| Patents for H01L 23 - Details of semiconductor or other solid state devices (226,155) |
|---|
| 06/22/2004 | US6754405 Electronic assembly having high interconnection density |
| 06/22/2004 | US6754244 Diode laser component |
| 06/22/2004 | US6754086 Integrated magnetic buck converter with magnetically coupled synchronously rectified mosfet gate drive |
| 06/22/2004 | US6754080 Clip for heat sink |
| 06/22/2004 | US6754079 KD heat sink fins |
| 06/22/2004 | US6754078 Heat dissipating device with slanting engaged heat dissipating sheets and bottom plate |
| 06/22/2004 | US6753745 High efficiency four port circuit |
| 06/22/2004 | US6753726 Apparatus and method for an offset-correcting sense amplifier |
| 06/22/2004 | US6753617 Method for improving a stepper signal in a planarized surface over alignment topography |
| 06/22/2004 | US6753616 Flip chip semiconductor device in a molded chip scale package |
| 06/22/2004 | US6753614 Having adhesive agent portions intermittently formed on surface of tape shaped base material having specified surface tension, in longitudinal direction and in same shape as chip to be adhered; adhesive having gradable adhesiveness |
| 06/22/2004 | US6753613 Stacked dice standoffs |
| 06/22/2004 | US6753612 Economical high density chip carrier |
| 06/22/2004 | US6753611 Semiconductor device, designing method thereof, and recording medium storing semiconductor designing program |
| 06/22/2004 | US6753610 Semiconductor device having multilayer interconnection structure and method of making the same |
| 06/22/2004 | US6753608 Passivation film and seal for edge of die which serve as protective structure for semiconductor device |
| 06/22/2004 | US6753605 Passivation scheme for bumped wafers |
| 06/22/2004 | US6753603 Electronic equipment having insulating heat dissipation plate |
| 06/22/2004 | US6753602 Semiconductor package with heat-dissipating structure and method of making the same |
| 06/22/2004 | US6753600 Structure of a substrate for a high density semiconductor package |
| 06/22/2004 | US6753599 Semiconductor package and mounting structure on substrate thereof and stack structure thereof |
| 06/22/2004 | US6753598 Transverse hybrid LOC package |
| 06/22/2004 | US6753597 Encapsulated semiconductor package including chip paddle and leads |
| 06/22/2004 | US6753596 Resin-sealed semiconductor device |
| 06/22/2004 | US6753595 Substrates for semiconductor devices with shielding for NC contacts |
| 06/22/2004 | US6753594 Configuration of contact surfaces makes possible partly narrowed contour of through-hole and thus makes more space available at narrowed locations for terminal pads of rewiring plane; reliable bond connections |
| 06/22/2004 | US6753590 Antifuses that can be programmed at voltages and currents that reduce possibility of damaging non-programmed circuit elements |
| 06/22/2004 | US6753578 Resin-sealed semiconductor device |
| 06/22/2004 | US6753574 Semiconductor device and method for fabricating the same |
| 06/22/2004 | US6753547 Method and apparatus for wafer level testing of semiconductor using sacrificial on die power and ground metalization |
| 06/22/2004 | US6753541 Method and apparatus for making and using a beacon fiducial for an integrated circuit |
| 06/22/2004 | US6753482 Semiconductor component with adjustment circuitry |
| 06/22/2004 | US6753481 Printed circuit board employing lossy power distribution network to reduce power plane resonances |
| 06/22/2004 | US6753480 Printed circuit board having permanent solder mask |
| 06/22/2004 | US6753277 Ceramics having excellent high-frequency characteristics and method of producing the same |
| 06/22/2004 | US6753259 Method of improving the bondability between Au wires and Cu bonding pads |
| 06/22/2004 | US6753258 Integration scheme for dual damascene structure |
| 06/22/2004 | US6753253 Method of making wiring and logic corrections on a semiconductor device by use of focused ion beams |
| 06/22/2004 | US6753244 Method for manufacturing a copper fuse structure |
| 06/22/2004 | US6753241 Semiconductor processing methods of forming contact openings, methods of forming electrical connections and interconnections, and integrated circuitry |
| 06/22/2004 | US6753238 Semiconductor device and manufacturing method thereof |
| 06/22/2004 | US6753210 Metal fuse for semiconductor devices |
| 06/22/2004 | US6753208 Wafer scale method of packaging integrated circuit die |
| 06/22/2004 | US6753207 Stacked semiconductor package and fabricating method thereof |
| 06/22/2004 | US6753206 Dual-chip integrated circuit package with unaligned chip arrangement and method of manufacturing the same |
| 06/22/2004 | US6753205 Method for manufacturing a structure comprising a substrate with a cavity and a semiconductor integrated circuit bonded to a contact pad located in the cavity |
| 06/22/2004 | US6753204 Method for assembling integrated circuits with protection of the circuits against electrostatic discharge |
| 06/22/2004 | US6753199 Topside active optical device apparatus and method |
| 06/22/2004 | US6753108 Energy devices and methods for the fabrication of energy devices |
| 06/22/2004 | US6753093 Heat dissipating material and manufacturing method thereof |
| 06/22/2004 | US6753086 Thermosetting resin composition, epoxy resin molding material and semiconductor device |
| 06/22/2004 | US6753070 Insulating ceramic compact, ceramic multilayer substrate, and ceramic electronic device |
| 06/22/2004 | US6752645 Semiconductor device-socket having rotationally movable heat sinks |
| 06/22/2004 | US6752643 KGD carrier and an IC mounting socket mounting it |
| 06/22/2004 | US6752636 Retainer device for electronic package |
| 06/22/2004 | US6752577 Heat sink fastener |
| 06/22/2004 | US6752310 Electrically conductive wire |
| 06/22/2004 | US6752204 Iodine-containing thermal interface material |
| 06/22/2004 | US6752201 Cooling mechanism for an electronic device |
| 06/22/2004 | US6751862 Method of making an electronic device |
| 06/22/2004 | US6751857 Conductive contamination reliability solution for assembling substrates |
| 06/22/2004 | US6751837 Method of heat extraction from an integrated circuit die |
| 06/22/2004 | CA2342857C Preparation of cross-linked 2-dimensional polymers with sidedness from .alpha.,.beta.-lactones |
| 06/18/2004 | CA2452519A1 Package for housing semiconductor chip, fabrication method thereof and semiconductor device |
| 06/17/2004 | WO2004052067A1 Cooling of electric appliance unit |
| 06/17/2004 | WO2004051848A1 Acoustic resonator support, acoustic resonator and corresponding integrated circuit |
| 06/17/2004 | WO2004051806A2 Flip-chip device having conductive connectors |
| 06/17/2004 | WO2004051749A1 Lateral lubistor structure and method |
| 06/17/2004 | WO2004051748A1 Solder bond pad with a convex shape |
| 06/17/2004 | WO2004051746A1 High-frequency circuit and high-frequency package |
| 06/17/2004 | WO2004051745A2 Electronic component comprising a plurality of chips and method for producing the same |
| 06/17/2004 | WO2004051743A2 Radiation protection in integrated circuits |
| 06/17/2004 | WO2004051737A2 Split manufacturing method for semiconductor circuits |
| 06/17/2004 | WO2004051733A1 Thin gaas die with copper back-metal structure |
| 06/17/2004 | WO2004051732A1 Attachment of flip-chips to substrates |
| 06/17/2004 | WO2004051134A2 Vacuum heat insulator and its manufacturing method |
| 06/17/2004 | WO2004050950A1 Metal material for electric electronic component |
| 06/17/2004 | WO2004034427A3 Semiconductor packages, lead-containing solders and anodes and methods of removing alpha-emitters from materials |
| 06/17/2004 | WO2004032188A3 Packaged rf power transistor having rf bypassing/output matching network |
| 06/17/2004 | WO2004030096A3 Crack resistant interconnect module |
| 06/17/2004 | WO2004025695A3 Semiconductor device with wire bond inductor and method |
| 06/17/2004 | WO2004021400A3 Substrate based unmolded package |
| 06/17/2004 | WO2003100858A3 Surface mounted decoupling capacitor system and process of making the same |
| 06/17/2004 | WO2003092070A3 Power and ground shield mesh to remove both capacitive and inductive signal coupling effects of routing in integrated circuit device |
| 06/17/2004 | WO2003088370A3 Hermetic encapsulation of organic electro-optical elements |
| 06/17/2004 | WO2003067658A3 Thermal management materials having a phase change dispersion |
| 06/17/2004 | WO2003061006A3 Stacked die in die bga package |
| 06/17/2004 | US20040115963 Test structure for determining the electrical loadability of contacts |
| 06/17/2004 | US20040115952 Cleaning solution and method for selectively removing layer in a silicidation process |
| 06/17/2004 | US20040115942 Bonding pad of a semiconductor device and formation method thereof |
| 06/17/2004 | US20040115934 Method of improving contact resistance |
| 06/17/2004 | US20040115925 Method for improving semiconductor process wafer CMP uniformity while avoiding fracture |
| 06/17/2004 | US20040115920 Semiconductor device and method for manufacturing the same, circuit board, electronic apparatus, and semiconductor device manufacturing apparatus |
| 06/17/2004 | US20040115919 Semiconductor device and its manufacturing method |
| 06/17/2004 | US20040115915 Method for fabricating multilayer interconnect and method for checking the same |
| 06/17/2004 | US20040115914 Method of fabricating integrated circuitry, and method of forming a conductive line |
| 06/17/2004 | US20040115902 Semiconductor device, method of manufacturing the same, circuit board, and electronic equipment |
| 06/17/2004 | US20040115899 Transposed split of ion cut materials |
| 06/17/2004 | US20040115876 Method of manufacturing silicon carbide film |
| 06/17/2004 | US20040115875 Method and structure for forming precision mim fusible circuit elements using fuses and antifuses |