| Patents for H01L 23 - Details of semiconductor or other solid state devices (226,155) |
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| 08/03/2004 | US6770957 Adhesives, adhesive films and electric devices |
| 08/03/2004 | US6770955 Shielded antenna in a semiconductor package |
| 08/03/2004 | US6770948 Integrated fuse with regions of different doping within the fuse neck |
| 08/03/2004 | US6770947 Laser-breakable fuse link with alignment and break point promotion structures |
| 08/03/2004 | US6770942 Semiconductor device having silicide film formed in a part of source-drain diffusion layers and method of manufacturing the same |
| 08/03/2004 | US6770938 Diode fabrication for ESD/EOS protection |
| 08/03/2004 | US6770937 Photoconductive thin film for reduction of plasma damage |
| 08/03/2004 | US6770936 Thin film transistors, and liquid crystal display device and electronic apparatus using the same |
| 08/03/2004 | US6770930 Semiconductor device having MIM structure capacitor |
| 08/03/2004 | US6770907 Antifuse including silicon substrate, ring of shallow trench isolation, polysilicon gate overlapping inner perimeter of isolation, dielectric layer with damaged region having lower breakdown voltage than undamaged region, diffused region |
| 08/03/2004 | US6770906 Semiconductor reliability test chip |
| 08/03/2004 | US6770822 High frequency device packages and methods |
| 08/03/2004 | US6770808 A temperature controller for a semiconductor |
| 08/03/2004 | US6770573 Method for fabricating an ultralow dielectric constant material |
| 08/03/2004 | US6770572 Use of multifunctional si-based oligomer/polymer for the surface modification of nanoporous silica films |
| 08/03/2004 | US6770560 Method of forming metal wiring |
| 08/03/2004 | US6770557 Semiconductor device and method of fabricating the same |
| 08/03/2004 | US6770555 Process for fabricating semiconductor integrated circuit device having polycide line and impurity region respectively exposed to contact holes different in depth |
| 08/03/2004 | US6770554 On-chip interconnect circuits with use of large-sized copper fill in CMP process |
| 08/03/2004 | US6770550 Semiconductor device manufacturing method |
| 08/03/2004 | US6770547 Method for producing a semiconductor device |
| 08/03/2004 | US6770543 Semiconductor apparatus and semiconductor apparatus manufacturing method |
| 08/03/2004 | US6770535 Semiconductor integrated circuit device and process for manufacturing the same |
| 08/03/2004 | US6770531 Adhesive material for programmable device |
| 08/03/2004 | US6770514 Stereolithographic methods for fabricating hermetic semiconductor device packages and semiconductor devices including stereolithographically fabricated hermetic packages |
| 08/03/2004 | US6770513 Thermally enhanced flip chip packaging arrangement |
| 08/03/2004 | US6770511 Semiconductor device, and its manufacturing method, circuit substrate, and electronic apparatus |
| 08/03/2004 | US6770510 Flip chip process of flux-less no-flow underfill |
| 08/03/2004 | US6770509 Method for connecting a chip to an antenna in a contactless smart card radio frequency identification device |
| 08/03/2004 | US6770493 Integrated circuit package capable of operating in multiple orientations |
| 08/03/2004 | US6770184 Integrated de-ionized water pressure monitoring system for solder plating machines |
| 08/03/2004 | US6770164 Method for attaching a semiconductor die to a substrate |
| 08/03/2004 | US6770138 Pattern for monitoring epitaxial layer washout |
| 08/03/2004 | US6769923 Fluted signal pin, cap, membrane, and stanchion for a ball grid array |
| 08/03/2004 | US6769619 Electronic module for chip card |
| 08/03/2004 | US6769175 Heat sink device manufacture |
| 08/03/2004 | US6769174 Leadframeless package structure and method |
| 08/03/2004 | CA2332209C Wire bond pad and method therefor |
| 08/03/2004 | CA2327810C Material for electronic components, method of connecting material for electronic components, ball grid array type electronic components and method of connecting ball grid array type electronic components |
| 07/30/2004 | CA2455024A1 Stacked chip electronic package having laminate carrier and method of making same |
| 07/30/2004 | CA2454971A1 Multi-chip electronic package having laminate carrier and method of making same |
| 07/29/2004 | WO2004064467A1 Multilayer wiring board, method for producing the same, and method for producing fiber reinforced resin board |
| 07/29/2004 | WO2004064466A1 High-frequency layered part and manufacturing method thereof |
| 07/29/2004 | WO2004064464A2 System and method for packaging electronic components |
| 07/29/2004 | WO2004064163A1 Wiring substrate and radiation detector using same |
| 07/29/2004 | WO2004064160A2 Two-stage etching process for producing an integrated circuit arrangement, in particular comprising a capacitor assembly, in addition to an integrated circuit arrangement |
| 07/29/2004 | WO2004064159A1 Semiconductor device, three-dimensional mounting semiconductor apparatus, method for manufacturing semiconductor device |
| 07/29/2004 | WO2004064158A2 Component with ultra-high frequency connections in a substrate |
| 07/29/2004 | WO2004064157A1 Post cmp porogen burn out process |
| 07/29/2004 | WO2004064156A1 Laminate made by electro-forming and method for manufacturing the same |
| 07/29/2004 | WO2004064155A1 Electro-forming master having a pin portion and the same master-manufacturing method, and metal minute pattern made by the master |
| 07/29/2004 | WO2004064154A1 Lead frame for a semiconductor device |
| 07/29/2004 | WO2004064153A1 Semiconductor device and method of manufacturing the same |
| 07/29/2004 | WO2004064152A2 Modular construction component with encapsulation |
| 07/29/2004 | WO2004064151A2 Electronic device and method of manufacturing a substrate |
| 07/29/2004 | WO2004064150A1 Method for manufacturing electronic component mount board and electronic mount board manufactured by this method |
| 07/29/2004 | WO2004064149A1 Magnetic memory device |
| 07/29/2004 | WO2004064144A2 Semiconductor packaging with a partially prepatterned lead frame and method of manufacturing the same |
| 07/29/2004 | WO2004064143A1 Method of microelectrode connection and connected structure of use threof |
| 07/29/2004 | WO2004064142A1 Semiconductor device and process for producing the same |
| 07/29/2004 | WO2004064140A1 Module with encapsulation |
| 07/29/2004 | WO2004064136A1 A method of improving stability in low k barrier layers |
| 07/29/2004 | WO2004064135A1 Composite shape electroforming member, its electroforming master and method for manufacturing the same |
| 07/29/2004 | WO2004064120A2 Semiconductor package having non-ceramic based window frame |
| 07/29/2004 | WO2004064110A2 Space-efficient package for laterally conducting device |
| 07/29/2004 | WO2004064071A2 Tamper-resistant packaging and approach using magnetically-set data |
| 07/29/2004 | WO2004063980A1 Module for a hybrid card |
| 07/29/2004 | WO2004063639A2 3-dimensional high performance heat sinks |
| 07/29/2004 | WO2004062958A2 Integrated component |
| 07/29/2004 | WO2004044980A3 Hermetically encapsulated component and waferscale method for the production thereof |
| 07/29/2004 | WO2004038798A3 Stacked electronic structures including offset substrates |
| 07/29/2004 | WO2003081641A3 Support clip |
| 07/29/2004 | WO2003073356A8 Memory module assembly using partially defective chips |
| 07/29/2004 | WO2003061004A3 Method for coding and authenticating semiconductor circuits |
| 07/29/2004 | US20040148457 Semiconductor memory device |
| 07/29/2004 | US20040148120 Method and apparatus for monitoring integrated circuit fabrication |
| 07/29/2004 | US20040147736 Activated polyethylene glycol compounds |
| 07/29/2004 | US20040147710 Fluorinated aromatic polymer and use thereof |
| 07/29/2004 | US20040147702 Addition-curable silicone gel composition |
| 07/29/2004 | US20040147658 Resin containing dielectric filler for formation of built-in capactor layer of printed wiring board, copper double clad laminate having dielectric layer formed with resin containing dielectric filler, and process for producing copper double clad laminate |
| 07/29/2004 | US20040147137 Method for fabricating semiconductor devices |
| 07/29/2004 | US20040147127 Fabrication method of semiconductor integrated circuit device |
| 07/29/2004 | US20040147123 Chemical mechanical polishing slurry for ruthenium titanium nitride and polishing process using the same |
| 07/29/2004 | US20040147121 Method and system for manufacturing a semiconductor device |
| 07/29/2004 | US20040147117 Protection of low-k ILD during damascene processing with thin liner |
| 07/29/2004 | US20040147115 Two-step formation of etch stop layer |
| 07/29/2004 | US20040147106 Manufacturing of a semiconductor device with a reduced capacitance between wirings |
| 07/29/2004 | US20040147104 Method of barrier-less integration with copper alloy |
| 07/29/2004 | US20040147089 Encapsulated metal structures for semiconductor devices and MIM capacitors including the same |
| 07/29/2004 | US20040147087 Adjustable 3D capacitor |
| 07/29/2004 | US20040147081 Dual-trench isolated crosspoint memory array and method for fabricating same |
| 07/29/2004 | US20040147063 Lead frame, method of manufacturing the same, semiconductor device using lead frame and method of manufacturing semiconductor device |
| 07/29/2004 | US20040147061 Clip-type lead frame for source mounted die |
| 07/29/2004 | US20040147060 Ball grid array package having improved reliability and method of manufacturing the same |
| 07/29/2004 | US20040147056 Micro-fabricated device and method of making |
| 07/29/2004 | US20040147051 Miniature optical element for wireless bonding in an electronic instrument |
| 07/29/2004 | US20040147048 Balancing planarization of layers and the effect of underlying structure on the metrology signal |
| 07/29/2004 | US20040146707 Heat radiating sheet |
| 07/29/2004 | US20040145882 Heat dissipation assembly including heat sink and fan |
| 07/29/2004 | US20040145877 Sheet capacitor, IC socket using the same, and manufacturing method of sheet capacitor |