| Patents for H01L 23 - Details of semiconductor or other solid state devices (226,155) |
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| 07/08/2004 | US20040130013 Electronic parts packaging structure and method of manufacturing the same |
| 07/08/2004 | US20040130012 uses a contact system in which the ends of the contact elements of the integrated circuit and substrate are not firmly connected to one another, but are placed one on top of the other, while being under a specific pressure |
| 07/08/2004 | US20040130011 a semiconductor device that includes a lead frame including a source pad, source lead rails at a periphery of the source pad, a gate pad adjacent to the source pad, and a gate lead rail at a periphery of the gate pad |
| 07/08/2004 | US20040130010 Method for fabricating semiconductor component with multi layered leadframe |
| 07/08/2004 | US20040130009 Method for maintaining solder thickness in flipchip attach packaging processes |
| 07/08/2004 | US20040130008 Microelectronic component assemblies and microelectronic component lead frame structures |
| 07/08/2004 | US20040130007 Flat lead package for a semiconductor device |
| 07/08/2004 | US20040130004 Semiconductor device whose semiconductor chip has chamfered backside surface edges and method of manufacturing the same |
| 07/08/2004 | US20040130001 arranging a plurality of dice in a semiconductor wafer such that there is a separation region between each neighboring die of the semiconductor wafer; trenches are etched in the separation region of the wafer, which is then fractured into pieces |
| 07/08/2004 | US20040129999 Semiconductor device and method of manufacturing the same |
| 07/08/2004 | US20040129980 Semiconductor device with resistor element |
| 07/08/2004 | US20040129977 SOI substrate and semiconductor integrated circuit device |
| 07/08/2004 | US20040129974 System with meshed power and signal buses on cell array |
| 07/08/2004 | US20040129966 Metal-metal capacitor array |
| 07/08/2004 | US20040129961 ferroelectric film comprises ferroelectric layered superlattice comprising strontium bismuth tantalate or strontium bismuth tantalum niobate; large surface area; vapor depositing conformal top electrode layer |
| 07/08/2004 | US20040129955 Bowtie and T-shaped structures of L-shaped mesh implementation |
| 07/08/2004 | US20040129950 Integrated circuit |
| 07/08/2004 | US20040129946 Light emission apparatus |
| 07/08/2004 | US20040129940 Semiconductor wafer and a methd for manufacturing a semiconductor wafer |
| 07/08/2004 | US20040129939 Stacked type semiconductor device |
| 07/08/2004 | US20040129938 Multi-functional structure for enhanced chip manufacturibility & reliability for low k dielectrics semiconductors and a crackstop integrity screen and monitor |
| 07/08/2004 | US20040129900 Device inspection |
| 07/08/2004 | US20040129882 Thermal infrared detector and infrared image sensor using the same |
| 07/08/2004 | US20040129454 Circuit board made of resin with pin |
| 07/08/2004 | US20040129452 Multi-strand substrate for ball-grid array assemblies and method |
| 07/08/2004 | US20040129441 Cooled externally modulated laser for transmitter optical subassembly |
| 07/08/2004 | US20040129409 Omnidirectional fan-heatsinks |
| 07/08/2004 | US20040129344 Semiconductor device with solder bumps with fewer occurrences of voids and cracks |
| 07/08/2004 | US20040128830 Mapable tape apply for LOC and BOC packages |
| 07/08/2004 | US20040128829 Circuit board, method of manufacturing the same, transfer chip, transfer source subtrate, electro-optical device, and electronic apparatus |
| 07/08/2004 | DE4444584B4 Halbleiterwafer zum Durchführen eines Burn-In-Tests Semiconductor wafers for performing a burn-in tests |
| 07/08/2004 | DE19639247B4 Halbleiteranordnung mit einem Verdrahtungssubstrat A semiconductor device comprising a wiring substrate |
| 07/08/2004 | DE19608484B4 Bei niedriger Temperatur gebranntes Keramik-Schaltungssubstrat At low temperature-fired ceramic circuit substrate |
| 07/08/2004 | DE19547798B4 Verfahren zur Herstellung von Wolfram-Kupfer-Mischoxiden A process for the production of tungsten-copper composite oxides |
| 07/08/2004 | DE19547797B4 Verfahren zur Herstellung von Wolfram-Kupfer-Mischoxiden A process for the production of tungsten-copper composite oxides |
| 07/08/2004 | DE10360895A1 Polymer compositions useful as electronics encapsulants contain a toughener in a composition otherwise comprising a polycyanurate matrix and filler |
| 07/08/2004 | DE10352653A1 Semiconducting component with cooling plate, has filter element for preventing noise emissions in conducting layer associated with at least one of semiconducting component's electrodes |
| 07/08/2004 | DE10319541A1 Semiconducting device, especially substrate- or circuit board-free re-wiring device on chip or chip scale package, has re-wiring device attached to first chip surface and corresponding bearer surface |
| 07/08/2004 | DE10260851A1 Manufacture of heat sink for power device in motor vehicle electronic control device, by using thermally conductive adhesive to adhere heat sink to baseplate after soldering power device to its surface |
| 07/08/2004 | DE10260646A1 Housing for semiconducting components has base surface essentially in form of triangle and housing essentially in form of triangular prism; all lateral surfaces can have connecting elements |
| 07/08/2004 | DE10260033A1 Fan-free heatsink/cooler for e.g. microprocessor, combines multi-part heat sink plates, liquid coolers and/or cooling walls with heat dissipating plates |
| 07/08/2004 | DE10258511A1 Integrierte Schaltung sowie zugehörige gehäuste integrierte Schaltung Integrated circuit and associated packaged integrated circuit |
| 07/08/2004 | DE10258478A1 Top-bottom ball grid array package for a micro-system construction kit, has metal top and bottom parts with electric wiring/connection structures |
| 07/08/2004 | DE10258094A1 Wafer structure method for creating three-dimensional structures on wafers in the form of bumps spread on each wafer, with each bump linked electrically to a bond pad via a reroute layer |
| 07/08/2004 | DE10258081A1 Production of a solder stop arrangement for forming three-dimensional structures on wafers comprises depositing a seed layer on a wafer having a coating made from an organic material which leaves open the tip of the structure |
| 07/08/2004 | DE10255378A1 Teststruktur zum Bestimmen der Stabilität elektronischer Vorrichtungen die miteinander verbundene Substrate umfassen For determining the stability of electronic devices include test structure, the substrates interconnected |
| 07/08/2004 | DE10222964B4 Verfahren zur Gehäusebildung bei elektronischen Bauteilen sowie so hermetisch verkapselte elektronische Bauteile A method for encasing for electronic components and so hermetically encapsulated electronic components |
| 07/08/2004 | DE10054962B4 Leistungsmodul Power module |
| 07/07/2004 | EP1435661A2 Thin film transistor with protective cap over flexible substrate, electronic device using the same, and manufacturing method thereof |
| 07/07/2004 | EP1435659A1 Partially populated ball grid design to accomodate landing pads close to the die |
| 07/07/2004 | EP1435658A1 Substrate and method for producing the same |
| 07/07/2004 | EP1435651A2 Process for the constrained sintering of asymetrically configured dielectric layers |
| 07/07/2004 | EP1435112A2 Method of manufacturing a semiconductor device and semiconductor device |
| 07/07/2004 | EP1434750A2 Thick film conductor compositions for use on aluminum nitride substrates |
| 07/07/2004 | EP1043774B1 Semiconductor integrated circuit |
| 07/07/2004 | EP1030349B1 Method and apparatus for treating electronic components mounted on a substrate, in particular semiconductor chips |
| 07/07/2004 | EP0855089B1 Solderable transistor clip and heat sink |
| 07/07/2004 | CN2624590Y Structure capable of blocking the flooding of thermal interface material |
| 07/07/2004 | CN2624589Y Protecting cover structure capable of protecting circuit board and wafer |
| 07/07/2004 | CN2624407Y Fragrant heat-sinking fan |
| 07/07/2004 | CN2624406Y 散热器 Heat sink |
| 07/07/2004 | CN2624405Y 散热器 Heat sink |
| 07/07/2004 | CN2624404Y A novel radiating fin structure |
| 07/07/2004 | CN2624403Y Semiconductor device radiator capable of combined using |
| 07/07/2004 | CN2624402Y Heat radiating fin |
| 07/07/2004 | CN2624401Y Heat radiating fin |
| 07/07/2004 | CN2624400Y Inclined riveted construction of radiating fin and baseboard |
| 07/07/2004 | CN2624399Y Heat radiation module structure in electronic installation |
| 07/07/2004 | CN2624398Y Stacked finned radiator |
| 07/07/2004 | CN2624397Y Heat pipe radiator with drawing-off style fan |
| 07/07/2004 | CN2624271Y A fixing device for CPU radiator |
| 07/07/2004 | CN1511435A Shunt power connection for integrated circuit package |
| 07/07/2004 | CN1511347A Substrate for electric component and method for production thereof |
| 07/07/2004 | CN1511346A Semiconductor device and method of manufacturing same |
| 07/07/2004 | CN1511342A Dispensing process for fabrication of microelectronic packages |
| 07/07/2004 | CN1511341A Filling compositions |
| 07/07/2004 | CN1511028A Phase change thermal interface composition having induced bonding property |
| 07/07/2004 | CN1510985A Module with electric separation |
| 07/07/2004 | CN1510982A Electric signal electric interconnection technology between electronic component and multi-layer route device |
| 07/07/2004 | CN1510980A Film carrying belt for mounting electronic components, production and electrolyzing apparatus |
| 07/07/2004 | CN1510850A Glass terminal for high-speed optical communication |
| 07/07/2004 | CN1510810A Anti-distort casing for electronic circuit |
| 07/07/2004 | CN1510752A Semiconductor device with redundant function |
| 07/07/2004 | CN1510750A 电路装置及其制造方法 Circuit device and manufacturing method thereof |
| 07/07/2004 | CN1510749A Electrostatic discharge protective circuit with self-trigger function |
| 07/07/2004 | CN1510748A Semiconductor device with multilayer interconnecting structure and manufacturing method thereof |
| 07/07/2004 | CN1510747A Semiconductor device and manufactring method thereof |
| 07/07/2004 | CN1510746A 电路装置及其制造方法 Circuit device and manufacturing method thereof |
| 07/07/2004 | CN1510745A Semiconductor device and manufacturing meethod thereof |
| 07/07/2004 | CN1510744A 功率模块 Power Modules |
| 07/07/2004 | CN1510743A Film carried belt for mounting electronic components thereon |
| 07/07/2004 | CN1510735A Fuse structure shaping method |
| 07/07/2004 | CN1510734A Manufacturing method for semiconductor device |
| 07/07/2004 | CN1510728A Manufacturing method for semiconductor device, semiconductor device, circuit substrate and apparatus |
| 07/07/2004 | CN1510723A Electronic device manufacture |
| 07/07/2004 | CN1510522A Device manufacturing method |
| 07/07/2004 | CN1510388A Surface installation chip package |
| 07/07/2004 | CN1510174A Method for depositing non-lead tin alloy |
| 07/07/2004 | CN1509838A Method for manufacturing non-lead solder lug |
| 07/07/2004 | CN1157105C Built-in circuit device assembly and its manufacturing method |