| Patents for H01L 23 - Details of semiconductor or other solid state devices (226,155) |
|---|
| 07/13/2004 | US6762433 Semiconductor product wafer having vertically and horizontally arranged patterned areas including a limited number of test element group regions |
| 07/13/2004 | US6762431 Wafer-level package with test terminals |
| 07/13/2004 | US6762369 Multilayer ceramic substrate and method for manufacturing the same |
| 07/13/2004 | US6762367 Electronic package having high density signal wires with low resistance |
| 07/13/2004 | US6762366 Ball assignment for ball grid array package |
| 07/13/2004 | US6762123 Moisture corrosion inhibitor layer for Al-alloy metallization layers, particularly for electronic devices and corresponding manufacturing method |
| 07/13/2004 | US6762122 Methods of forming metallurgy structures for wire and solder bonding |
| 07/13/2004 | US6762120 Semiconductor device and method for fabricating the same |
| 07/13/2004 | US6762118 Package having array of metal pegs linked by printed circuit lines |
| 07/13/2004 | US6762117 Method of fabricating metal redistribution layer having solderable pads and wire bondable pads |
| 07/13/2004 | US6762115 Chip structure and process for forming the same |
| 07/13/2004 | US6762111 Method of manufacturing a semiconductor device |
| 07/13/2004 | US6762109 Method of manufacturing semiconductor device with reduced number of process steps for capacitor formation |
| 07/13/2004 | US6762108 Method of forming a metal-insulator-metal capacitor for dual damascene interconnect processing and the device so formed |
| 07/13/2004 | US6762089 Method for manufacturing a memory device |
| 07/13/2004 | US6762087 Process for manufacturing an integrated circuit including a dual-damascene structure and a capacitor |
| 07/13/2004 | US6762079 Methods for fabricating dual loc semiconductor die assembly employing floating lead finger structure |
| 07/13/2004 | US6762078 Semiconductor package having semiconductor chip within central aperture of substrate |
| 07/13/2004 | US6762077 Integrated sensor packages and methods of making the same |
| 07/13/2004 | US6762076 Process of vertically stacking multiple wafers supporting different active integrated circuit (IC) devices |
| 07/13/2004 | US6762075 Semiconductor module and producing method therefor |
| 07/13/2004 | US6762074 Method and apparatus for forming thin microelectronic dies |
| 07/13/2004 | US6762067 Method of packaging a plurality of devices utilizing a plurality of lead frames coupled together by rails |
| 07/13/2004 | US6761963 Integrated thin film capacitor/inductor/interconnect system and method |
| 07/13/2004 | US6761947 Curing a silicone polymer while the polymer lies between backing materials and the backing material has a surface containing oxygen and/or sulfur atoms in contact with silicon, separating the cured product from backing material |
| 07/13/2004 | US6761928 Coating a solid magnesium, aluminum, or copper sheet of high conductivity with a low melting indium alloy |
| 07/13/2004 | US6761842 Heat conductive mold and manufacturing method thereof |
| 07/13/2004 | US6761813 Covalently bonding thermal interface material to a bottom surface of heat dissipating device and/ or a backside surface of heat generating device; thermally coupling heat dissipating device to heat generating device |
| 07/13/2004 | US6761302 Device mounting method |
| 07/13/2004 | US6761212 Spiral copper tube and aluminum fin thermosyphon heat exchanger |
| 07/13/2004 | US6761211 High-performance heat sink for electronics cooling |
| 07/08/2004 | WO2004057749A2 Flexible inverter power module for motor drives |
| 07/08/2004 | WO2004057673A1 Electronic device and use thereof |
| 07/08/2004 | WO2004057672A1 Method of producing semiconductor elements using a test structure |
| 07/08/2004 | WO2004057671A2 Method for forming patterns aligned on either side of a thin film |
| 07/08/2004 | WO2004057670A1 Surface-mounted microwave package and corresponding mounting with multilayer circuit |
| 07/08/2004 | WO2004057668A2 Electronic device and method of manufacturing same |
| 07/08/2004 | WO2004057667A2 Method for re-routing lithography-free microelectronic devices |
| 07/08/2004 | WO2004057666A2 Rf power transistor with internal bias feed |
| 07/08/2004 | WO2004057662A2 Electronic device and method of manufacturing same |
| 07/08/2004 | WO2004057649A2 Voltage contrast test structure |
| 07/08/2004 | WO2004056914A1 Electrically insulating and thermally conductive polyester molding materials |
| 07/08/2004 | WO2004042305A3 Optimal spreader system, device and method for fluid cooled micro-scaled heat exchange |
| 07/08/2004 | WO2004015771A3 Semiconductor device and method of manufacturing the same |
| 07/08/2004 | WO2004001837A3 Methods of forming electronic structures including conductive shunt layers and related structures |
| 07/08/2004 | WO2003098688A3 Structural design of under bump metallurgy for high reliability bumped packages |
| 07/08/2004 | WO2003090259A3 Authentication of integrated circuits |
| 07/08/2004 | WO2003070809B1 Organosiloxanes and their use in dielectric films of semiconductors |
| 07/08/2004 | WO2003031373B1 Thick film conductor compositions for use on aluminum nitride substrates |
| 07/08/2004 | WO2002071481A8 Enhanced leadless chip carrier |
| 07/08/2004 | US20040132888 Electronic device packaging and curable resin composition |
| 07/08/2004 | US20040132331 Support and grounding structure |
| 07/08/2004 | US20040132321 Connection housing for an electronic component |
| 07/08/2004 | US20040132303 Membrane 3D IC fabrication |
| 07/08/2004 | US20040132299 Method for depositing lead-free tin alloy |
| 07/08/2004 | US20040132288 Fabrication of semiconductor devices |
| 07/08/2004 | US20040132282 Copper transition layer for improving copper interconnection reliability |
| 07/08/2004 | US20040132279 Electronic package with filled blind vias |
| 07/08/2004 | US20040132257 Semiconductor device fabrication method |
| 07/08/2004 | US20040132243 Method of forming cavity between multilayered wirings |
| 07/08/2004 | US20040132230 Ball grid array substrate and method for preparing the same |
| 07/08/2004 | US20040132229 Concurrent electrical signal wiring optimization for an electronic package |
| 07/08/2004 | US20040131835 Structure for heat dissipation |
| 07/08/2004 | US20040131832 Metal/ceramic circuit board |
| 07/08/2004 | US20040131763 Methods of forming roughened layers of platinum |
| 07/08/2004 | US20040131096 Laser diode module for optical communication |
| 07/08/2004 | US20040130929 MRAM architecture with a flux closed data storage layere |
| 07/08/2004 | US20040130877 Substrate for high-frequency module and high-frequency module |
| 07/08/2004 | US20040130876 Heat sink attachment device |
| 07/08/2004 | US20040130875 Fastening device for heat slug |
| 07/08/2004 | US20040130874 Embedded liquid pump and microchannel cooling system |
| 07/08/2004 | US20040130873 Structure for removable cooler |
| 07/08/2004 | US20040130871 Cooling device for an electrical or electronic unit |
| 07/08/2004 | US20040130849 Layer capacitor element and production process as well as electronic device |
| 07/08/2004 | US20040130690 Alignment system and methods for lithographic systems using at least two wavelengths |
| 07/08/2004 | US20040130436 Laser-trimmable digital resistor |
| 07/08/2004 | US20040130435 Ball grid array resistor network having a ground plane |
| 07/08/2004 | US20040130434 Method of fabrication of MIMCAP and resistor at same level |
| 07/08/2004 | US20040130038 Electrode for electric double layer capacitor |
| 07/08/2004 | US20040130037 Group III nitride based flip-chip intergrated circuit and method for fabricating |
| 07/08/2004 | US20040130036 Mult-chip module |
| 07/08/2004 | US20040130035 Method of forming copper interconnects |
| 07/08/2004 | US20040130034 the package avoids mechanical grinding. |
| 07/08/2004 | US20040130033 Semiconductor device |
| 07/08/2004 | US20040130032 by using multiple layers of pre-porous dielectric materials that are made porous subsequent to etching and metal filling of apertures ; Suitable etch differential between the layers can be achieved through the use of certain removable material |
| 07/08/2004 | US20040130031 modifying carborane material to enable it to be deposited by chemical vapor deposition; used as a semiconductor |
| 07/08/2004 | US20040130030 Semiconductor device and method for manufacturing same |
| 07/08/2004 | US20040130029 Conformal lining layers for damascene metallization |
| 07/08/2004 | US20040130028 Semiconductor device and manufacturing method thereof |
| 07/08/2004 | US20040130027 Improved formation of porous interconnection layers |
| 07/08/2004 | US20040130026 Semiconductor device and method of manufacturing the same |
| 07/08/2004 | US20040130024 Semiconductor device package manufacturing method and semiconductor device package manufactured by the method |
| 07/08/2004 | US20040130023 has bumps that have electrical connection capabilities disposed at the sections of four corners of a semiconductor chip , as well as electrically-non-contact dummy bumps, |
| 07/08/2004 | US20040130022 Semiconductor device with improved design freedom of external terminal |
| 07/08/2004 | US20040130021 High power silicon carbide and silicon semiconductor device package |
| 07/08/2004 | US20040130020 Semiconductor device and manufacturing method thereof |
| 07/08/2004 | US20040130018 Method of manufacturing a low expansion material and semiconductor device using the low expansion material |
| 07/08/2004 | US20040130017 Stacked layer type semiconductor device and its manufacturing method |
| 07/08/2004 | US20040130016 Semiconductor device and different levels of signal processing systems using the same |
| 07/08/2004 | US20040130014 Semiconductor device and its manufacturing method |