| Patents for H01L 23 - Details of semiconductor or other solid state devices (226,155) |
|---|
| 07/22/2004 | US20040140487 Semiconductor device |
| 07/22/2004 | US20040140486 Dynamic random access memory |
| 07/22/2004 | US20040140484 Use of irregularly shaped conductive filler features to improve planarization of the conductive layer while reducing parasitic capacitance introduced by the filler features |
| 07/22/2004 | US20040140482 Semiconductor device and process for producing semiconductor device |
| 07/22/2004 | US20040140467 Semiconductor device having pad |
| 07/22/2004 | US20040140197 Sputtering target, Al interconnection film, and electronic component |
| 07/22/2004 | US20040140196 Shaping features in sputter deposition |
| 07/22/2004 | US20040140122 Product comprising a substrate and a chip attached to the substrate |
| 07/22/2004 | US20040140116 High voltage module and method for producing same |
| 07/22/2004 | US20040140084 Heat dissipating device with forced coolant and air flow |
| 07/22/2004 | US20040140039 Adhesive tape applying method and apparatus |
| 07/22/2004 | US20040139820 a powder batch and method of making copper metal particles that are substantially spherical, have a weight average particle size of less than about 5 mu m and a narrow particle size distribution and high crystallinity |
| 07/22/2004 | US20040139603 Wired board with bump electrode and method of fabricating the same |
| 07/22/2004 | DE202004006687U1 Ribbed heat sink elements are clamped to an adapter at the end of a heat transfer tube for cooling of processor chips. |
| 07/22/2004 | DE202004006288U1 Chipmodul Chip module |
| 07/22/2004 | DE10346581A1 Verfahren zum Herstellen einer Halbleitervorrichtung A method of manufacturing a semiconductor device |
| 07/22/2004 | DE10334435A1 Halbleitervorrichtung und Verfahren für deren Herstellung Semiconductor device and methods for their preparation |
| 07/22/2004 | DE10317747B3 Process for control of thickness reduction of semiconductor elements involves use of a simple test structure with a series of trenches of different widths formed in a plate |
| 07/22/2004 | DE10309502A1 Lothügelstruktur und Verfahren zur Herstellung derselben Lothügelstruktur and methods for making the same |
| 07/22/2004 | DE10301091A1 Method for connection of semiconductor devices on common substrate e.g. for automobile applications, requires conductive flat contact stirrup between first and second semiconductor devices |
| 07/22/2004 | DE10300958A1 Modul mit Verkapselung Module encapsulation |
| 07/22/2004 | DE10300594A1 Electronic and/or micromechanical structural element with chips, a packaging, a gel, and a gel packing agent useful in stress determination |
| 07/22/2004 | DE10295878T5 Gegen Reverse Engineering geschützte integrierte Schaltungen und Verfahren zur Herstellung derselben unter Verwendung einer auf Feldoxid endenden sichtbaren Metallkontaktleitung Protected against reverse engineering integrated circuits and methods of manufacturing the same using an ending on the visible field oxide metal contact line |
| 07/22/2004 | DE10294243T5 Kaskadenkondensator Kaskadenkondensator |
| 07/22/2004 | DE10261410A1 Assembly of an integrated circuit, e.g. a chip, wafer or hybrid with substrate by provision of a packing and substrate with the same number of junction regions useful for construction of integrated circuits |
| 07/22/2004 | DE10261385A1 Monolithically integrated, especially high frequency, transformer, has at least four essentially quadrilateral windings in two groups in first layer with stacked and crossed conducting winding tracks |
| 07/22/2004 | DE10260242A1 Schaltungsmodul für Kraftfahrzeuge Circuit module for motor vehicles |
| 07/22/2004 | DE10240848B4 Kühlkörper aus Leichtmetall in Blockform und Verfahren zu dessen Herstellung Cooling body made of light metal, in block form, and process for its preparation |
| 07/22/2004 | DE10234585B4 Optoelektronisches SMD-Bauteil für den Empfang von elektromagnetischer Strahlung, insbesondere Sonnenlicht, und dessen Verwendung in einem Strahlungssensor An opto-electronic SMD component for receiving electromagnetic radiation, in particular sunlight, and its use in a radiation sensor |
| 07/22/2004 | DE10226654B4 Wärmeableitungsvorrichtung Heat dissipation device |
| 07/22/2004 | DE102004001061A1 Optimales Induktormanagement Optimal Induktormanagement |
| 07/22/2004 | DE10022384B4 Verfahren zur Passivierung einer schnellen Leistungsdiode A method for passivating a fast power diode |
| 07/22/2004 | CA2511005A1 Group iii nitride based flip-chip integrated circuit and method for fabricating |
| 07/22/2004 | CA2509673A1 Method for fabrication of semiconductor device |
| 07/21/2004 | EP1439582A2 Image sensor device with copper interconnects and method for forming the same |
| 07/21/2004 | EP1439581A2 Interconnection structure |
| 07/21/2004 | EP1439577A2 Semiconductor device and manufacturing method for the same |
| 07/21/2004 | EP1439576A2 Through hole manufacturing method |
| 07/21/2004 | EP1439575A2 Semiconductor device with a lead frame and method of manufacturing the same |
| 07/21/2004 | EP1439397A2 Method of performing a burn-in |
| 07/21/2004 | EP1439049A2 Adhesive tape applying method and apparatus |
| 07/21/2004 | EP1438748A2 Micro- or nano-electronic component comprising a power source and means for protecting the power source |
| 07/21/2004 | EP1438747A1 Electrical or electronic component and method of producing same |
| 07/21/2004 | EP1438746A2 Thin metal package and manufacturing method thereof |
| 07/21/2004 | EP1438745A2 Multiple die interconnect system |
| 07/21/2004 | EP1438744A2 Method of forming a raised contact for a substrate |
| 07/21/2004 | EP1438743A2 Fill pattern generation for spin-on glass and related self-planarization deposition |
| 07/21/2004 | EP1438742A2 Method for selecting faulty dielectrics of a semiconductor component |
| 07/21/2004 | EP1438741A2 Adhesive wafers for die attach application |
| 07/21/2004 | EP1438740A2 Method for packing electronic modules and multiple chip packaging |
| 07/21/2004 | EP1438595A1 Method and apparatus for accelerated determination of electromigration characteristics of semiconductor wiring |
| 07/21/2004 | EP1438198A1 Method of manufacturing an electronic component and electronic component obtained by means of said method |
| 07/21/2004 | EP1222725A4 Universal multi-functional common conductive shield structure for electrical circuitry and energy conditioning |
| 07/21/2004 | EP1166361A4 Apparatus and method for an integrated circuit having high q reactive components |
| 07/21/2004 | EP1134805B1 Solder bump fabrication methods and structure including a titanium barrier layer |
| 07/21/2004 | EP0971407B1 Thermal conductive unit and thermal connection structure using same |
| 07/21/2004 | EP0961809A4 Low temperature method and compositions for producing electrical conductors |
| 07/21/2004 | CN2627736Y Mounting structure of power switching element absorption capacitor |
| 07/21/2004 | CN2627654Y 热电模块 Thermoelectric Modules |
| 07/21/2004 | CN2627653Y Protected type triode |
| 07/21/2004 | CN2627652Y Built-in combined type heat sink |
| 07/21/2004 | CN2627651Y Improved structure of radiator unit |
| 07/21/2004 | CN2627650Y Heat radiating fin structure having flow guiding function |
| 07/21/2004 | CN2627649Y Side wind type radiator unit |
| 07/21/2004 | CN2627648Y Heat radiation structure of fan |
| 07/21/2004 | CN2627647Y Stack apparatus of integrated circuit packaging housing |
| 07/21/2004 | CN2627562Y Fastener of heat sink |
| 07/21/2004 | CN2627561Y Heat sink |
| 07/21/2004 | CN2627427Y Heat radiator for electronic refrigeration |
| 07/21/2004 | CN1515134A Pin grid array connector with reinforcement plate |
| 07/21/2004 | CN1515032A Ball grid array x-ray oreintation mark |
| 07/21/2004 | CN1515031A Process for mfg. of printed circuit boards with plated resistors |
| 07/21/2004 | CN1514954A Semiconductor package and method of preparing same |
| 07/21/2004 | CN1514764A Ceramic multilayer substrate manufacturing method unfired composite multilayer body |
| 07/21/2004 | CN1514541A Multilayer ceramic frequency selective circuit |
| 07/21/2004 | CN1514493A Structure of small image sensing treatment module and its manufacturing method |
| 07/21/2004 | CN1514490A Semiconductor device having X shaped pipe core support and its manufacturing method |
| 07/21/2004 | CN1514488A Porous structive coramic cooling fin and its making method |
| 07/21/2004 | CN1514487A Self composed nano-level interface structure and its application |
| 07/21/2004 | CN1514478A Solid super low k interlocking structure using first bridge then metal spray coating manufacturing sequence |
| 07/21/2004 | CN1514422A Electronic module and its mfg. method, driving method and electronic apparatus |
| 07/21/2004 | CN1158759C Conductive cap, electronic assembly and method for forming insulation film of conductive cap |
| 07/21/2004 | CN1158757C Encapsulated surface wave component and method for making same |
| 07/21/2004 | CN1158713C Semiconductor device and method for manufacturing the same |
| 07/21/2004 | CN1158712C Resistance element having flexing portion and its manufacturing method |
| 07/21/2004 | CN1158710C Semiconductor integrated circuit device including memory device |
| 07/21/2004 | CN1158706C Semiconductor chip with surface coating |
| 07/21/2004 | CN1158705C Method for fabrication of semiconductor device |
| 07/21/2004 | CN1158699C Method and apparatus for manufacture of electronic components, and method for driving the apparatus |
| 07/20/2004 | US6766503 Method and apparatus for circuit design |
| 07/20/2004 | US6765806 Composition with EMC shielding characteristics |
| 07/20/2004 | US6765799 Heat dissipating fins interlocking mechanism |
| 07/20/2004 | US6765794 Heat sink, manufacturing method thereof, and electronic apparatus having the heat sink |
| 07/20/2004 | US6765778 Integrated vertical stack capacitor |
| 07/20/2004 | US6765773 ESD protection for a CMOS output stage |
| 07/20/2004 | US6765772 Electrostatic discharge protection device |
| 07/20/2004 | US6765652 Forming thermally curable materials on a support structure in an electronic device |
| 07/20/2004 | US6765561 Display device having integrated circuit chips thereon |
| 07/20/2004 | US6765398 Conductive material for integrated circuit fabrication |
| 07/20/2004 | US6765301 Integrated circuit bonding device and manufacturing method thereof |