| Patents for H01L 23 - Details of semiconductor or other solid state devices (226,155) |
|---|
| 07/01/2004 | US20040124502 Semiconductor wafer having identification indication |
| 07/01/2004 | US20040124501 Bonding metallic substrates; reducing thickness |
| 07/01/2004 | US20040124486 Image sensor adapted for reduced component chip scale packaging |
| 07/01/2004 | US20040124472 Electrostatic discharge (ESD) protection device |
| 07/01/2004 | US20040124471 Semiconductor device |
| 07/01/2004 | US20040124458 Programmable fuse device |
| 07/01/2004 | US20040124452 Reducing stress in integrated circuits |
| 07/01/2004 | US20040124438 Planarizers for spin etch planarization of electronic components and methods of use thereof |
| 07/01/2004 | US20040124437 Self-identifying integrated circuits and method for fabrication thereof |
| 07/01/2004 | US20040124417 Active matrix display device and manufacturing method thereof |
| 07/01/2004 | US20040124412 Misalignment test structure and method thereof |
| 07/01/2004 | US20040124411 Semiconductor device capable of preventing a pattern collapse |
| 07/01/2004 | US20040124340 Photoelectric leak current compensating circuit and optical signal circuit using same |
| 07/01/2004 | US20040124225 Apparatus for aligning and dispensing solder columns in an array |
| 07/01/2004 | US20040124171 [bump-forming process] |
| 07/01/2004 | US20040124089 Plating method and apparatus for controlling deposition on predetermined portions of a workpiece |
| 07/01/2004 | US20040124007 Circuit board, mounting structure for semiconductor device with bumps, and electro-optic device and electronic device |
| 07/01/2004 | US20040124006 Built up lands |
| 07/01/2004 | US20040124004 Decoupled signal-power substrate architecture |
| 07/01/2004 | US20040124002 Method and structures for enhanced temperature control of high power components on multilayer LTCC and LTCC-M boards |
| 07/01/2004 | US20040123981 Heat-dissicipating substrate |
| 07/01/2004 | US20040123978 Air-applying device having a case with an air inlet port, a cooling unit having the air-applying device, and an electronic apparatus having the air-applying device |
| 07/01/2004 | US20040123977 External attachable heat exchanger |
| 07/01/2004 | US20040123975 Device and method for removing heat from object by spraying cooling agent |
| 07/01/2004 | US20040123968 Apparatus, mold, and method for manufacturing metal-ceramic composite member |
| 07/01/2004 | US20040123456 Process for producing semiconductor device |
| 07/01/2004 | DE202004001331U1 Cooler as tangential bladed blower has submounted concave or convex surfaced base with inbuilt heat-exchange elements as cooling fingers to dissipate operating heat assisted by base surface shape. |
| 07/01/2004 | DE10360401A1 Liquid cooling system for electronic device, especially computer, has filler and overflow devices at essentially lowest and highest points, radiator additionally acting as equalization container |
| 07/01/2004 | DE10359430A1 Verfahren und Vorrichtung für Röntgenbilddetektoranordnungen Method and apparatus for X-ray detector arrays |
| 07/01/2004 | DE10356654A1 Removal of metal layers used in fabricating semiconductor device comprises removing metal layers with cleaning solution comprising acid solution and oxidation agent containing iodine |
| 07/01/2004 | DE10316355B3 Flexible spring-loaded outer contact system for semiconductor module carrying heavy load has housing with frame members at sides carrying contact points for contact springs |
| 07/01/2004 | DE10314616B3 Integrated switching network with test switch for measurement system has activation switch incorporating SR flip flop and inverters |
| 07/01/2004 | DE10314155B3 Terminal or output for flash storage memory with strap-shaped connector has U-section carrier with shallow upturned sides and flat bottom portion |
| 07/01/2004 | DE10260098A1 Elektrisch isolierende und wärmeleitfähige Polyesterformmassen Electrically insulating and thermally conductive polyester molding compositions of |
| 07/01/2004 | DE10255636A1 Circuit device with flip-flop that can operate in stand-by mode, for mobile telephone or PDA, has switching transistors connected between flip-flop and power switching transistor, with differing threshold voltages |
| 07/01/2004 | DE10249206B3 Verfahren zum Zusammenbau eines Leistungsbauelements A method of assembling a power device |
| 07/01/2004 | DE10050126B4 Kühlkörper für ein Bauelement und Verfahren zu dessen Herstellung Heat sink for a device and method for its production |
| 07/01/2004 | CA2507431A1 Single package multi-chip rf power amplifier |
| 06/30/2004 | EP1434474A2 Technique for electrically interconnecting electrical signals between an electronic component and a multilayer signal routing device |
| 06/30/2004 | EP1434276A2 Image sensor adapted for reduced component chip scale packaging |
| 06/30/2004 | EP1434266A1 Metal/ceramic bonding substrate and method for producing same |
| 06/30/2004 | EP1434265A1 Heat-conducting multilayer substrate and power module substrate |
| 06/30/2004 | EP1434264A2 Semiconductor device and manufacturing method using the transfer technique |
| 06/30/2004 | EP1434262A2 Semiconductor device manufactured by the transfer technique |
| 06/30/2004 | EP1433829A1 Thermally-formable and cross-linkable precursor of a thermally conductive material |
| 06/30/2004 | EP1433744A1 System with nano-scale conductor and nano-opening |
| 06/30/2004 | EP1433742A2 Electronic devices and production methods |
| 06/30/2004 | EP1433370A1 Power delivery connector for integrated circuits with capacitor |
| 06/30/2004 | EP1433369A1 Power delivery system for integrated circuits utilizing discrete capacitors |
| 06/30/2004 | EP1433368A1 Electronic circuit comprising conductive bridges and method for making such bridges |
| 06/30/2004 | EP1433208A1 Phonon-blocking, electron-transmitting low-dimensional structures |
| 06/30/2004 | EP1433204A2 Device with power semiconductor components for controlling the power of high currents and use of said device |
| 06/30/2004 | EP1433203A2 Method of producing a contact system on the rear of a component with stacked substrates and a component equipped with one such contact system |
| 06/30/2004 | EP1433202A2 Integration of barrier layer and seed layer |
| 06/30/2004 | EP1432840A2 Discontinuous carbon fiber reinforced metal matrix composite |
| 06/30/2004 | EP1432774A1 Adhesive sheet of cross-linked silicone, method of manufacturing thereof and device comprising the sheet |
| 06/30/2004 | EP1432664A2 Self-constrained low temperature glass-ceramic unfired tape for microelectronics and methods for making and using the same |
| 06/30/2004 | EP1432528A2 Method for edge sealing barrier films |
| 06/30/2004 | EP1158578B1 Integrated circuit or circuit board with bump electrode and manufacturing method thereof |
| 06/30/2004 | EP1114445A4 Electronic device with a thermal control capability |
| 06/30/2004 | EP0815615B1 A package housing multiple semiconductor dies |
| 06/30/2004 | CN2622866Y Air-liquid integrated radiator of CPU |
| 06/30/2004 | CN2622865Y Plate thermotube structure with support |
| 06/30/2004 | CN2622864Y Thermotube radiator |
| 06/30/2004 | CN2622863Y Spacing structure of radiating fin |
| 06/30/2004 | CN2622862Y Radiator fastening |
| 06/30/2004 | CN2622861Y Improved device of radiation modular |
| 06/30/2004 | CN1509516A Portable electronic device with enhanced battery life and cooling |
| 06/30/2004 | CN1509500A Heat dissipation device having load centering mechanism |
| 06/30/2004 | CN1509499A Substrate for use in joining element |
| 06/30/2004 | CN1509136A Micro welded pad gap organic circuit board with electroplating soldering tin |
| 06/30/2004 | CN1509134A Method for producing circuit device, circuit moudle and method for producing circuit devicd |
| 06/30/2004 | CN1509061A Camera moudle |
| 06/30/2004 | CN1508968A Electronic element and its manufacturing method |
| 06/30/2004 | CN1508928A Semiconductor device fitted with impulse-voltage protection circuit |
| 06/30/2004 | CN1508912A Joint disc grid-array package-piece socket |
| 06/30/2004 | CN1508904A High-frequency assembly and method for providing through-hole in high-frequency assembly |
| 06/30/2004 | CN1508869A Copper depression technology applied to selective top and chemical cladding material |
| 06/30/2004 | CN1508868A Semiconductor device and its manufacturing method |
| 06/30/2004 | CN1508867A Cooling device for cooling two sides of semiconductor device |
| 06/30/2004 | CN1508866A Radiator |
| 06/30/2004 | CN1508865A Radiating fins |
| 06/30/2004 | CN1508864A Chip Packaging board |
| 06/30/2004 | CN1508863A High-performance base board structure |
| 06/30/2004 | CN1508844A Method for manufacturing semiconductor device, semeconductor device and electronic product |
| 06/30/2004 | CN1508649A Method and apparatus for intensifying cooling ability of lap computer |
| 06/30/2004 | CN1508615A Electronic device and its making method, spattering target |
| 06/30/2004 | CN1508286A Metal film formation method, semiconductor device and wiring substrate board |
| 06/30/2004 | CN1508210A Solidifiable resin composition for packing electronic equipment |
| 06/30/2004 | CN1156203C Printed circuit boards for mounting semiconductor integrated circuit die |
| 06/30/2004 | CN1156029C Wavelength conversion pouring material, its use and manufacturing method |
| 06/30/2004 | CN1156006C Circuit assembly with at least one nanoelectronic component and method for producing same |
| 06/30/2004 | CN1156003C Assembly structure |
| 06/30/2004 | CN1156002C Carrier element for semiconductor chips |
| 06/30/2004 | CN1156001C Package structure for integrated circuit |
| 06/30/2004 | CN1155997C Anisotropic conductor film, semiconductor chip, and method of packaging |
| 06/30/2004 | CN1155996C Method of manufacturing semiconductor device suitable for surface mounting |
| 06/30/2004 | CN1155909C System for providing an integrated circuit with unique identification code and method |
| 06/30/2004 | CN1155655C Epoxy resin composition |
| 06/30/2004 | CN1155450C Method employing UV laser pulses of varied energy density to form blind vias in multilayered targets |