| Patents for H01L 23 - Details of semiconductor or other solid state devices (226,155) |
|---|
| 07/15/2004 | US20040137707 Flat-top bumping structure and preparation method |
| 07/15/2004 | US20040137706 Method of manufacturing semiconductor device |
| 07/15/2004 | US20040137705 Method of manufacturing semiconductor device |
| 07/15/2004 | US20040137702 Semiconductor device obtained by dividing semiconductor wafer by use of laser dicing technique and method of manufacturing the same |
| 07/15/2004 | US20040137701 Semiconductor device and manufacturing method thereof |
| 07/15/2004 | US20040137661 Semiconductor device manufacturing method |
| 07/15/2004 | US20040137660 Method for manufacturing semiconductor device and semiconductor device |
| 07/15/2004 | US20040137659 [method of fabricating a solder mask and structure of a substrate] |
| 07/15/2004 | US20040137649 Method of fabricating semiconductor device comprising superposition inspection step |
| 07/15/2004 | US20040137241 Patternable low dielectric constsnt materials and their use in ULSI interconnection |
| 07/15/2004 | US20040137216 curable mixtures of rubbers, amino resins and thermoconductive fillers, used as heat exchangers for electronics |
| 07/15/2004 | US20040137161 Device and method for electroless plating |
| 07/15/2004 | US20040137153 low dielectric; formed via spinning |
| 07/15/2004 | US20040136163 Heat sink device having light-emitting components |
| 07/15/2004 | US20040136162 Heat dissipating device for electronic components of electronic control devices |
| 07/15/2004 | US20040136161 Heat sink attachment |
| 07/15/2004 | US20040136160 Heat dissipation assembly including heat sink and fan |
| 07/15/2004 | US20040136123 Circuit devices and method for manufacturing the same |
| 07/15/2004 | US20040135720 Radar apparatus |
| 07/15/2004 | US20040135622 Optimal inductor management |
| 07/15/2004 | US20040135269 Interconnect substrate, semiconductor device, methods of manufacturing the same, circuit board, and electronic equipment |
| 07/15/2004 | US20040135268 Interface for UV-curable adhesives |
| 07/15/2004 | US20040135267 Semiconductor device and manufacturing method thereof |
| 07/15/2004 | US20040135266 Substrate for mounting a semiconductor chip |
| 07/15/2004 | US20040135264 Semiconductor device and method for packaging same |
| 07/15/2004 | US20040135263 Donut power mesh scheme for flip chip package |
| 07/15/2004 | US20040135262 Semiconductor device and a method of manufacturing the same |
| 07/15/2004 | US20040135261 Interconnections having double capping layer and method for forming the same |
| 07/15/2004 | US20040135260 Semiconductor devices and methods of fabricating the same |
| 07/15/2004 | US20040135259 Semiconductor device and method for fabricating the same |
| 07/15/2004 | US20040135257 Semiconductor device with a multi-level interconnect structure and method for making the same |
| 07/15/2004 | US20040135256 Nonvolatile semiconductor memory device |
| 07/15/2004 | US20040135255 Semiconductor device and its manufacturing method |
| 07/15/2004 | US20040135254 Porous multilayer dielectric overcoating substrate |
| 07/15/2004 | US20040135253 Semiconductor component with electrical characteristic adjustment circuitry |
| 07/15/2004 | US20040135252 Arrangement for the protection of three-dimensional structures on wafers |
| 07/15/2004 | US20040135251 Composite metal column for mounting semiconductor device |
| 07/15/2004 | US20040135250 MCM package with bridge connection |
| 07/15/2004 | US20040135249 Semiconductor devices and substrates used in thereof |
| 07/15/2004 | US20040135248 Semiconductor device |
| 07/15/2004 | US20040135247 Heat dissipation substrates; copper, tungsten alloy; mixture of metal powder with binders; heating; molding; sintering; controlling particle size |
| 07/15/2004 | US20040135246 Method for fabricating semiconductor package and semiconductor package |
| 07/15/2004 | US20040135245 Wafer with semiconductor chips mounted thereon |
| 07/15/2004 | US20040135244 Semiconductor device |
| 07/15/2004 | US20040135243 Semiconductor device, its manufacturing method and electronic device |
| 07/15/2004 | US20040135242 Stacked structure of chips |
| 07/15/2004 | US20040135239 EMI heatspreader/lid for integrated circuit packages |
| 07/15/2004 | US20040135238 EMI grounding pins for CPU/ASIC chips |
| 07/15/2004 | US20040135237 Semiconductor device and method of manufacturing the same |
| 07/15/2004 | US20040135234 Semiconductor device with MOS transistors with an etch-stop layer having an improved residual stress level and method for fabricating such a semiconductor device |
| 07/15/2004 | US20040135233 Wafer integrated rigid support ring |
| 07/15/2004 | US20040135232 Semiconductor wafer and method of marking a crystallographic direction on a semiconductor wafer |
| 07/15/2004 | US20040135231 An arrangement for testing semiconductor chips while incorporated on a semiconductor wafer |
| 07/15/2004 | US20040135230 Integrated circuit structure; corrosion and oxidation resistance; adhesion; low temperature annealing |
| 07/15/2004 | US20040135229 Semiconductor device and method of setting input pin capacity |
| 07/15/2004 | US20040135227 Method and apparatus for a deposited fill layer |
| 07/15/2004 | US20040135226 Isolation trenches; support subatrates; dielectrics; adjustment grooves; patterning |
| 07/15/2004 | US20040135211 Semiconductor device and method of manufacturing the same |
| 07/15/2004 | US20040135206 Semiconductor circuit having an input protection circuit |
| 07/15/2004 | US20040135197 Semiconductor structure with integrated shield |
| 07/15/2004 | US20040135189 Semiconductor device |
| 07/15/2004 | US20040135171 Sealing apparatus for semiconductor wafer, mold of sealing apparatus, and semiconductor wafer |
| 07/15/2004 | US20040135168 Multilayer; semiconductor substrates, power transistor, coupling intakes, drains; charging using bypass capacitor |
| 07/15/2004 | US20040135151 Light-emitting apparatus |
| 07/15/2004 | US20040135143 Display device and manufacturing method of the same |
| 07/15/2004 | US20040134979 Semiconductor device and an information management system therefore |
| 07/15/2004 | US20040134974 Solder bump structure and method for forming a solder bump |
| 07/15/2004 | US20040134899 Ceramic substrate for a semiconductor-production/inspection device |
| 07/15/2004 | US20040134896 Laser-based method and system for memory link processing with picosecond lasers |
| 07/15/2004 | US20040134894 Laser-based system for memory link processing with picosecond lasers |
| 07/15/2004 | US20040134685 Two signal one power plane circuit board |
| 07/15/2004 | US20040134681 Circuit board and its manufacturing method |
| 07/15/2004 | US20040134680 Use of perimeter stops to support solder interconnects between integrated circuit assembly components |
| 07/15/2004 | US20040134646 Graphite-based heat sinks and method and apparatus for the manufacture thereof |
| 07/15/2004 | US20040134642 Heat dissipation device including heat sink and heat pipes |
| 07/15/2004 | US20040134641 Cooling device boiling and condensing refrigerant |
| 07/15/2004 | US20040134639 Easily removed heatsink clip |
| 07/15/2004 | US20040134549 Hydraulic motor vehicle gearbox control device with a plastic hydraulic distribution plate and conductors integrated therein |
| 07/15/2004 | US20040134530 device for securely fixing a junction of a thermocouple to a top plate while ensuring heat transfer between the junction and the top plate; |
| 07/15/2004 | DE202004007701U1 Cooling system, especially for computer processors, has heat conducting tube(s), two-sided cooling body in one or more parts implemented on at least 2 sides with and/or without cooling ribs, lamellas |
| 07/15/2004 | DE202004007700U1 Multi-sided cooling body with integrated thermal conducting pipe for cooling exothermic electrical and electronic components has one or more parts, cooling ribs and/or lamellas on at least three sides |
| 07/15/2004 | DE202004000914U1 Thin-film cooling device for microprocessor, has solder paste applied via copper tube and two layers of copper gauze joined using heating plate |
| 07/15/2004 | DE19750918B4 Halbleitereinrichtung mit Bitleitung und Kondensatorelektrode und zugehöriges Herstellungsverfahren Semiconductor device having bit line and capacitor electrode and associated production method |
| 07/15/2004 | DE19736139B4 Leiterplatte Circuit board |
| 07/15/2004 | DE10357789A1 Leistungs-Halbleitervorrichtung Power semiconductor device |
| 07/15/2004 | DE10356796A1 Herstellungsverfahren einer Halbleitervorrichtung Manufacturing method of a semiconductor device |
| 07/15/2004 | DE10351875A1 Integriertes Schaltkreisbauelement und Halbleiterbauelement mit MIM-Kondensator Integrated circuit device and semiconductor device including the MIM capacitor |
| 07/15/2004 | DE10349125A1 Halbleitervorrichtung mit Überspannungsschutzschaltung A semiconductor device with overvoltage protection circuit |
| 07/15/2004 | DE10339213A1 Leistungsmodul Power module |
| 07/15/2004 | DE10310716A1 Adjustment marking manufacturing method for semiconductor wafers, has fourth insulating layer applied directly to surface of third insulating layer |
| 07/15/2004 | DE10300956B3 Bauelement mit Höchstfrequenzverbindungen in einem Substrat Component with high frequency links in a substrate |
| 07/15/2004 | DE10300462A1 Phosphormodifiziertes Epoxidharz A phosphorus-modified epoxy resin |
| 07/15/2004 | DE10259221A1 Electronic component for high performance memory chips, has stack of semiconductor chips with wiring layer between chips to connect contact surfaces |
| 07/15/2004 | DE10259049A1 Integriertes Halbleitermodul Integrated semiconductor module |
| 07/15/2004 | DE10259035A1 Electrostatic discharge protection component for mobile telephone multiband front end modules, includes spark gap and inductance on substrate |
| 07/15/2004 | DE10258570A1 Gehäuse für Leistungshalbleitermodule Housing for power semiconductor modules |
| 07/15/2004 | DE10257870A1 Halbleiterstruktur mit einer integrierten Abschirmung Semiconductor structure with an integrated shield |
| 07/15/2004 | DE10255844B3 Integrated circuit manufacturing method of chip scale package, involves attaching solder balls in area that is uncovered by resist element, of patterned rewriting element, in patterned form |
| 07/15/2004 | DE10250887B3 Schaltende Metallleitungskonfigurationen in Metallschichtstrukturen Switching metal line configurations in metal layer structures |
| 07/15/2004 | DE10062661B4 Testzellenstruktur und Verfahren zum Bestimmen elektrischer Eigenschaften von auf einem Substrat gebildeten eng beabstandeten Verbindungsflächen Test cell structure and method for determining the electrical properties of formed on a substrate closely spaced joining surfaces |