20040113721 MLC frequency selective circuit structures |
| 06/17/2004 | US20040113719 High-frequency module |
| 06/17/2004 | US20040113717 Coupling device using buried capacitors in multilayered substrate |
| 06/17/2004 | US20040113697 Single package multi-chip RF power amplifier |
| 06/17/2004 | US20040113549 High power radiation emitter device and heat dissipating package for electronic components |
| 06/17/2004 | US20040113285 Method and apparatus for reducing electrical interconnection fatigue |
| 06/17/2004 | US20040113284 Integrated circuits; multilayer |
| 06/17/2004 | US20040113283 Method for fabricating encapsulated semiconductor components by etching |
| 06/17/2004 | US20040113282 [structure of flip chip package with area bump] |
| 06/17/2004 | US20040113281 Multi-chip module and method of forming |
| 06/17/2004 | US20040113280 Multi-chip package |
| 06/17/2004 | US20040113279 Integrated circuits; interconnecting layer between substrate and conductive features |
| 06/17/2004 | US20040113278 Structure and method for reducing thermo-mechanical stress in stacked vias |
| 06/17/2004 | US20040113277 Formation of aligned capped metal lines and interconnections in multilevel semiconductor structures |
| 06/17/2004 | US20040113274 Multilayer;covering surfaces |
| 06/17/2004 | US20040113273 Under-bump-metallurgy layer for improving adhesion |
| 06/17/2004 | US20040113272 [bump and fabricating process thereof] |
| 06/17/2004 | US20040113271 Tape carrier package having stacked semiconductor elements, and short and long leads |
| 06/17/2004 | US20040113270 Semiconductor component having a compliant buffer layer |
| 06/17/2004 | US20040113269 Semiconductor device and method for manufacturing the same |
| 06/17/2004 | US20040113268 Semiconductor device |
| 06/17/2004 | US20040113267 Electronic device |
| 06/17/2004 | US20040113266 [semiconductor package module and manufacturing mehod thereof] |
| 06/17/2004 | US20040113265 Localized backside chip cooling with integrated smart valves |
| 06/17/2004 | US20040113264 High performance vias for vertical IC packaging |
| 06/17/2004 | US20040113263 Semiconductor package structure provided with heat sink fan |
| 06/17/2004 | US20040113262 Miniature moldlocks for heatsink or flag for an overmolded plastic package |
| 06/17/2004 | US20040113261 wiring pattern; connecting terminals via apertures : flip chips |
| 06/17/2004 | US20040113260 Electronic parts packaging structure and method of manufacturing the same |
| 06/17/2004 | US20040113259 Method for making a semiconductor package and semiconductor package with integrated circuit chips |
| 06/17/2004 | US20040113258 Semiconductor power module |
| 06/17/2004 | US20040113257 Integrated circuit package and printed circuit board arrangement |
| 06/17/2004 | US20040113252 Partially populated ball grid design to accommodate landing pads close to the die |
| 06/17/2004 | US20040113251 Semiconductor chip package with a package substrate and a lid cover |
| 06/17/2004 | US20040113250 Integrated circuit assembly |
| 06/17/2004 | US20040113249 Contacting structure of a card connector |
| 06/17/2004 | US20040113248 Semiconductor device and manufacturing the same |
| 06/17/2004 | US20040113247 Flip-chip packaging |
| 06/17/2004 | US20040113245 Semiconductor device and process for fabricating the same |
| 06/17/2004 | US20040113244 Package substrate manufactured using electrolytic leadless plating process, and method for manufacturing the same |
| 06/17/2004 | US20040113243 UV cured polymeric semiconductor die coating |
| 06/17/2004 | US20040113242 Electronic component having lead frame |
| 06/17/2004 | US20040113241 Gold spot plated leadframes for semiconductor devices and method of fabrication |
| 06/17/2004 | US20040113240 An electronic component with a leadframe |
| 06/17/2004 | US20040113239 High-speed signaling interface with broadside dynamic wave coupling |
| 06/17/2004 | US20040113238 Semiconductor device |
| 06/17/2004 | US20040113234 Test structure and methodology for semiconductor stress-induced defects and antifuse based on same test structure |
| 06/17/2004 | US20040113233 Fuse box of semiconductor device and fabrication method thereof |
| 06/17/2004 | US20040113231 High voltage semiconductor device |
| 06/17/2004 | US20040113228 Convex polycrystalline silicon thin films; separation layer with convex, concave zones |
| 06/17/2004 | US20040113222 Stacked microelectronic module with vertical interconnect vias |
| 06/17/2004 | US20040113215 Surface acoustic wave device and method for manufacturing same |
| 06/17/2004 | US20040113200 Semiconductor device |
| 06/17/2004 | US20040113190 Integrated circuit devices including a MIM capacitor |
| 06/17/2004 | US20040113149 Thin film transistor array panel and manufacturing method thereof |
| 06/17/2004 | US20040113148 Structure and method for measuring the etching speed |
| 06/17/2004 | US20040113147 Semiconductor substrate; electroconductive zones; multilayer |
| 06/17/2004 | US20040113142 Semiconductor device and method of manufacturing the same |
| 06/17/2004 | US20040113139 Sublithographic nanoscale memory architecture |
| 06/17/2004 | US20040113138 Stochastic assembly of sublithographic nanoscale interfaces |
| 06/17/2004 | US20040112636 Manufacturing method for electronic component module and electromagnetically readable data carrier |
| 06/17/2004 | US20040112633 Electronic device module |
| 06/17/2004 | US20040112617 Non-circular micro-via |
| 06/17/2004 | US20040112585 Method and apparatus for achieving temperature uniformity and hot spot cooling in a heat producing device |
| 06/17/2004 | US20040112571 Method and apparatus for efficient vertical fluid delivery for cooling a heat producing device |
| 06/17/2004 | US20040111887 Method for filling heat pipe wick structure and the like |
| 06/17/2004 | US20040111882 Process for producing a printed wiring board-forming sheet and multi-layered printed wiring board |
| 06/17/2004 | DE19608683B4 Verfahren zum Herstellen eines Substrates A method for manufacturing a substrate |
| 06/17/2004 | DE19509203B4 Halbleitervorrichtung mit einer mehrschichtigen Zwischenverbindungsstruktur und Verfahren zu ihrer Herstellung A semiconductor device having a multilayer interconnection structure and methods for their preparation |
| 06/17/2004 | DE10355065A1 Verfahren zum Vergießen mit Harz, Verwendung des genannten Verfahrens zum Herstellen eines Halbleiterbauteils sowie Harzmaterial für das Verfahren A method for encapsulating with resin, the use of said method for producing a semiconductor device as well as resin material for the process |
| 06/17/2004 | DE10354202A1 Heat removal device for electronic components of electronic control device e.g. for vehicles, has heat conducting connection joined to circuit board in vicinity of electronic component/unit |
| 06/17/2004 | DE10351924A1 Durchkontaktierungssubstrat und ein Verfahren zur Herstellung eines Durchkontaktierungssubstrats Durchkontaktierungssubstrat and a method for producing a Durchkontaktierungssubstrats |
| 06/17/2004 | DE10349692A1 Halbleitervorrichtung und Verfahren zur Herstellung derselben A semiconductor device and method of manufacturing the same |
| 06/17/2004 | DE10335391A1 Herstellungsverfahren für ein Flash-Speicherbauteil Manufacturing method for a flash memory device |