| Patents for H01L 23 - Details of semiconductor or other solid state devices (226,155) |
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| 07/15/2004 | DE10049288B4 Elektronische Bauteile und eine Folienband zum Verpacken von Bonddrahtverbindungen elektronischer Bauteile sowie deren Herstellungsverfahren Electronic components and foil tape for packing bonding wire connections of electronic components as well as their method of preparation |
| 07/14/2004 | EP1437928A1 Multi-layer wiring board, ic package, and method of manufacturing multi-layer wiring boards |
| 07/14/2004 | EP1437770A2 Press-fitting method and rectifying device having press-fitted member |
| 07/14/2004 | EP1437762A1 Notched compound semiconductor wafer |
| 07/14/2004 | EP1437684A1 Module for a hybrid card |
| 07/14/2004 | EP1437036A1 Latching micro magnetic relay packages and methods of packaging |
| 07/14/2004 | EP1436893A2 Electronic device and method of testing and of manufacturing |
| 07/14/2004 | EP1436838A2 Semiconductor component |
| 07/14/2004 | EP1436837A2 Semiconductor structure with one or more through-holes |
| 07/14/2004 | EP1436836A1 Thermal interface material and electronic assembly having such a thermal interface material |
| 07/14/2004 | EP1436835A2 Electrically conductive thermal interface |
| 07/14/2004 | EP1436834A2 Stacking of multilayer modules |
| 07/14/2004 | EP1436815A1 Semiconductor memory cell and memory array using a breakdown phenomena in an ultra-thin dielectric |
| 07/14/2004 | EP0950261B1 Semiconductor with metal coating on its rear surface |
| 07/14/2004 | CN2626187Y Laminated line base plate |
| 07/14/2004 | CN2626186Y Rigid flexible base plate and camera using the same |
| 07/14/2004 | CN2626051Y Side blown heat radiating fin combination for electronic element |
| 07/14/2004 | CN2626050Y Down opening packaging structure |
| 07/14/2004 | CN2626049Y Contactless intelligent card band |
| 07/14/2004 | CN1513219A Socket connector and contact for use in socket connector |
| 07/14/2004 | CN1513207A Contact system |
| 07/14/2004 | CN1513206A Fluxless flip chip inter connection |
| 07/14/2004 | CN1513205A High frequency integrated circuit (HFIC) microsystem assembly and method for fabricatnig the same |
| 07/14/2004 | CN1513203A Microelectronic structure comprising hydrogen barrier layer |
| 07/14/2004 | CN1513201A Deposition method, deposition apparatus, insulation film and semiconductor integrated circuit |
| 07/14/2004 | CN1513068A Thermal management material, devices and methods therefor |
| 07/14/2004 | CN1512933A Interface materials and methods of production and use thereof |
| 07/14/2004 | CN1512919A Microdeposition apparatus |
| 07/14/2004 | CN1512918A Interchangeable microdeposition head apparatus and method |
| 07/14/2004 | CN1512917A Waveform generation for microdeposition control system |
| 07/14/2004 | CN1512601A Luminous device and lighting device |
| 07/14/2004 | CN1512593A Image sensor adapted for element reducing chip level package |
| 07/14/2004 | CN1512583A Current compensation circuit for light leakage and light signal circuit using said circuit |
| 07/14/2004 | CN1512580A Semiconductor device and its producing method |
| 07/14/2004 | CN1512579A 半导体模块 Semiconductor Modules |
| 07/14/2004 | CN1512578A 半导体模块 Semiconductor Modules |
| 07/14/2004 | CN1512576A Semiconductor device and its producing method |
| 07/14/2004 | CN1512575A Internal connection structure and its forming method |
| 07/14/2004 | CN1512574A Semiconductor device and its producing method |
| 07/14/2004 | CN1512573A Flip-chip bonding package structure of chip |
| 07/14/2004 | CN1512572A Optical valve heat radiator |
| 07/14/2004 | CN1512571A Heat pipe radiator and its producing method and apparatus |
| 07/14/2004 | CN1512570A Heat radiator and its producing and forming method |
| 07/14/2004 | CN1512569A Heat conductive multilayer substrate and substrate for power module |
| 07/14/2004 | CN1512566A Substrate for face down bonding |
| 07/14/2004 | CN1512554A Method for connecting integrated circuit to substrate and relative circuit wiring |
| 07/14/2004 | CN1512553A Method for producing semiconductor device |
| 07/14/2004 | CN1512544A Semiconductor device capable of preventing pattern from damage |
| 07/14/2004 | CN1512542A Electronic device production |
| 07/14/2004 | CN1512445A IC card and its producing method |
| 07/14/2004 | CN1512293A Method for computer radiation and control noise |
| 07/14/2004 | CN1511977A Electroplating cup with adjustable spacing between cathode, anode and uniform stream plate in wafer level package |
| 07/14/2004 | CN1511911A Package seal composition for electronic device |
| 07/14/2004 | CN1157790C Chip stack package structure |
| 07/14/2004 | CN1157789C Static discharge buffer device |
| 07/14/2004 | CN1157787C 半导体器件 Semiconductor devices |
| 07/14/2004 | CN1157786C Low-noise high-frequency integrated circuit device and its making method |
| 07/14/2004 | CN1157785C Moldless semiconductor device and photovoltaic device module making use of same |
| 07/14/2004 | CN1157784C Composite material for semiconductor radiator and producing method therefor |
| 07/14/2004 | CN1157783C Heat sink and memory module with heat sink |
| 07/14/2004 | CN1157781C IC package structure and its manufacture |
| 07/14/2004 | CN1157779C Method for handling thinned chips for introducing them into chip cards |
| 07/14/2004 | CN1157778C Manufacturing method of semiconductor device and semiconductor devcies manufactured thereby |
| 07/14/2004 | CN1157774C Method for producing semiconductor device and semiconductor device |
| 07/14/2004 | CN1157773C Metal core substrate printed wiring board enabling thermally enhanced ball grid array (BGA) packages and method |
| 07/13/2004 | US6762937 Power module |
| 07/13/2004 | US6762868 Electro-optical package with drop-in aperture |
| 07/13/2004 | US6762608 Apparatus and method for testing fuses |
| 07/13/2004 | US6762597 Structure, system, and method for assessing electromigration permeability of layer material within interconnect |
| 07/13/2004 | US6762511 Thermosetting resin composition |
| 07/13/2004 | US6762510 Flexible integrated monolithic circuit |
| 07/13/2004 | US6762509 Flip-chip packaging method that treats an interconnect substrate to control stress created at edges of fill material |
| 07/13/2004 | US6762508 Semiconductor encapsulant resin having an additive with a gradient concentration |
| 07/13/2004 | US6762507 Array-type bonding pads provides a corresponding internal circuit structure while increasing the maximum allowable pad number that can be designed on the chip |
| 07/13/2004 | US6762506 Assembly of semiconductor device and wiring substrate |
| 07/13/2004 | US6762505 150 degree bump placement layout for an integrated circuit power grid |
| 07/13/2004 | US6762503 Innovative solder ball pad structure to ease design rule, methods of fabricating same and substrates, electronic device assemblies and systems employing same |
| 07/13/2004 | US6762502 Semiconductor device packages including a plurality of layers substantially encapsulating leads thereof |
| 07/13/2004 | US6762501 To prevent the formation of voids and/or cracking faults in asymmetric copper interconnect lines |
| 07/13/2004 | US6762499 Damage to circuits under pads at the time of wafer test and the occurrence rate of cracks in circuits under pads are reduced without detriment to wire bonding characteristics |
| 07/13/2004 | US6762498 Reducing the signal reflection without endangering the mechanical stability of the substrate |
| 07/13/2004 | US6762497 Integrated circuit with stop layer and associated fabrication process |
| 07/13/2004 | US6762496 Substrate and production method therefor |
| 07/13/2004 | US6762495 Area array package with non-electrically connected solder balls |
| 07/13/2004 | US6762494 Electronic package substrate with an upper dielectric layer covering high speed signal traces |
| 07/13/2004 | US6762493 Microwave integrated circuit |
| 07/13/2004 | US6762492 Adhesive material does not enter into a space between the substrate and the semiconductor chip, parasitic capacitance is prevented |
| 07/13/2004 | US6762491 Power semiconductor device |
| 07/13/2004 | US6762490 Semiconductor device and method for producing the same |
| 07/13/2004 | US6762489 Jogging structure for wiring translation between grids with non-integral pitch ratios in chip carrier modules |
| 07/13/2004 | US6762488 Light thin stacked package semiconductor device and process for fabrication thereof |
| 07/13/2004 | US6762485 Plastic lead frames for semiconductor devices |
| 07/13/2004 | US6762484 Thermoelectric element |
| 07/13/2004 | US6762482 Memory device with composite contact plug and method for manufacturing the same |
| 07/13/2004 | US6762472 Signal communication structures |
| 07/13/2004 | US6762470 Fingerprint sensor having a portion of the fluorocarbon polymer physical interface layer amorphized |
| 07/13/2004 | US6762466 Circuit structure for connecting bonding pad and ESD protection circuit |
| 07/13/2004 | US6762461 Semiconductor element protected with a plurality of zener diodes |
| 07/13/2004 | US6762442 Semiconductor device carrying a plurality of circuits |
| 07/13/2004 | US6762434 Electrical print resolution test die |