| Patents for H01L 23 - Details of semiconductor or other solid state devices (226,155) |
|---|
| 07/01/2004 | WO2004055824A2 Method and device for protection of an mram device against tampering |
| 07/01/2004 | WO2004055823A2 Hardware security device for magnetic memory cells |
| 07/01/2004 | WO2004055657A1 Device for radiating heat in cpu in computer |
| 07/01/2004 | WO2004055656A1 Cpu cooler |
| 07/01/2004 | WO2004055534A1 Self-marking device for an integrated circuit, and associated housed integrated circuit |
| 07/01/2004 | WO2004036654A3 Integrated circuit package configuration incorporating shielded circuit element |
| 07/01/2004 | WO2004034466A3 Heat spreader |
| 07/01/2004 | WO2004032205A3 Current-carrying electronic component and method of manufacturing same |
| 07/01/2004 | WO2004030040A3 Method and apparatus for shielding an integrated circuit from radiation |
| 07/01/2004 | WO2004010749A3 Interconnection system |
| 07/01/2004 | WO2003104958A3 Method and apparatus for cooling a circuit component |
| 07/01/2004 | WO2003085719A3 Process for making air gap containing semiconducting devices and resulting semiconducting device |
| 07/01/2004 | WO2003079407A3 Wafer-level coated copper stud bumps |
| 07/01/2004 | US20040128636 Semiconductor device, semiconductor device design method, semiconductor device design method recording medium, and semiconductor device design support system |
| 07/01/2004 | US20040127697 arylisothiocyanate compounds useful for activating alcohol-containing macromolecules, for example polyethyleneglycols and cellulose, for covalent linkage to amino-groups of biomolecules such as antibodies, enzymes, and proteins |
| 07/01/2004 | US20040127374 Composition and method for removing copper-compatible resist |
| 07/01/2004 | US20040127075 Socket |
| 07/01/2004 | US20040127036 Semiconductor device with electrically coupled spiral inductors |
| 07/01/2004 | US20040127023 Method for forming a contact using a dual damascene process in semiconductor fabrication |
| 07/01/2004 | US20040127010 Bumping process |
| 07/01/2004 | US20040127009 Bumping process |
| 07/01/2004 | US20040127001 Robust ultra-low k interconnect structures using bridge-then-metallization fabrication sequence |
| 07/01/2004 | US20040126997 Method for fabricating copper damascene structures in porous dielectric materials |
| 07/01/2004 | US20040126994 Method of forming a multi-layer semiconductor structure having a seamless bonding interface |
| 07/01/2004 | US20040126984 Method of fabricating a metal-insulator-metal capacitor |
| 07/01/2004 | US20040126962 [method of fabricating shallow trench isolation] |
| 07/01/2004 | US20040126957 Microelectronic process and structure |
| 07/01/2004 | US20040126933 Semiconductor assembly encapsulation mold |
| 07/01/2004 | US20040126932 Semiconductor device |
| 07/01/2004 | US20040126931 Chip on board and heat sink attachment methods |
| 07/01/2004 | US20040126927 Method of assembling chips |
| 07/01/2004 | US20040126926 Semiconductor device and method for fabricating the same |
| 07/01/2004 | US20040126910 Method for manufacturing a stack arrangement of a memory module |
| 07/01/2004 | US20040126608 Electronic device, method of manufacture of the same, and sputtering target |
| 07/01/2004 | US20040126598 Aluminum nitride sintered body and substrate for electronic devices |
| 07/01/2004 | US20040126586 product of Diels Alder and phenyl acetylene cure reactions, e.g., 3,3'-(oxydi-1,4-phenylene)bis(2,4,5-triphenylcyclopentadienone) and 1,3,5-tris (phenylethynyl)benzene; integrated circuits |
| 07/01/2004 | US20040126269 Solder for use on surfaces coated with nickel by electroless plating |
| 07/01/2004 | US20040126268 Electronic device having external terminals with lead-free metal thin film formed on the surface thereof |
| 07/01/2004 | US20040125582 Device for controlling a vehicle |
| 07/01/2004 | US20040125579 Semiconductor module |
| 07/01/2004 | US20040125578 Semiconductor module |
| 07/01/2004 | US20040125577 Low loss, high density array interconnection |
| 07/01/2004 | US20040125574 Multi-chip semiconductor package and method for manufacturing the same |
| 07/01/2004 | US20040125572 Mechanical cooling fin for interconnects |
| 07/01/2004 | US20040125570 System for loading a heat sink mechanism independently of clamping load on electrical device |
| 07/01/2004 | US20040125569 Easily removed heatsink clip |
| 07/01/2004 | US20040125568 Thermal enhance package and manufacturing method thereof |
| 07/01/2004 | US20040125567 Heat sink clip with pivoting locking portions |
| 07/01/2004 | US20040125566 Heat sink assembly with fixing mechanism |
| 07/01/2004 | US20040125565 Thermal interface material |
| 07/01/2004 | US20040125564 Method and apparatus for protecting thermal interfaces |
| 07/01/2004 | US20040125563 Coating for a heat dissipation device and a method of fabrication |
| 07/01/2004 | US20040125562 Parallel heat exchanger for a component in a mobile system |
| 07/01/2004 | US20040125561 Sealed and pressurized liquid cooling system for microprocessor |
| 07/01/2004 | US20040125529 Power module |
| 07/01/2004 | US20040125525 Cooling device and apparatus and method for making the same |
| 07/01/2004 | US20040125520 Electrostatic discharge protection for electrostatically actuated microrelays |
| 07/01/2004 | US20040125516 Assembly of ICs with blocking capacitors and printed circuit boards |
| 07/01/2004 | US20040125280 Method for fabricating array substrate having color filter on thin film transistor structure for liquid crystal display device |
| 07/01/2004 | US20040124956 Low-loss coplanar waveguides |
| 07/01/2004 | US20040124942 Transmission line and semiconductor integrated circuit device |
| 07/01/2004 | US20040124867 Tfi probe i/o wrap test method |
| 07/01/2004 | US20040124865 Method and structure for wafer-level reliability electromigration and stress migration test by isothermal heater |
| 07/01/2004 | US20040124547 Semiconductor device and method of manufacturing the same |
| 07/01/2004 | US20040124546 Reliable integrated circuit and package |
| 07/01/2004 | US20040124545 High density integrated circuits and the method of packaging the same |
| 07/01/2004 | US20040124544 Adhesive film for semiconductor, lead frame and semiconductor device using the same, and method of producing semiconductor device |
| 07/01/2004 | US20040124543 Low stress semiconductor die attach |
| 07/01/2004 | US20040124542 Semiconductor device and method for manufacturing the same |
| 07/01/2004 | US20040124541 Flip chip package |
| 07/01/2004 | US20040124540 [flip chip package structure] |
| 07/01/2004 | US20040124539 Multi-chip stack flip-chip package |
| 07/01/2004 | US20040124538 Multi-layer integrated semiconductor structure |
| 07/01/2004 | US20040124537 Semiconductor device having a multilayer interconnection structure and fabrication process thereof |
| 07/01/2004 | US20040124536 Semiconductor device |
| 07/01/2004 | US20040124535 Substrate with stacked vias and fine circuits thereon, and method for fabricating the same |
| 07/01/2004 | US20040124534 Multi-layer interconnect |
| 07/01/2004 | US20040124533 Method of semi-additive plating of imprinted layers and resulting product |
| 07/01/2004 | US20040124531 Copper diffusion barriers |
| 07/01/2004 | US20040124529 Semiconductor device and method of fabrication the same, circuit board, together with electronic instrument |
| 07/01/2004 | US20040124528 Metal line structures in semiconductor devices and methods of forming the same |
| 07/01/2004 | US20040124527 Folded BGA package design with shortened communication paths and more electrical routing flexibility |
| 07/01/2004 | US20040124526 Gel thermal interface materials comprising fillers having low melting point and electronic packages comprising these gel thermal interface materials |
| 07/01/2004 | US20040124525 Chip cooling |
| 07/01/2004 | US20040124524 Shielding device for integrated circuits |
| 07/01/2004 | US20040124523 Semiconductor devices including peripherally located bond pads, intermediates thereof, assemblies, and packages including the semiconductor devices, and support elements for the semiconductor devices |
| 07/01/2004 | US20040124522 Pin-assignment method for integrated circuit packages to increase the electro-static discharge protective capability |
| 07/01/2004 | US20040124521 Termination ring for integrated circuit |
| 07/01/2004 | US20040124520 Stacked electronic structures including offset substrates |
| 07/01/2004 | US20040124517 Structural reinforcement for electronic substrate |
| 07/01/2004 | US20040124516 Circuit device, circuit module, and method for manufacturing circuit device |
| 07/01/2004 | US20040124515 [chip package structure and method for manufacturing the same] |
| 07/01/2004 | US20040124514 Surface mount chip package |
| 07/01/2004 | US20040124513 High-density multichip module package |
| 07/01/2004 | US20040124512 Thermal enhance MCM package |
| 07/01/2004 | US20040124510 On die voltage regulator |
| 07/01/2004 | US20040124509 Method and structure for vertically-stacked device contact |
| 07/01/2004 | US20040124508 High performance chip scale leadframe package and method of manufacturing the package |
| 07/01/2004 | US20040124506 Semiconductor device and a method of manufacturing the same |
| 07/01/2004 | US20040124505 Semiconductor device package with leadframe-to-plastic lock |