| Patents for H01L 23 - Details of semiconductor or other solid state devices (226,155) |
|---|
| 07/28/2004 | CN1516277A Equipment for protecting high-frequency radio-frequency integrated circuit against electrostatic discharge injury |
| 07/28/2004 | CN1516276A Seiconductor interconnection with double-cover and its mfg. method |
| 07/28/2004 | CN1516274A Integrated circuit packaging body |
| 07/28/2004 | CN1516273A Radiation device for electronic element |
| 07/28/2004 | CN1516272A Semiconductor device, its mfg. method and thin sheet interconnecting line parts |
| 07/28/2004 | CN1516253A Semiconductor device and its mfg. method |
| 07/28/2004 | CN1516252A Method for mfg. semiconductor integrated circuit device |
| 07/28/2004 | CN1516251A Method for mfg. semiconductor assembly and semiconductor assembly |
| 07/28/2004 | CN1516250A Semiconductor device and mfg. method, circuit board and film carrier belt |
| 07/28/2004 | CN1516243A Crystalline grain in metal film growth control method |
| 07/28/2004 | CN1516241A Method for forming penetrating electrode and chip with penerating electrode |
| 07/28/2004 | CN1516203A Constrained sintering method for asymmetrical configurational dielectric layer |
| 07/28/2004 | CN1515977A Mainboard setting method for improving computer performance and its mainboard |
| 07/28/2004 | CN1515623A Wavelength exchange pouring material, its application and preparation method |
| 07/28/2004 | CN1159956C Terminal electrode for circuit substrate on which chip package mounted and method for manufacturing the same |
| 07/28/2004 | CN1159764C N channel metal-oxide-semiconductor drive circuit and its manufacture method |
| 07/28/2004 | CN1159761C Connecting material for electronic elements, and semiconductor device using same |
| 07/28/2004 | CN1159756C Lead wire frame and its producing method |
| 07/27/2004 | US6768964 Method and apparatus for determining dot-mark-forming position of semiconductor wafer |
| 07/27/2004 | US6768660 Multi-chip memory devices and modules including independent control of memory chips |
| 07/27/2004 | US6768649 Method and a circuit system for using equivalent integrated-circuit devices operating at different voltages |
| 07/27/2004 | US6768646 High density internal ball grid array integrated circuit package |
| 07/27/2004 | US6768641 Heat dissipation assembly |
| 07/27/2004 | US6768619 Low-voltage-triggered SOI-SCR device and associated ESD protection circuit |
| 07/27/2004 | US6768516 Semiconductor device constituting a CMOS camera system |
| 07/27/2004 | US6768401 Wiring board with a waveguide tube and wiring board module for mounting plural wiring boards |
| 07/27/2004 | US6768386 Dual clock package option |
| 07/27/2004 | US6768213 Automated combi deposition apparatus and method |
| 07/27/2004 | US6768212 Semiconductor packages and methods for manufacturing such semiconductor packages |
| 07/27/2004 | US6768211 Five layer adhesive/insulator/metal/insulator/adhesive tape for semiconductor die packaging |
| 07/27/2004 | US6768210 Bumpless wafer scale device and board assembly |
| 07/27/2004 | US6768209 Underfill compounds including electrically charged filler elements, microelectronic devices having underfill compounds including electrically charged filler elements, and methods of underfilling microelectronic devices |
| 07/27/2004 | US6768207 Multichip wafer-level package and method for manufacturing the same |
| 07/27/2004 | US6768206 Organic substrate for flip chip bonding |
| 07/27/2004 | US6768205 Thin-film circuit substrate |
| 07/27/2004 | US6768204 Self-aligned conductive plugs in a semiconductor device |
| 07/27/2004 | US6768202 Semiconductor device and method of manufacturing the same |
| 07/27/2004 | US6768201 Interlevel insulating film covers gate electrode |
| 07/27/2004 | US6768200 Ultralow dielectric constant material as an intralevel or interlevel dielectric in a semiconductor device |
| 07/27/2004 | US6768199 Flip chip type semiconductor device and method of fabricating the same |
| 07/27/2004 | US6768196 Packaged microchip with isolation |
| 07/27/2004 | US6768195 Multi-chip semiconductor device |
| 07/27/2004 | US6768193 Heat transfer structure for a semiconductor device utilizing a bismuth glass layer |
| 07/27/2004 | US6768192 Pin layout of dual band receiver with two input pads/pins restricted to a single side of a four sided package |
| 07/27/2004 | US6768191 Electronic component with stacked electronic elements |
| 07/27/2004 | US6768190 Stack type flip-chip package |
| 07/27/2004 | US6768189 High power chip scale package |
| 07/27/2004 | US6768188 Semiconductor device |
| 07/27/2004 | US6768187 Coupling spaced bond pads to a contact |
| 07/27/2004 | US6768186 Semiconductor device and laminated leadframe package |
| 07/27/2004 | US6768185 Formation of antifuse structure in a three dimensional memory |
| 07/27/2004 | US6768184 Fuse structure used in an integrated circuit device |
| 07/27/2004 | US6768177 Parallel plate diode |
| 07/27/2004 | US6768176 Electrostatic discharge protection circuit |
| 07/27/2004 | US6768163 Nonvolatile semiconductor memory device and nonvolatile semiconductor memory system |
| 07/27/2004 | US6768153 Semiconductor device |
| 07/27/2004 | US6768142 Circuit component placement |
| 07/27/2004 | US6768063 Multilayer; capacitance coupling |
| 07/27/2004 | US6768062 Connection method and connection structure of pad electrodes, and inspecting methods for connection state thereof |
| 07/27/2004 | US6767820 Chip scale surface mounted device and process of manufacture |
| 07/27/2004 | US6767819 Apparatus with compliant electrical terminals, and methods for forming same |
| 07/27/2004 | US6767817 Asymmetric plating |
| 07/27/2004 | US6767815 Stereolithographically fabricated conductive elements, semiconductor device components and assemblies including such conductive elements, and methods |
| 07/27/2004 | US6767812 Method of forming CVD titanium film |
| 07/27/2004 | US6767810 Method to increase substrate potential in MOS transistors used in ESD protection circuits |
| 07/27/2004 | US6767800 Process for integrating alignment mark and trench device |
| 07/27/2004 | US6767796 Method of manufacturing semiconductor device and the semiconductor device |
| 07/27/2004 | US6767789 Method for interconnection between transfer devices and storage capacitors in memory cells and device formed thereby |
| 07/27/2004 | US6767788 Semiconductor device having a metal insulator metal capacitor |
| 07/27/2004 | US6767782 Suppressing electric charges generated on substrate and which flow to ground potential through substrate prevents damages to substrate due to charge-up |
| 07/27/2004 | US6767769 Metal-to-metal antifuse employing carbon-containing antifuse material |
| 07/27/2004 | US6767768 Method for forming antifuse via structure |
| 07/27/2004 | US6767767 Method of manufacturing a semiconductor device in which a block molding package utilizes air vents in a substrate |
| 07/27/2004 | US6767766 Heat dissipation structure; power control circuits |
| 07/27/2004 | US6767765 Methods and apparatus for disposing a thermal interface material between a heat source and a heat dissipation device |
| 07/27/2004 | US6767762 Lightweight semiconductor device and method for its manufacture |
| 07/27/2004 | US6767761 Method of manufacturing a flip-chip semiconductor device with a stress-absorbing layer made of thermosetting resin |
| 07/27/2004 | US6767753 Image sensor of a quad flat package |
| 07/27/2004 | US6767616 Metal core substrate and process for manufacturing same |
| 07/27/2004 | US6767409 Method for cleaning semiconductor wafer after chemical mechanical polishing on copper wiring |
| 07/27/2004 | US6767140 Ceramic optical sub-assembly for opto-electronic module utilizing LTCC (low-temperature co-fired ceramic) technology |
| 07/27/2004 | US6766998 Molds for wafer scale molding of protective caps |
| 07/27/2004 | US6766852 Heatsink plate |
| 07/27/2004 | US6766851 Heat sink fin assembly |
| 07/22/2004 | WO2004062333A1 Thermally enhanced package for an integrated circuit |
| 07/22/2004 | WO2004062094A2 Sealed and pressurized liquid cooling system for microprocessor |
| 07/22/2004 | WO2004061982A1 Cooling device for electronic component using thermo-electric conversion material |
| 07/22/2004 | WO2004061973A1 Group iii nitride based flip-chip integrated circuit and method for fabricating |
| 07/22/2004 | WO2004061962A2 Multi-layer integrated semiconductor structure |
| 07/22/2004 | WO2004061961A1 Multi-layer integrated semiconductor structure having an electrical shielding portion |
| 07/22/2004 | WO2004061960A2 Semiconductor device power interconnect striping |
| 07/22/2004 | WO2004061959A1 Packaged ic using insulated wire |
| 07/22/2004 | WO2004061958A1 Electro-osmotic pumps and micro-channels |
| 07/22/2004 | WO2004061957A1 Method and apparatus for temperature control of optoelectronic semiconductor components |
| 07/22/2004 | WO2004061956A1 Heat sink of electronic component |
| 07/22/2004 | WO2004061954A2 Electronic unit integrated into a flexible polymer body |
| 07/22/2004 | WO2004061953A2 Method of forming a multi-layer semiconductor structure incorporating a processing handle member |
| 07/22/2004 | WO2004061952A2 Method of forming a multi-layer semiconductor structure having a seamless bonding interface |
| 07/22/2004 | WO2004061947A1 Semiconductor device, dram integrated circuit device, and its manufacturing method |
| 07/22/2004 | WO2004061936A1 Low stress semiconductor die attach |