| Patents for H01L 23 - Details of semiconductor or other solid state devices (226,155) |
|---|
| 06/29/2004 | US6757659 Audio signal processing apparatus |
| 06/29/2004 | US6757475 Optical fiber arrays with precise hole sizing |
| 06/29/2004 | US6757181 Molded shield structures and method for their fabrication |
| 06/29/2004 | US6757178 Electronic circuit equipment using multilayer circuit board |
| 06/29/2004 | US6757176 Circuit board |
| 06/29/2004 | US6757170 Heat sink and package surface design |
| 06/29/2004 | US6757169 Electronic apparatus |
| 06/29/2004 | US6757155 Electronic circuit board case |
| 06/29/2004 | US6757152 Cascade capacitor |
| 06/29/2004 | US6756936 Microwave planar motion sensor |
| 06/29/2004 | US6756877 Shunt resistor configuration |
| 06/29/2004 | US6756804 Semiconductor integrated circuit device |
| 06/29/2004 | US6756803 Semiconductor device downsizing its built-in driver |
| 06/29/2004 | US6756796 Method of search and identify reference die |
| 06/29/2004 | US6756691 Semiconductor device with an improvement in alignment, and method of manufacturing the same |
| 06/29/2004 | US6756689 Power device having multi-chip package structure |
| 06/29/2004 | US6756688 Wiring board and its production method, semiconductor device and its production method, and electronic apparatus |
| 06/29/2004 | US6756687 Interfacial strengthening for electroless nickel immersion gold substrates |
| 06/29/2004 | US6756686 Semiconductor device |
| 06/29/2004 | US6756685 Connected electrodes of package substrate composed of a resin and electrodes of chip formed of silicon |
| 06/29/2004 | US6756683 High-frequency semiconductor device including a semiconductor chip |
| 06/29/2004 | US6756681 Radio frequency integrated circuit having increased substrate resistance enabling three dimensional interconnection with feedthroughs |
| 06/29/2004 | US6756680 Flip chip C4 extension structure and process |
| 06/29/2004 | US6756679 Semiconductor integrated circuit device and manufacturing method of semiconductor integrated circuit device |
| 06/29/2004 | US6756678 Conductive connection forming methods, oxidation reducing methods, and integrated circuits formed thereby |
| 06/29/2004 | US6756676 Semiconductor device and method of manufacturing the same |
| 06/29/2004 | US6756675 Semiconductor device and a method for making the same that provide arrangement of a connecting region for an external connecting terminal |
| 06/29/2004 | US6756674 Low dielectric constant silicon oxide-based dielectric layer for integrated circuit structures having improved compatibility with via filler materials, and method of making same |
| 06/29/2004 | US6756673 Low-loss coplanar waveguides and method of fabrication |
| 06/29/2004 | US6756672 Use of sic for preventing copper contamination of low-k dielectric layers |
| 06/29/2004 | US6756671 Microelectronic device with a redistribution layer having a step shaped portion and method of making the same |
| 06/29/2004 | US6756670 Electronic device and its manufacturing method |
| 06/29/2004 | US6756669 Microelectronic package for heat dissipation; notch between surfaces proximate to corner |
| 06/29/2004 | US6756668 Semiconductor package having thermal interface material (TIM) |
| 06/29/2004 | US6756667 Hermetically sealed semiconductor power module and large scale module comprising the same |
| 06/29/2004 | US6756666 Solder couplings connecting plurality of corner terminals; printed circuits |
| 06/29/2004 | US6756665 Integrated circuit package structure with heat dissipating design |
| 06/29/2004 | US6756664 Noise eliminating system on chip and method of making same |
| 06/29/2004 | US6756663 Semiconductor device including wiring board with three dimensional wiring pattern |
| 06/29/2004 | US6756662 Semiconductor chip module and method of manufacture of same |
| 06/29/2004 | US6756661 Semiconductor device, a semiconductor module loaded with said semiconductor device and a method of manufacturing said semiconductor device |
| 06/29/2004 | US6756660 Lead frame for a semiconductor device and a semiconductor device incorporating the lead frame |
| 06/29/2004 | US6756659 Die paddle clamping method for wire bond enhancement |
| 06/29/2004 | US6756658 Making two lead surface mounting high power microleadframe semiconductor packages |
| 06/29/2004 | US6756655 Fuse for a semiconductor configuration and method for its production |
| 06/29/2004 | US6756642 Integrated circuit having improved ESD protection |
| 06/29/2004 | US6756624 Encapsulated metal structures for semiconductor devices and MIM capacitors including the same |
| 06/29/2004 | US6756614 Thin film semiconductor device, polycrystalline semiconductor thin film production process and production apparatus |
| 06/29/2004 | US6756606 Apparatus and method for marking defective sections of laminate substrates |
| 06/29/2004 | US6756323 Method for fabricating an ultralow dielectric constant material as an intralevel or interlevel dielectric in a semiconductor device |
| 06/29/2004 | US6756305 Stacked dice bonded with aluminum posts |
| 06/29/2004 | US6756304 Method for producing via-connections in a substrate and substrate equipped with same |
| 06/29/2004 | US6756295 Chip structure and process for forming the same |
| 06/29/2004 | US6756294 Method for improving bump reliability for flip chip devices |
| 06/29/2004 | US6756282 Semiconductor device and method of fabricating the same |
| 06/29/2004 | US6756262 Semiconductor integrated circuit device having spaced-apart electrodes and the method thereof |
| 06/29/2004 | US6756256 Method for preventing burnt fuse pad from further electrical connection |
| 06/29/2004 | US6756255 CMOS process with an integrated, high performance, silicide agglomeration fuse |
| 06/29/2004 | US6756254 Metallizing circuit substrate; overcoating with dielectric; patterning; forming metal silicide |
| 06/29/2004 | US6756253 Method for fabricating a semiconductor component with external contact polymer support layer |
| 06/29/2004 | US6756252 Multilayer laser trim interconnect method |
| 06/29/2004 | US6756251 Method of manufacturing microelectronic devices, including methods of underfilling microelectronic components through an underfill aperture |
| 06/29/2004 | US6756244 Interconnect structure |
| 06/29/2004 | US6756138 Micro-electromechanical devices |
| 06/29/2004 | US6755242 Active heat sink structure with directed air flow |
| 06/29/2004 | US6755240 Cooling device for an electronic component and cooling system with such cooling devices |
| 06/29/2004 | US6755229 Method for preparing high performance ball grid array board and jig applicable to said method |
| 06/29/2004 | US6755069 Method and tooling for z-axis offset of lead frames |
| 06/29/2004 | US6754950 Electronic component and method of production thereof |
| 06/29/2004 | CA2252407C Flexible integrated circuit package |
| 06/24/2004 | WO2004054342A2 Method, system and apparatus for cooling high power density devices |
| 06/24/2004 | WO2004054340A1 Multilayer printed circuit board and method for manufacturing same |
| 06/24/2004 | WO2004054339A1 Method for supplying solder |
| 06/24/2004 | WO2004054089A1 Piezoelectric oscillator and production method thereof and portable phone device and electronic apparatus |
| 06/24/2004 | WO2004053988A1 Single-phase power converter module |
| 06/24/2004 | WO2004053987A1 High density package interconnect wire bond strip line and method therefor |
| 06/24/2004 | WO2004053986A1 High density package interconnect power and ground strap and method therefor |
| 06/24/2004 | WO2004053985A1 Leadless semiconductor packaging structure with inverted flip chip and methods of manufacture |
| 06/24/2004 | WO2004053984A1 Semiconductor element heat dissipating member, semiconductor device using same, and method for manufacturing same |
| 06/24/2004 | WO2004053983A1 Metal core substrate packaging |
| 06/24/2004 | WO2004053981A1 Method of cutting semiconductor wafer and protective sheet used in the cutting method |
| 06/24/2004 | WO2004053975A1 Chip-on-film and its methods of manufacturing by electro-forming |
| 06/24/2004 | WO2004053973A1 Method of packaging integrated circuits, and integrated circuit packages produced by the method |
| 06/24/2004 | WO2004053971A1 Copper alloy for wiring, semiconductor device, method for forming wiring and method for manufacturing semiconductor device |
| 06/24/2004 | WO2004053967A1 Semiconductor apparatus, wiring board forming method, and substrate treatment apparatus |
| 06/24/2004 | WO2004053944A2 Fast localization of electrical failures on an integrated circuit system and method |
| 06/24/2004 | WO2004053932A2 Inside-out heat sink |
| 06/24/2004 | WO2004053931A2 Package having exposed integrated circuit device |
| 06/24/2004 | WO2004053585A1 Thin film transistor substrate, method of manufacturing the same, liquid crystal display apparatus having the same and method of manufacturing the liquid crystal display apparatus |
| 06/24/2004 | WO2004053443A1 Thermal mismatch compensation technique for integrated circuit assemblies |
| 06/24/2004 | WO2004053412A1 Heat transport apparatus and heat transport apparatus manufacturing method |
| 06/24/2004 | WO2004053403A2 Method and system for cooling high power density devices |
| 06/24/2004 | WO2004053309A1 Liquid/coolant system including boiling sensor |
| 06/24/2004 | WO2004052642A1 CONDUCTIVE SHEET HAVING CONDUCTIVE LAYER ON Si-CONTAINING LAYER |
| 06/24/2004 | WO2004052547A2 Coated and magnetic particles and applications thereof |
| 06/24/2004 | WO2004023546A9 Methods of making microelectronic packages including folded substrates |
| 06/24/2004 | WO2003048981A3 Improving integrated circuit performance and reliability using a patterned bump layout on a power grid |
| 06/24/2004 | US20040122606 Adaptable heat dissipation device for a personal computer |
| 06/24/2004 | US20040121811 Radio frequency apparatus |
| 06/24/2004 | US20040121616 Method for bottomless deposition of barrier layers in integrated circuit metallization schemes |