| Patents for H01L 23 - Details of semiconductor or other solid state devices (226,155) |
|---|
| 07/07/2004 | CN1156978C Solid-state relay |
| 07/07/2004 | CN1156910C Lead frame, semiconductor device using the lead frame and method of manufacturing the same |
| 07/07/2004 | CN1156909C Method and device for inteconnect radio frequency power SiC field effect transistors |
| 07/07/2004 | CN1156908C Auxiliary fixer of heat sink |
| 07/07/2004 | CN1156906C Film spherical grid array type semiconductor packaye structure and its making method |
| 07/07/2004 | CN1156903C Manufacture of semiconductor device |
| 07/07/2004 | CN1156902C Improved integrated multi-layer test pads and methods therefor |
| 07/07/2004 | CN1156901C Fixing clamp, distribution board and electronic component assembly and making method thereof |
| 07/07/2004 | CN1156891C Method for integrated substrate contact on insulator slicon chip with shallow ridges insulation technology |
| 07/07/2004 | CN1156862C Lead terminal and electronic device including terminal |
| 07/07/2004 | CN1156613C Process of controlling grain growth in metal films |
| 07/07/2004 | CN1156533C Resin composition for sealing semiconductor, and semiconductor using its and manufacturing method |
| 07/06/2004 | US6760901 Trough adjusted optical proximity correction for dual damascene vias which takes into account the topography on a wafer created by prior wafer processing operations |
| 07/06/2004 | US6760472 Identification method for an article using crystal defects |
| 07/06/2004 | US6760227 Multilayer ceramic electronic component and manufacturing method thereof |
| 07/06/2004 | US6760224 Heat sink with alignment and retaining features |
| 07/06/2004 | US6760222 Dissipating heat using a heat conduit |
| 07/06/2004 | US6760221 Evaporator with air cooling backup |
| 07/06/2004 | US6759937 On-chip differential multi-layer inductor |
| 07/06/2004 | US6759921 Characteristic impedance equalizer and an integrated circuit package employing the same |
| 07/06/2004 | US6759917 Method and apparatus for adjusting impedance of matching circuit |
| 07/06/2004 | US6759904 Large gain range, high linearity, low noise MOS VGA |
| 07/06/2004 | US6759863 Wireless radio frequency technique design and method for testing of integrated circuits and wafers |
| 07/06/2004 | US6759768 Repeater methods for constrained pitch wire buses on integrated circuits |
| 07/06/2004 | US6759753 Multi-chip package |
| 07/06/2004 | US6759752 Single unit automated assembly of flex enhanced ball grid array packages |
| 07/06/2004 | US6759747 Semiconductor device having damascene interconnection structure that prevents void formation between interconnections |
| 07/06/2004 | US6759746 Die attachment and method |
| 07/06/2004 | US6759745 Further miniaturize the semiconductor package by limiting the amount of the fillet spread out around the semiconductor chip |
| 07/06/2004 | US6759744 Electronic circuit unit suitable for miniaturization |
| 07/06/2004 | US6759743 Thick film millimeter wave transceiver module |
| 07/06/2004 | US6759742 Interchangeable bond-wire interconnects |
| 07/06/2004 | US6759740 Insulating layers of alumina ceramics and dielectric layers of ceramics laminated as a unitary structure, and conductor layers of au, ag, cu and pt are formed on the surfaces and inside of the composite ceramic board |
| 07/06/2004 | US6759739 Multilayered substrate for semiconductor device |
| 07/06/2004 | US6759738 Systems interconnected by bumps of joining material |
| 07/06/2004 | US6759737 Semiconductor package including stacked chips with aligned input/output pads |
| 07/06/2004 | US6759736 Semiconductor device comprising a security coating and smartcard provided with such a device |
| 07/06/2004 | US6759735 High power semiconductor device having semiconductor chips |
| 07/06/2004 | US6759732 Semiconductor device with circuit cell array and arrangement on a semiconductor chip |
| 07/06/2004 | US6759722 Semiconductor device and method of manufacturing the same |
| 07/06/2004 | US6759720 Semiconductor device with transfer gate having gate insulating film and gate electrode layer |
| 07/06/2004 | US6759716 Input/output protection device for a semiconductor integrated circuit |
| 07/06/2004 | US6759714 Semiconductor device having heat release structure using SOI substrate and fabrication method thereof |
| 07/06/2004 | US6759703 Capacitor and a manufacturing process therefor |
| 07/06/2004 | US6759692 Gate driver with level shift circuit |
| 07/06/2004 | US6759691 ESD protection circuit having a high triggering threshold |
| 07/06/2004 | US6759668 Photoconductive switch module and manufacturing method thereof |
| 07/06/2004 | US6759667 Photocoupling device and method of manufacturing the same |
| 07/06/2004 | US6759599 Having thick-film fine wiring patterns, and a miniature high-performance high-output module |
| 07/06/2004 | US6759597 Wire bonding to dual metal covered pad surfaces |
| 07/06/2004 | US6759590 Hermetically sealed micro-device package with window |
| 07/06/2004 | US6759333 Semiconductor device and method of manufacturing the same |
| 07/06/2004 | US6759332 Method for producing dual damascene interconnections and structure produced thereby |
| 07/06/2004 | US6759329 Internal circuit structure of semiconductor chip with array-type bonding pads and method of fabricating the same |
| 07/06/2004 | US6759326 Method of making a semiconductor device having a planarized fluoropolymer passivating layer with selectively implanted charged particles |
| 07/06/2004 | US6759325 Sealing porous structures |
| 07/06/2004 | US6759321 Stabilization of fluorine-containing low-k dielectrics in a metal/insulator wiring structure by ultraviolet irradiation |
| 07/06/2004 | US6759318 Translation pad flip chip (TPFC) method for improving micro bump pitch IC substrate structure and manufacturing process |
| 07/06/2004 | US6759316 Method of manufacturing a semiconductor chip |
| 07/06/2004 | US6759311 Fan out of interconnect elements attached to semiconductor wafer |
| 07/06/2004 | US6759307 Method to prevent die attach adhesive contamination in stacked chips |
| 07/06/2004 | US6759295 Method of determining the active region width between shallow trench isolation structures using a gate current measurement technique for fabricating a flash memory semiconductor device and device thereby formed |
| 07/06/2004 | US6759290 Metal/polysilicon oxide nitride oxide silicon (monos) memory arrays with reduced bit line resistance |
| 07/06/2004 | US6759282 Method and structure for buried circuits and devices |
| 07/06/2004 | US6759279 Method of manufacturing semiconductor device having resin sealing body |
| 07/06/2004 | US6759278 Method for surface mounted power transistor with heat sink |
| 07/06/2004 | US6759277 Crystalline silicon die array and method for assembling crystalline silicon sheets onto substrates |
| 07/06/2004 | US6759275 Method for making high-performance RF integrated circuits |
| 07/06/2004 | US6759272 Semiconductor device and manufacturing method thereof |
| 07/06/2004 | US6759271 Flip chip type semiconductor device and method of manufacturing the same |
| 07/06/2004 | US6759270 Semiconductor chip module and method of manufacture of same |
| 07/06/2004 | US6759269 Method for fabricating Al-Si alloy packaging material |
| 07/06/2004 | US6759266 Quick sealing glass-lidded package fabrication method |
| 07/06/2004 | US6759257 Structure and method for embedding capacitors in z-connected multi-chip modules |
| 07/06/2004 | US6759253 Process monitoring methods in a plasma processing apparatus, monitoring units, and a sample processing method using the monitoring units |
| 07/06/2004 | US6759248 Semiconductor wafer identification |
| 07/06/2004 | US6759180 Method of fabricating sub-lithographic sized line and space patterns for nano-imprinting lithography |
| 07/06/2004 | US6759173 Single mask process for patterning microchip having grayscale and micromachined features |
| 07/06/2004 | US6759115 Multilayer circuit component and method for manufacturing the same |
| 07/06/2004 | US6758926 Method for producing multilayer ceramic substrate |
| 07/06/2004 | US6758920 Copper, silver alloy |
| 07/06/2004 | US6758692 Heat sink assembly having retention module |
| 07/06/2004 | US6758684 IC socket |
| 07/06/2004 | US6758387 Electroplating difficult to solder material with easier to solder one; hot dipping; applying ultrasonic waves; adhesion to plated portions |
| 07/06/2004 | US6758264 Heat sink and its manufacturing method |
| 07/06/2004 | US6758263 Heat dissipating component using high conducting inserts |
| 07/06/2004 | US6758262 Heat sink, method for manufacturing same, and pressing jig |
| 07/06/2004 | US6757968 Chip scale packaging on CTE matched printed wiring boards |
| 07/06/2004 | US6757967 Method of forming a chip assembly |
| 07/01/2004 | WO2004056162A1 Flip-chip mounting electronic component and method for producing the same, circuit board and method for producing the same, method for producing package |
| 07/01/2004 | WO2004055979A1 Single package multi-chip rf power amplifier |
| 07/01/2004 | WO2004055918A2 Tamper-resistant packaging and approach |
| 07/01/2004 | WO2004055895A1 Integrated circuit assembly |
| 07/01/2004 | WO2004055894A1 Integrated semiconductor module comprising an identification region |
| 07/01/2004 | WO2004055893A1 Poly-silicon stringer fuse |
| 07/01/2004 | WO2004055891A1 Semiconductor device and stacked semiconductor device |
| 07/01/2004 | WO2004055890A1 Method and apparatus for electrostatically aligning integrated circuits |
| 07/01/2004 | WO2004055889A1 Miniature moldlocks for heatsink or flag for an overmolded plastic package |
| 07/01/2004 | WO2004055888A1 Magnetic memory device |
| 07/01/2004 | WO2004055839A1 A planar inductive component and an integrated circuit comprising a planar inductive component |