| Patents for H01L 23 - Details of semiconductor or other solid state devices (226,155) |
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| 06/24/2004 | DE10257083A1 Heat sink for power semiconductor on circuit board has cooling vane which penetrates opening in cooling plate and is thermally connected to cooling plate |
| 06/24/2004 | CA2507651A1 Method, system and apparatus for cooling high power density devices |
| 06/23/2004 | EP1432295A1 Cooling device for an electric or electronic unit |
| 06/23/2004 | EP1432293A1 Printed wiring board and production method for printed wiring board |
| 06/23/2004 | EP1432239A1 Camera module |
| 06/23/2004 | EP1432123A2 Electronic component and method of producing the same |
| 06/23/2004 | EP1432064A1 RF module and method for arranging through holes in RF module |
| 06/23/2004 | EP1432034A1 Semiconductor device and semiconductor device manufacturing method |
| 06/23/2004 | EP1432033A1 Multi-chip module and method of forming |
| 06/23/2004 | EP1432032A2 Semiconductor chip stack and method for manufacturing the same |
| 06/23/2004 | EP1432031A1 Anti-tampering enclosure for electronic circuitry |
| 06/23/2004 | EP1432030A2 Semiconductor device |
| 06/23/2004 | EP1432029A2 Package for housing a semiconductor chip having a metal-diamond composite in the substrate, and fabrication method thereof |
| 06/23/2004 | EP1432028A1 Production method for semiconductor device |
| 06/23/2004 | EP1432027A1 HIGH FREQUENCY IC PACKAGE, HIGH FREQUENCY UNIT USING IT, AND METHOD FOR MANUFACTURING THE SAME |
| 06/23/2004 | EP1432025A2 Semiconductor device having a multilayer interconnection structure and fabrication process thereof |
| 06/23/2004 | EP1432024A2 Method of forming a penetration electrode and substrate having a penetration electrode |
| 06/23/2004 | EP1432023A1 Semiconductor device and production method therefor |
| 06/23/2004 | EP1432022A2 Method for manufacturing and transferring a semiconductor film |
| 06/23/2004 | EP1432021A2 Manufacturing method for electronic component module and electromagnetically readable data carrier |
| 06/23/2004 | EP1432020A1 Apparatus for aligning and dispensing solder columns in an array |
| 06/23/2004 | EP1432016A2 A plating-rinse-plating process for fabricating copper interconnects |
| 06/23/2004 | EP1431413A2 Shielded system with a housing having a high atomic number metal coating applied by thermal spray technique |
| 06/23/2004 | EP1431242A2 Bonding method for flip-chip semiconductor device, mems device package and package method using the same |
| 06/23/2004 | EP1430833A1 Fingerprint sensor |
| 06/23/2004 | EP1430568A2 Metallic surface of a body, method for producing a structured metallic surface of a body and the use thereof |
| 06/23/2004 | EP1430551A1 Improved sealing for oled devices |
| 06/23/2004 | EP1430533A2 TEST STRUCTURES AND MODELS FOR ESTIMATING THE YIELD IMPACT OF DISHING AND/OR VOIDS |
| 06/23/2004 | EP1430532A2 Encapsulation of pin solder for maintaining accuracy in pin position |
| 06/23/2004 | EP1430531A2 Arrangement of vias in a substrate to support a ball grid array |
| 06/23/2004 | EP1430530A2 Heat exchanger |
| 06/23/2004 | EP1430529A2 Soldered heat sink anchor and method of use |
| 06/23/2004 | EP1430528A2 Arrangement to increase structural rigidity of a semiconductor package |
| 06/23/2004 | EP1430527A2 Multilayer thin film hydrogen getter |
| 06/23/2004 | EP1430526A1 Method for forming metal-metal oxide etch stop/ electromigration barrier for integrated circuit interconnects and device |
| 06/23/2004 | EP1430525A2 Dual-damascene interconnects without an etch stop layer by alternating ilds |
| 06/23/2004 | EP1430524A2 Method for contacting electrical contact surfaces of a substrate and device consisting of a substrate having electrical contact surfaces |
| 06/23/2004 | EP1430523A2 Method of forming a bond pad and structure thereof |
| 06/23/2004 | EP1430316A1 Test structures for estimating dishing and erosion effects in copper damascene technology |
| 06/23/2004 | EP1430167A2 Plating apparatus and method |
| 06/23/2004 | EP1430007A1 Brazeable matallizations for diamond components |
| 06/23/2004 | EP1406188A9 Semiconductor integrated circuit, method of manufacturing semiconductor integrated circuit, charge pump circuit, layout designing apparatus, and layout designing program |
| 06/23/2004 | EP1362489A4 Wireless local loop antenna |
| 06/23/2004 | CN2621342Y Integrated heat-sink module |
| 06/23/2004 | CN1507767A Electronic module including a cooling substrate and related methods |
| 06/23/2004 | CN1507671A 高频模块 High-frequency module |
| 06/23/2004 | CN1507661A Methods of fabricating nanostructures and nanowires and devices fabricated therefrom |
| 06/23/2004 | CN1507657A Semiconductor device and method for manufacturing same |
| 06/23/2004 | CN1507655A Ruthenium silicide wet etch |
| 06/23/2004 | CN1507653A Dielectric films for narrow gap-fill applications |
| 06/23/2004 | CN1507639A Capacitor having improved electrodes |
| 06/23/2004 | CN1507462A Resin composition for optical-semiconductor encapsulation |
| 06/23/2004 | CN1507150A Method for producing piezoelectric parts and piezoelectric parts |
| 06/23/2004 | CN1507067A Image sensing equipment and portable terminal |
| 06/23/2004 | CN1507059A Improved memory unit contact part |
| 06/23/2004 | CN1507055A Integrated circuit capacitor |
| 06/23/2004 | CN1507053A 半导体集成电路器件 The semiconductor integrated circuit device |
| 06/23/2004 | CN1507052A Semiconductor integrated circuit apparatus and method for producing semiconductor integrated circuit apparatus |
| 06/23/2004 | CN1507050A Semiconductor device with unloading circuit for removing defect part |
| 06/23/2004 | CN1507047A Alignment of metal wire with cap in multi-stage semiconductor structure and formation of interconnection |
| 06/23/2004 | CN1507046A High-density chip carrier and its constituent method |
| 06/23/2004 | CN1507045A Integrated circuit apparatus and semiconductor device including metal isolator-metal capacitor |
| 06/23/2004 | CN1507044A Structure and method for reducing thermal-mechanical stress in superposed through hole |
| 06/23/2004 | CN1507043A Resin packaging semiconductor device |
| 06/23/2004 | CN1507042A Semiconductor device |
| 06/23/2004 | CN1507041A Non-lead semiconductor packaging structure with inverse bonding chip and producing method |
| 06/23/2004 | CN1507040A Multidirectional liquid storage slot heat conducting apparatus and method |
| 06/23/2004 | CN1507039A Thermally driven heat exchanger |
| 06/23/2004 | CN1507038A Thermal transfer device and producing method thereof and electronic device |
| 06/23/2004 | CN1507037A Ball grid array semiconductor package |
| 06/23/2004 | CN1507027A Electrified estimating apparatus, producing method thereof and electrified estimating method |
| 06/23/2004 | CN1507023A Side welding method for flip-chip semiconductor device |
| 06/23/2004 | CN1507022A TAB tape carrier and producing method thereof |
| 06/23/2004 | CN1507020A Method for producing semiconductor device |
| 06/23/2004 | CN1507015A Method for producing low-dielectric constant material and chemical vapour phase deposition (CVD) |
| 06/23/2004 | CN1507012A Semiconductor device and method for producing semiconductor device |
| 06/23/2004 | CN1506768A Alignment system and method for photoetching system |
| 06/23/2004 | CN1506737A Method for producing array base plate with colour filter structure on thin film transistor for liquid crystal display device |
| 06/23/2004 | CN1506649A Heat-transfer apparatus and electronic apparatus |
| 06/23/2004 | CN1506648A Heat transfer device and electronic equipment |
| 06/23/2004 | CN1506188A Structure and method for leadless welding flux electronic packaging interconnection |
| 06/23/2004 | CN1155140C Socket for integrated circuit chip |
| 06/23/2004 | CN1155113C Light emitting display element, method for connecting same to electric wiring substrate and method of manufacturing same |
| 06/23/2004 | CN1155089C Integrated circuit chip, integrated circuit, printed-circuit board and electronic device |
| 06/23/2004 | CN1155088C Direct contact chips assembling |
| 06/23/2004 | CN1155087C Security integrated circuit apparatus and method for making same |
| 06/23/2004 | CN1155086C Chip assembly and manufacture of same |
| 06/23/2004 | CN1155085C Semiconductor lead frame assembly and method for mfg. semiconductor element |
| 06/23/2004 | CN1155084C Leading frame and manufacture thereof, semiconjductor device and manufacture thereof |
| 06/23/2004 | CN1155083C Electronic assembly and its producting method and its used lead wire frame |
| 06/23/2004 | CN1155082C Method and apparatus for radiating from integrated circuit |
| 06/23/2004 | CN1155081C Encapsulated circuit apparatus and encapsulating method |
| 06/23/2004 | CN1155080C Multi-strand substrate for ball-grid array assemblies and muonting method of assemblied members |
| 06/23/2004 | CN1155079C Semiconductor device and manufacturing method thereof, and reinforcing belt for manufacturing said semiconductor device |
| 06/23/2004 | CN1155075C Method for producing semiconductor device |
| 06/23/2004 | CN1155067C Method for producing semiconductor apparatus |
| 06/23/2004 | CN1155057C Method for forming copper conductor in electronic structure |
| 06/23/2004 | CN1155051C Method and apparatus for etching of protection unit |
| 06/23/2004 | CN1154420C Fan attachment clip for heat sink |
| 06/23/2004 | CA2438922A1 Technique for electrically interconnecting electrical signals between an electronic component and a multilayer signal routing device |