| Patents for H01L 23 - Details of semiconductor or other solid state devices (226,155) |
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| 06/24/2004 | US20040121611 Method of cutting semiconductor wafer and protective sheet used in the cutting method |
| 06/24/2004 | US20040121595 Method of forming a metal film, semiconductor device and wiring board |
| 06/24/2004 | US20040121587 Semiconductor device and method of fabricating the same |
| 06/24/2004 | US20040121577 Method for providing a dummy feature and structure thereof |
| 06/24/2004 | US20040121571 Semiconductor device and a method of manufacturing the same |
| 06/24/2004 | US20040121563 Method for fabricating encapsulated semiconductor components having conductive vias |
| 06/24/2004 | US20040121562 Method for manufacturing a semiconductor device having multiple laminated layers of different materials |
| 06/24/2004 | US20040121561 Method of forming electronic dies wherein each die has a layer of solid diamond |
| 06/24/2004 | US20040121556 Thinning techniques for wafer-to-wafer vertical stacks |
| 06/24/2004 | US20040121543 Method of manufacturing semiconductor device |
| 06/24/2004 | US20040121528 Electronic unit integrated into a flexible polymer body |
| 06/24/2004 | US20040121525 System with nano-scale conductor and nano-opening |
| 06/24/2004 | US20040121523 Matrix substrate, electronic apparatus, electro-optic apparatus, and electronic unit |
| 06/24/2004 | US20040121522 Metal redistribution layer traces in an integrated circuit die. |
| 06/24/2004 | US20040121521 Semiconductor dice having back side redistribution layer accessed using through-silicon vias, methods of fabrication and assemblies |
| 06/24/2004 | US20040121519 Method of balanced coefficient of thermal expansion for flip chip ball grid array |
| 06/24/2004 | US20040121518 Underfill and encapsulation of carrier substrate-mounted flip-chip components using stereolithography |
| 06/24/2004 | US20040121517 Placement tool for wafer scale caps |
| 06/24/2004 | US20040121516 Method for manufacturing semiconductor apparatus, and semiconductor apparatus and electric appliance |
| 06/24/2004 | US20040121511 Packaging of a microchip device-I |
| 06/24/2004 | US20040121501 Low dielectric constant interconnect insulator having fullerene additive |
| 06/24/2004 | US20040121497 Voltage contrast test structure |
| 06/24/2004 | US20040121493 Chip scale marker and method of calibrating marking position |
| 06/24/2004 | US20040121267 Method of fabricating lead-free solder bumps |
| 06/24/2004 | US20040121194 Shielded system with a housing having a high atomic number metal coating applied by thermal spray technique |
| 06/24/2004 | US20040121073 Particles have an ultrathin, conformal coating made using atomic layer deposition; useful as fillers for electronic packaging, sintering aid for ceramics or cermets, as supported catalysts, in drug delivery with magnetic field, as explosive |
| 06/24/2004 | US20040120827 Electro-osmotic pumps and micro-channels |
| 06/24/2004 | US20040120453 Methods and apparatus for X-ray image detector assemblies |
| 06/24/2004 | US20040120198 Method for providing bitline contacts in a memory cell array and a memory cell array having bitline contacts |
| 06/24/2004 | US20040120177 Interconnection structure and methods |
| 06/24/2004 | US20040120176 Multi-chip package for reducing parasitic load of pin |
| 06/24/2004 | US20040120128 Bga package with same power ballout assignment for wire bonding packaging and flip chip packaging |
| 06/24/2004 | US20040120127 Compact circuit module having high mounting accuracy and method of manufacturing the same |
| 06/24/2004 | US20040120121 Densely packed electronic assemblage with heat removing element |
| 06/24/2004 | US20040120119 Heat sink assembly including clip with pressing and operating members |
| 06/24/2004 | US20040120117 Electronic package with improved thermal performance |
| 06/24/2004 | US20040120116 Embedded heat pipe for a conduction cooled circuit card assembly |
| 06/24/2004 | US20040120115 Heat-dissipating assembly |
| 06/24/2004 | US20040120101 Anti-tampering enclosure for electronic circuitry |
| 06/24/2004 | US20040120097 Methods of forming metal-insulator-metal capacitors |
| 06/24/2004 | US20040120096 Electronic power module |
| 06/24/2004 | US20040120085 Semiconductor device with surge protection circuit |
| 06/24/2004 | US20040119574 Inductor for radio frequency integrated circuit |
| 06/24/2004 | US20040119565 High-frequency wiring board |
| 06/24/2004 | US20040119560 High frequency composite switch module |
| 06/24/2004 | US20040119173 Packages for semiconductor die |
| 06/24/2004 | US20040119172 integrated circuits(IC), comprising dies conected to electroconductive cores having dielectric coatings applied by plasma enhanced/chemical vapor deposition |
| 06/24/2004 | US20040119170 reduced chance of a short occurring between the conductive layers and the self-aligned contact |
| 06/24/2004 | US20040119169 three dimensional integrated circuit stacked structure; forms a part of a wireless communications device, such as a cellular telephone |
| 06/24/2004 | US20040119168 Packaged integrated circuit having wire bonds and method therefor |
| 06/24/2004 | US20040119167 Semiconductor device having an active region whose width varies |
| 06/24/2004 | US20040119166 Semiconductor device and method of manufacturing the same |
| 06/24/2004 | US20040119165 Multilayered integrated circuit with extraneous conductive traces |
| 06/24/2004 | US20040119164 Semiconductor device and its manufacturing method |
| 06/24/2004 | US20040119163 Method of making semiconductor devices using carbon nitride, a low-dielectric-constant hard mask and/or etch stop |
| 06/24/2004 | US20040119162 Semiconductor device and manufacturing method thereof |
| 06/24/2004 | US20040119161 Package for housing semiconductor chip, fabrication method thereof and semiconductor device |
| 06/24/2004 | US20040119159 Semiconductor device comprising ESD protection circuit for protecting circuit from being destructed by electrostatic discharge |
| 06/24/2004 | US20040119158 Thermally enhanced package for an integrated circuit |
| 06/24/2004 | US20040119157 Remote thermal vias for densely packed electrical assemblage |
| 06/24/2004 | US20040119156 Electronic circuit assembly having high contrast fiducial |
| 06/24/2004 | US20040119154 Flip chip fet device |
| 06/24/2004 | US20040119151 Pre-applied underfill |
| 06/24/2004 | US20040119150 reduces insertion loss and return loss |
| 06/24/2004 | US20040119149 Grounded embedded flip chip RF integrated circuit |
| 06/24/2004 | US20040119148 Semiconductor device package |
| 06/24/2004 | US20040119147 Apparatus and method for improving AC coupling on circuit boards |
| 06/24/2004 | US20040119146 Semiconductor device and method of manufacturing the same, circuit board, and electronic instrument |
| 06/24/2004 | US20040119144 Silicon building blocks in integrated circuit packaging |
| 06/24/2004 | US20040119140 RF passive circuit and RF amplifier with via-holes |
| 06/24/2004 | US20040119139 Semiconductor device having a redundancy function |
| 06/24/2004 | US20040119138 Method of forming a metal fuse on semiconductor devices |
| 06/24/2004 | US20040119118 Testable electrostatic discharge protection circuits |
| 06/24/2004 | US20040119103 Mosgated device with accumulated channel region and schottky contact |
| 06/24/2004 | US20040119098 Method for fabrication of semiconductor device |
| 06/24/2004 | US20040119097 Integrated chip package structure using organic substrate and method of manufacturing the same |
| 06/24/2004 | US20040119095 Magnetic shield for integrated circuit packaging |
| 06/24/2004 | US20040119089 Compression assembled electronic package having a plastic molded insulation ring |
| 06/24/2004 | US20040119088 surface roughness of the substrate is defined as a ratio between a substantial area and a projected area; polishing and wet-etching a backside surface of the substrate mechanically with using predetermined abrasive grains |
| 06/24/2004 | US20040119069 Method and apparatus for optical probing of integrated circuit operation |
| 06/24/2004 | US20040119065 Semiconductor device and semiconductor device data write method |
| 06/24/2004 | US20040118821 Chip scale marker and marking method |
| 06/24/2004 | US20040118696 electrolytically treating a copper or copper alloy substrate with a solution of phosphoric acid and a carboxylic acid, and electrodepositing tin or tin alloy; reduced tendency to form whiskers |
| 06/24/2004 | US20040118693 rotation of parallel wafers with laminar motion at constant speed; eliminates photolithographic definition steps |
| 06/24/2004 | US20040118692 Plating-rinse-plating process for fabricating copper interconnects |
| 06/24/2004 | US20040118599 Attaching flip chips to printed circuits; applying underfill to one zone; electrically heating |
| 06/24/2004 | US20040118584 Tool-less coupling assembly |
| 06/24/2004 | US20040118579 Flexible heat sink |
| 06/24/2004 | US20040118552 Heat-dissipating device |
| 06/24/2004 | US20040118551 Thermal interface material and methods for assembling and operating devices using such material |
| 06/24/2004 | US20040118550 Heatsink with multiple, selectable fin densities |
| 06/24/2004 | US20040118501 Heat transfer composite with anisotropic heat flow structure |
| 06/24/2004 | US20040118143 Modular sprayjet cooling system |
| 06/24/2004 | US20040118142 Methods and apparatus for thermal management of vehicle systems and components |
| 06/24/2004 | US20040118129 Thermoelectric cooling for microelectronic packages and dice |
| 06/24/2004 | DE10353599A1 Heat radiation structure for electronic controller, has heat transfer element to transmit heat generated by electronic component, to external actuator block |
| 06/24/2004 | DE10335622A1 Harzversiegelte Halbleiterbaugruppe The resin-sealed semiconductor device |
| 06/24/2004 | DE10323379A1 Integrated circuit has Hall probe structure arranged close to conducting track so Hall voltage dependent on measurement voltage can be measured depending on magnetic field caused by track current |
| 06/24/2004 | DE10318895B3 Cooling device for slow cooling of superconductive component e.g. HTS power transformer, has semi-permeable membrane for separation of liquid cooling medium and gaseous cooling medium |
| 06/24/2004 | DE10258035A1 Single-phase power converter module, e.g. automobile rectifier, has auxiliary element for inhibiting connector tilt about connecting vane longitudinal axis that can be separated after module assembly |