| Patents for H01L 23 - Details of semiconductor or other solid state devices (226,155) |
|---|
| 07/29/2004 | US20040145876 Method for shielding an electric circuit created on a printed circuit board and a corresponding combination of a printed circuit board and a shield |
| 07/29/2004 | US20040145874 Method, system, and apparatus for embedding circuits |
| 07/29/2004 | US20040145868 Cooling device with air shower |
| 07/29/2004 | US20040145718 Pad coating system and interlock method thereof |
| 07/29/2004 | US20040145434 RF module and method for arranging through holes in RF module |
| 07/29/2004 | US20040145278 Electronic component and method of producing the same |
| 07/29/2004 | US20040145066 forming structures of a first width next to structures of a second width, which is is greater than five times the first width; structures of a first width are separated from each other by a distance of between 1-5 times the first width |
| 07/29/2004 | US20040145065 Chip type solid electrolytic capacitor having a small size and a simple structure |
| 07/29/2004 | US20040145063 Integrated circuit assembly module that supports capacitive communication between semiconductor dies |
| 07/29/2004 | US20040145061 Semiconductor device |
| 07/29/2004 | US20040145060 Laser marking passivation film for semiconductor package |
| 07/29/2004 | US20040145058 Buried connections in an integrated circuit substrate |
| 07/29/2004 | US20040145056 Multi-metal layer MEMS structure and process for making the same |
| 07/29/2004 | US20040145055 Semiconductor device and thin film forming method |
| 07/29/2004 | US20040145054 Components, methods and assemblies for stacked packages |
| 07/29/2004 | US20040145053 Self-assembled nanobump array structures and a method to fabricate such structures |
| 07/29/2004 | US20040145052 Semiconductor device and display device using the same |
| 07/29/2004 | US20040145051 Semiconductor components having stacked dice and methods of fabrication |
| 07/29/2004 | US20040145050 Contact system |
| 07/29/2004 | US20040145049 Micro-fabricated device with thermoelectric device and method of making |
| 07/29/2004 | US20040145048 Integrated circuit system with a latent heat storage module |
| 07/29/2004 | US20040145047 Cooling micro-channels |
| 07/29/2004 | US20040145046 Power module and method of manufacturing the same |
| 07/29/2004 | US20040145045 Bonding pad and via structure design |
| 07/29/2004 | US20040145044 a first electrical insulating substrate of a mixture of an inorganic filler and a thermosetting resin containing chips connected to wiring patterns formed on substrate surface; inner vias passing through the substrate connected to wiring patterns |
| 07/29/2004 | US20040145043 Semiconductor device and semiconductor assembly module |
| 07/29/2004 | US20040145042 Semiconductor device |
| 07/29/2004 | US20040145041 Semiconductor apparatus with decoupling capacitor |
| 07/29/2004 | US20040145040 improved reliability of connections of fine metal wires of an upper semiconductor chip to a wiring board when the second semiconductor chip is significantly larger than the first; prevention of microcracks in the second chip |
| 07/29/2004 | US20040145038 Composite integrated circuit device |
| 07/29/2004 | US20040145037 Power semiconductor able of fast heat sinking |
| 07/29/2004 | US20040145036 Integrated circuit |
| 07/29/2004 | US20040145035 Signal transmission plate used in an assembly package |
| 07/29/2004 | US20040145034 Semiconductor device |
| 07/29/2004 | US20040145033 Integrated circuit devices and methods and apparatuses for designing integrated circuit devices |
| 07/29/2004 | US20040145032 Semiconductor device and method of manufacturing the same |
| 07/29/2004 | US20040145031 Semiconductor device, method for manufacturing the same, circuit substrate, electro-optical apparatus, and electronic equipment |
| 07/29/2004 | US20040145030 forming air gaps in a complementary metal oxide semiconductor by forming a cover over a polymeric layer; and thermally decomposing the layer underneath the cover to form a cavity |
| 07/29/2004 | US20040145029 A method of forming an arc layer for a semiconductor device |
| 07/29/2004 | US20040145028 Semiconductor device and method of fabricating semiconductor device with high CMP uniformity and resistance to loss that occurs in dicing |
| 07/29/2004 | US20040145018 Thin film transistors, liquid crystal display device and electronic apparatus using the same |
| 07/29/2004 | US20040145017 Semiconductor device and method of manufacturing same |
| 07/29/2004 | US20040145004 Method of manufacturing semiconductor integrated circuit device having capacitor element |
| 07/29/2004 | US20040144996 Coolant cooled type semiconductor device |
| 07/29/2004 | US20040144835 situating sealing member between first and second member, positioning members to create bounded volume between members, creating pressure differential between ambient pressure outside bounded volume and pressure created within bounded volume |
| 07/29/2004 | US20040144760 Method and system for marking a workpiece such as a semiconductor wafer and laser marker for use therein |
| 07/29/2004 | US20040144561 Metal/ceramic bonding substrate and method for producing same |
| 07/29/2004 | US20040144554 Electrical arrangement and method for producing an electrical arrangement |
| 07/29/2004 | US20040144476 Resistor and, or capacitor on cermic core; firing, trimming; controlling sintering temperature |
| 07/29/2004 | DE202004008424U1 Plastic cover for a processor base or socket wherein the cover at least partly covers the base or socket of the processor |
| 07/29/2004 | DE202004007473U1 Fanless cooling system for electronic components, especially computer CPUs, has a multi-layer heat sink connected to one or more heat transfer tubes that transfer heat away from the processor to the heat sink |
| 07/29/2004 | DE202004007472U1 Fastening system for an adapter for a heat transfer tube for cooling a processor mounted on a base plate, has a clamping bracket and bolt arrangement |
| 07/29/2004 | DE202004003785U1 Clamping device for fastening a heat transfer tube which transfers heat from a processor, to a heat sink, serves to clamp the tube in a leak-tight and gap-free manner |
| 07/29/2004 | DE19842441B4 Halbleiterbauelement und Verfahren zu seiner Herstellung Semiconductor device and process for its preparation |
| 07/29/2004 | DE19815136B4 Integrierte Halbleiterschaltung mit einem Kondensator und einem Sicherungselement und Herstellungsverfahren A semiconductor integrated circuit having a capacitor and a fuse element and manufacturing method |
| 07/29/2004 | DE19800655B4 Dünnschichttransistoranordnung und Betriebsverfahren für eine Dünnschichttransistoranordnung Thin film transistor array and operating method for a thin film transistor array |
| 07/29/2004 | DE19740534B4 Halbleitervorrichtung mit mindestens zwei Verbindungsebenen sowie Verfahren zu deren Hertellung A semiconductor device comprising at least two connecting levels as well as processes for their Hertel Lung |
| 07/29/2004 | DE10340333A1 Carrier for holding and individual electrical contacting of individual semiconductor dies during testing or burning in has contact assemblies with an elastomer bump that enables contacting of dies using a vacuum force |
| 07/29/2004 | DE10334354A1 Liquid cooler for power semiconductors, whose opposite sides form cathodes and anodes, or coupled to such, containing two mutually insulated contact members, between which semiconductor element is fitted, with at least one contact member |
| 07/29/2004 | DE10300532A1 Socket or adapter for use in semiconductor component testing systems, especially for memory component testing, is designed to permit solder-free mounting on a contact assembly |
| 07/29/2004 | DE10300531A1 Socket or adapter for use in semiconductor component testing systems, especially for memory component testing, has a connection pin that is inserted into a matching contact so that a clamped connection is formed |
| 07/29/2004 | DE10297034T5 Fluoriertes aromatisches Polymer und Verwendung davon Fluorinated aromatic polymer and use thereof |
| 07/29/2004 | DE102004002176A1 Mikrominiatur-Stromrichter Microminiature power converter |
| 07/28/2004 | EP1441581A2 Cooling device with air shower |
| 07/28/2004 | EP1441417A2 High density connector and method of manufacture |
| 07/28/2004 | EP1441391A2 Dual-trench isolated crosspoint memory array and method for fabricating same |
| 07/28/2004 | EP1441390A2 A method for forming a conductive copper structure |
| 07/28/2004 | EP1441389A2 Electronic parts packaging structure and method of manufacturing the same |
| 07/28/2004 | EP1441388A2 Solder bump fabrication methods and structure including a titanium barrier layer |
| 07/28/2004 | EP1441232A2 Method for connecting electronic components |
| 07/28/2004 | EP1440991A1 Curing agent composition for epoxy resins, epoxy resin composition and use thereof |
| 07/28/2004 | EP1440473A2 Thermally balanced power transistor |
| 07/28/2004 | EP1440472A2 Pattern for improved visual inspection of semiconductor devices |
| 07/28/2004 | EP1440471A2 Ball grid array with x-ray alignment mark |
| 07/28/2004 | EP1440470A2 Wirebond contact structure and method of wire bonding a microelectronic die |
| 07/28/2004 | EP1290928A4 Heatsink and heatsink device using the heatsink |
| 07/28/2004 | EP1114845B1 Paste composition, and protective film and semiconductor device both obtained with the same |
| 07/28/2004 | CN2629223Y 芯片模块 Chip Module |
| 07/28/2004 | CN2629222Y Structure of semiconductor conducting wire holder |
| 07/28/2004 | CN2629221Y Radiating device with plate type thermal tube |
| 07/28/2004 | CN2629220Y Radiating fins |
| 07/28/2004 | CN2629219Y Heat exchanging radiator |
| 07/28/2004 | CN2629218Y Radiating apparatus |
| 07/28/2004 | CN2629217Y Flip-chip encapsulated substrate |
| 07/28/2004 | CN2629107Y CPU vertical heat surperconducting radiating apparatus |
| 07/28/2004 | CN2629092Y Fix hold apparatus assembly |
| 07/28/2004 | CN2629090Y Fixhold apparatus assembly |
| 07/28/2004 | CN1516996A Heat sink |
| 07/28/2004 | CN1516898A Semconductor device and mfg. method thereof |
| 07/28/2004 | CN1516897A High voltage semiconductor device housing with increased clearance between housing can be die for improving flux flushing |
| 07/28/2004 | CN1516896A Method of selectively alloying interconnect regions by depostion process |
| 07/28/2004 | CN1516895A Barrier enhancement process for copper interconnects |
| 07/28/2004 | CN1516755A Plating apparatus, plasting method and method for mfg. semiconductor device |
| 07/28/2004 | CN1516547A Cooling device for electric and/or electronic unit |
| 07/28/2004 | CN1516546A 电子装置 Electronic devices |
| 07/28/2004 | CN1516542A Sheet-like matter for heat-transfer base plate and its mfg. method, and heat-transfer base plate and mfg. method using it |
| 07/28/2004 | CN1516537A Circuit device and its mfg. method |
| 07/28/2004 | CN1516295A Packaging material and its package light-mixed type light-emitting diode device |
| 07/28/2004 | CN1516282A 电子电路 Electronic circuit |
| 07/28/2004 | CN1516281A Electronic circuit |