| Patents for H01L 23 - Details of semiconductor or other solid state devices (226,155) |
|---|
| 02/19/2014 | CN103594451A Multi-layer multi-chip fan-out structure and manufacturing method |
| 02/19/2014 | CN103594450A Electrically programmable fuse structure of semiconductor device |
| 02/19/2014 | CN103594449A Circuit board of IGBT module |
| 02/19/2014 | CN103594448A Lead frame |
| 02/19/2014 | CN103594447A IC chip stack packaged component large in packaging density and good in high frequency performance and manufacturing method thereof |
| 02/19/2014 | CN103594446A IGBT module and span bridge electrode used for same |
| 02/19/2014 | CN103594445A W-wave-band IMPATT diode impedance matching pin and manufacturing method of W-wave-band IMPATT diode impedance matching pin |
| 02/19/2014 | CN103594444A Semiconductor assembly with dual connecting channels between interposer and coreless substrate |
| 02/19/2014 | CN103594443A Bonded structure for package and substrate |
| 02/19/2014 | CN103594442A 芯片 Chip |
| 02/19/2014 | CN103594441A Semiconductor package and method of manufacturing the same |
| 02/19/2014 | CN103594440A Semiconductor substrate assembly |
| 02/19/2014 | CN103594439A Large-power semiconductor device radiator |
| 02/19/2014 | CN103594438A Fully-enclosed phase-change type radiator and manufacturing method and applications thereof |
| 02/19/2014 | CN103594437A Heat dissipation apparatus used for electronic assembly and LED module possessing the heat dissipation apparatus |
| 02/19/2014 | CN103594436A Transistor fixing device |
| 02/19/2014 | CN103594435A Fixing block applied in radiator |
| 02/19/2014 | CN103594434A Composite heat dissipation layer of power component, technology of composite heat dissipation layer of power component and power component with composite heat dissipation layer |
| 02/19/2014 | CN103594433A Method for manufacturing three-dimensional package heat dissipation structure of rigid-flexible joint board |
| 02/19/2014 | CN103594432A Three-dimensional packaging heat radiation structure of rigid-flexible combination plate |
| 02/19/2014 | CN103594431A Semiconductor energy superconducting core |
| 02/19/2014 | CN103594430A Micro-channel radiator for dissipating heat of power electronic device |
| 02/19/2014 | CN103594429A Semiconductor packaging structure and heat dissipation member thereof |
| 02/19/2014 | CN103594428A Image sensor module and image capture module |
| 02/19/2014 | CN103594427A Image sensor module and image capture module |
| 02/19/2014 | CN103594426A Image sensor module and image capture module |
| 02/19/2014 | CN103594425A Packaging technology and structure of flexible substrate |
| 02/19/2014 | CN103594418A Semiconductor package and method of fabricating the same |
| 02/19/2014 | CN103594404A Feeding and discharging system of plastic packaging type intelligent power module and lead frame matched with same |
| 02/19/2014 | CN103594388A Contact pads with sidewall spacers and method of making contact pads with sidewall spacers |
| 02/19/2014 | CN103594387A Pad sidewall spacer and method of making pad sidewall spacer |
| 02/19/2014 | CN103594386A Laminated packaging composition and making method thereof |
| 02/19/2014 | CN103594385A Method to control underfill fillet width |
| 02/19/2014 | CN103594384A Method for producing electronic device, method for producing package, electronic device, and electronic equipment |
| 02/19/2014 | CN103594379A Interconnect substrate with embedded semiconductor and built-in stopper, and method of making the same |
| 02/19/2014 | CN103594333A Manufacturing method for transparent capacitor |
| 02/19/2014 | CN103591823A Method for manufacturing phase-change radiator |
| 02/19/2014 | CN103589384A Adhesive composition, connection structure, connection structure manufacturing method and application of adhesive composition |
| 02/19/2014 | CN102569261B Structure and method for testing heat radiating characteristic of nanoscale device |
| 02/19/2014 | CN102479725B Preparation method of semiconductor assembly with heat spreader and dual build-up circuitry |
| 02/19/2014 | CN102456662B 高电压电阻器 High voltage resistors |
| 02/19/2014 | CN102349362B Electronic component mounting method and electronic component mounting structure |
| 02/19/2014 | CN102299139B 半导体集成电路 The semiconductor integrated circuit |
| 02/19/2014 | CN102299133B 半导体结构及其制造方法 The semiconductor structure and a method of manufacturing |
| 02/19/2014 | CN102244053B Semiconductor light emitting device and power semiconductor device |
| 02/19/2014 | CN102224566B Integrated capacitor with alternating layered segments |
| 02/19/2014 | CN102142407B Heat conducting pad |
| 02/19/2014 | CN101894824B Bearing structure of electronic component and preparation method thereof |
| 02/19/2014 | CN101840117B TFT-LCD ( Thin Film Transistor-Liquid Crystal Diode) array substrate and manufacture method thereof |
| 02/19/2014 | CN101556828B Unit cell of nonvolatile memory device and nonvolatile memory device having the same |
| 02/18/2014 | US8656333 Integrated circuit package auto-routing |
| 02/18/2014 | US8654527 Thyristor valve module |
| 02/18/2014 | US8653926 Inductive and capacitive elements for semiconductor technologies with minimum pattern density requirements |
| 02/18/2014 | US8653676 Semiconductor package and method of manufacturing the same |
| 02/18/2014 | US8653675 Package including at least one topological feature on an encapsulant material to resist out-of-plane deformation |
| 02/18/2014 | US8653674 Electronic component package fabrication method and structure |
| 02/18/2014 | US8653673 Method for packaging semiconductors at a wafer level |
| 02/18/2014 | US8653672 Three dimensional structure memory |
| 02/18/2014 | US8653671 System for relieving stress and improving heat management in a 3D chip stack |
| 02/18/2014 | US8653670 Electrical interconnect for an integrated circuit package and method of making same |
| 02/18/2014 | US8653669 Semiconductor package |
| 02/18/2014 | US8653668 Copper bonding wire for semiconductor device and bonding structure thereof |
| 02/18/2014 | US8653667 Power MOSFET having selectively silvered pads for clip and bond wire attach |
| 02/18/2014 | US8653666 Semiconductor storage device having a peripheral circuit region and a memory cell region |
| 02/18/2014 | US8653665 Barrier layer, film forming method, and processing system |
| 02/18/2014 | US8653664 Barrier layers for copper interconnect |
| 02/18/2014 | US8653663 Barrier layer for copper interconnect |
| 02/18/2014 | US8653662 Structure for monitoring stress induced failures in interlevel dielectric layers of solder bump integrated circuits |
| 02/18/2014 | US8653660 Semiconductor device and package |
| 02/18/2014 | US8653659 Integrated circuit device including a copper pillar capped by barrier layer |
| 02/18/2014 | US8653658 Planarized bumps for underfill control |
| 02/18/2014 | US8653656 Semiconductor device having multiple external electrodes |
| 02/18/2014 | US8653655 Semiconductor device and manufacturing method thereof |
| 02/18/2014 | US8653654 Integrated circuit packaging system with a stackable package and method of manufacture thereof |
| 02/18/2014 | US8653653 High density three dimensional semiconductor die package |
| 02/18/2014 | US8653652 Semiconductor device, power semiconductor module and power conversion device equipped with power semiconductor module |
| 02/18/2014 | US8653651 Semiconductor apparatus and method for manufacturing the same |
| 02/18/2014 | US8653650 Semiconductor device with acene heat spreader |
| 02/18/2014 | US8653649 Device housing package and mounting structure |
| 02/18/2014 | US8653648 Zigzag pattern for TSV copper adhesion |
| 02/18/2014 | US8653647 Plastic package and method of fabricating the same |
| 02/18/2014 | US8653646 Stub minimization using duplicate sets of terminals for wirebond assemblies without windows |
| 02/18/2014 | US8653645 Semiconductor device comprising stacked LSI having circuit blocks connected by power supply and signal line through vias |
| 02/18/2014 | US8653644 Packaged semiconductor chips with array |
| 02/18/2014 | US8653643 Semiconductor module |
| 02/18/2014 | US8653642 Method for creating and packaging three dimensional stacks of biochips containing microelectro-mechanical systems |
| 02/18/2014 | US8653640 Semiconductor package apparatus |
| 02/18/2014 | US8653638 Integrated circuit package with multiple dies and bundling of control signals |
| 02/18/2014 | US8653636 Contactless communication medium |
| 02/18/2014 | US8653635 Power overlay structure with leadframe connections |
| 02/18/2014 | US8653634 EMI-shielded semiconductor devices and methods of making |
| 02/18/2014 | US8653633 Semiconductor device packages with electromagnetic interference shielding |
| 02/18/2014 | US8653632 System and method for conditioning implantable medical devices |
| 02/18/2014 | US8653629 Semiconductor device and wafer |
| 02/18/2014 | US8653626 Package structures including a capacitor and methods of forming the same |
| 02/18/2014 | US8653624 Semiconductor device comprising metal-based eFuses of enhanced programming efficiency by enhancing metal agglomeration and/or voiding |
| 02/18/2014 | US8653623 One-time programmable devices and methods of forming the same |
| 02/18/2014 | US8653622 Semiconductor device including transistor and fuse circuit and semiconductor module including the same |
| 02/18/2014 | US8653598 Electrical switch using gated resistor structures and three-dimensional integrated circuits using the same |
| 02/18/2014 | US8653587 Trench MOSFET having a top side drain |