| Patents for H01L 23 - Details of semiconductor or other solid state devices (226,155) |
|---|
| 07/20/2004 | US6765299 Semiconductor device and the method for manufacturing the same |
| 07/20/2004 | US6765298 Substrate pads with reduced impedance mismatch and methods to fabricate substrate pads |
| 07/20/2004 | US6765297 Semiconductor device and wiring forming method in semiconductor device |
| 07/20/2004 | US6765296 Via-sea layout integrated circuits |
| 07/20/2004 | US6765294 Semiconductor device including dual-damascene structure and method for manufacturing the same |
| 07/20/2004 | US6765293 Electrode structure of a carrier substrate of a semiconductor device |
| 07/20/2004 | US6765291 IC package with dual heat spreaders |
| 07/20/2004 | US6765290 Arrangement for back-biasing multiple integrated circuit substrates at maximum supply voltage among all circuits |
| 07/20/2004 | US6765289 Reinforcement material for silicon wafer and process for producing IC chip using said material |
| 07/20/2004 | US6765288 Stacked chip mounting without special prepackaged unit |
| 07/20/2004 | US6765286 Semiconductor integrated circuit device |
| 07/20/2004 | US6765285 Power semiconductor device with high radiating efficiency |
| 07/20/2004 | US6765284 Leadframe inductors |
| 07/20/2004 | US6765283 Semiconductor device with multi-layer interlayer dielectric film |
| 07/20/2004 | US6765282 Semiconductor structure and method for determining critical dimensions and overlay error |
| 07/20/2004 | US6765279 Membrane 3D IC fabrication |
| 07/20/2004 | US6765277 Aluminum metal or alloy conductor with noble metal passivation layer |
| 07/20/2004 | US6765275 Two-layer electrical substrate for optical devices |
| 07/20/2004 | US6765274 Semiconductor device having a built-in contact-type sensor and manufacturing method of such a semiconductor device |
| 07/20/2004 | US6765268 Multiple transistors having a common gate pad between first group of drains and second group of drains |
| 07/20/2004 | US6765267 Pixel structure |
| 07/20/2004 | US6765255 Increased capacitance |
| 07/20/2004 | US6765254 Structure and method for preventing UV radiation damage and increasing data retention in memory cells |
| 07/20/2004 | US6765236 Optical device and method for manufacturing the same, and electronic apparatus |
| 07/20/2004 | US6765228 Bonding pad with separate bonding and probing areas |
| 07/20/2004 | US6764958 Method of depositing dielectric films |
| 07/20/2004 | US6764955 Semiconductor device having a contact window and fabrication method thereof |
| 07/20/2004 | US6764954 Application of alignment marks to wafer |
| 07/20/2004 | US6764953 Electronic device, and method of patterning a first layer |
| 07/20/2004 | US6764951 Method for forming nitride capped Cu lines with reduced hillock formation |
| 07/20/2004 | US6764950 Fabrication method for semiconductor integrated circuit device |
| 07/20/2004 | US6764948 Method of manufacturing a semiconductor device and the semiconductor device manufactured by the method |
| 07/20/2004 | US6764945 Method of manufacturing a multilayer metallization structure with non-directional sputtering method |
| 07/20/2004 | US6764941 Bit line landing pad and borderless contact on bit line stud with localized etch stop layer and manufacturing method thereof |
| 07/20/2004 | US6764938 Integrated electronic device having flip-chip connection with circuit board and fabrication method thereof |
| 07/20/2004 | US6764937 Solder on a sloped surface |
| 07/20/2004 | US6764935 Stereolithographic methods for fabricating conductive elements |
| 07/20/2004 | US6764933 Stereolithographically fabricated conductive elements, semiconductor device components and assemblies including such conductive elements, and methods |
| 07/20/2004 | US6764931 Semiconductor package, method of manufacturing the same, and semiconductor device |
| 07/20/2004 | US6764919 Method for providing a dummy feature and structure thereof |
| 07/20/2004 | US6764899 Method for fabricating semiconductor device |
| 07/20/2004 | US6764886 Manufacturing method of semiconductor device |
| 07/20/2004 | US6764882 Two-stage transfer molding method to encapsulate MMC module |
| 07/20/2004 | US6764880 Semiconductor package and fabricating method thereof |
| 07/20/2004 | US6764879 Semiconductor wafer, semiconductor device, and method for manufacturing the same |
| 07/20/2004 | US6764878 Method of manufacturing a resin encapsulated semiconductor device to provide a vent hole in a base substrate |
| 07/20/2004 | US6764877 Method of dissipating static electric charge from a chip assembly during a manufacturing operation |
| 07/20/2004 | US6764876 Stress shield for microelectronic dice |
| 07/20/2004 | US6764875 Method of and apparatus for sealing an hermetic lid to a semiconductor die |
| 07/20/2004 | US6764867 Reticle option layer detection method |
| 07/20/2004 | US6764774 Structures with improved adhesion to Si and C containing dielectrics and method for preparing the same |
| 07/20/2004 | US6764773 Heat-dissipating substrate, method for making the same, and semiconductor device including the same |
| 07/20/2004 | US6764759 Method of forming a phase change thermal interface |
| 07/20/2004 | US6764585 Electronic device manufacturing method |
| 07/20/2004 | US6764525 Method for manufacturing thin-film lithium microbatteries |
| 07/20/2004 | US6763994 Semiconductor device and method of manufacture thereof, circuit board and electronic instrument |
| 07/20/2004 | US6763881 Thermally matched gradient heat sink |
| 07/20/2004 | US6763880 Liquid cooled radiation module for servers |
| 07/20/2004 | US6763581 Method for manufacturing spiral contactor |
| 07/20/2004 | US6763579 Method of making components with releasable leads |
| 07/20/2004 | US6763578 Method and apparatus for manufacturing known good semiconductor die |
| 07/20/2004 | CA2222857C Process to create metallic stand-offs on an electronic circuit |
| 07/15/2004 | WO2004059734A1 Testable electrostatic discharge protection circuits |
| 07/15/2004 | WO2004059733A1 Programmable fuse for an electronic device |
| 07/15/2004 | WO2004059732A1 Ic tiling pattern method, ic so formed and analysis method |
| 07/15/2004 | WO2004059730A1 Method of self-assembling electronic circuitry and circuits formed thereby |
| 07/15/2004 | WO2004059729A1 Electronic part manufacturing method and electronic part |
| 07/15/2004 | WO2004059728A2 Method of fabricating an integrated circuit and semiconductor chip |
| 07/15/2004 | WO2004059726A1 Integrated antifuse structure for finfet and cmos devices |
| 07/15/2004 | WO2004059722A1 Semiconductor sensor and plating method for semiconductor device |
| 07/15/2004 | WO2004059721A1 Electronic component unit |
| 07/15/2004 | WO2004059720A1 Three-dimensional device fabrication method |
| 07/15/2004 | WO2004059708A2 Structure and method for bonding to copper interconnect structures |
| 07/15/2004 | WO2004059174A1 Fan with case having air supplying opening, cooling unit and electronic apparatus comprising fan |
| 07/15/2004 | WO2004059042A1 Lead-free bump and method for forming the same |
| 07/15/2004 | WO2004049424A3 Microelectronic packaging and components |
| 07/15/2004 | WO2004049400A3 Methods for applying thermally conductive compounds utilizing piezo electric jet deposition |
| 07/15/2004 | WO2004047148A3 Method for producing and testing a corrosion-resistant channel in a silicon device |
| 07/15/2004 | WO2004044984A3 Chip-scale schottky device |
| 07/15/2004 | WO2004042303A3 Interwoven manifolds for pressure drop reduction in microchannel heat exchangers |
| 07/15/2004 | WO2004041972A3 Gas layer formation materials |
| 07/15/2004 | WO2004036648A3 Method of manufacturing a data carrier |
| 07/15/2004 | WO2004027865A3 Support structures for wirebond regions of contact pads over low modulus materials |
| 07/15/2004 | WO2004000718A3 Bridges for microelectromechanical structures |
| 07/15/2004 | WO2003106328A3 Micromechanical component and corresponding production method |
| 07/15/2004 | WO2003077313A3 Multilayered ceramic substrate for integrated power components and method for the production of said substrate |
| 07/15/2004 | WO2003043038A3 Mems device having contact and standoff bumps and related methods |
| 07/15/2004 | US20040139407 Semiconductor device layout inspection method |
| 07/15/2004 | US20040137756 Method of improving stability in low k barrier layers |
| 07/15/2004 | US20040137753 Method for low temperature liquid-phase deposition and method for cleaning liquid-deposition apparatus |
| 07/15/2004 | US20040137728 Air gap formation |
| 07/15/2004 | US20040137726 Underlayer film-forming material for copper, method for a forming underlayer film for copper, an underlayer film for copper, and a semiconductor device |
| 07/15/2004 | US20040137724 Semiconductor die including conductive columns |
| 07/15/2004 | US20040137723 Manufacturing method of semiconductor device |
| 07/15/2004 | US20040137720 Semiconductor device and manufacturing method for the same |
| 07/15/2004 | US20040137719 Method for forming metal line of semiconductor device |
| 07/15/2004 | US20040137717 Methods of preventing oxidation of barrier metal of semiconductor devices |
| 07/15/2004 | US20040137711 Forming silicon nitride as hard mask for wiring by dual damascene process; multilayer; etching patterns |
| 07/15/2004 | US20040137709 Metal barrier cap fabrication by polymer lift-off |
| 07/15/2004 | US20040137708 Method for manufacturing semiconductor device |