Patents
Patents for H01L 23 - Details of semiconductor or other solid state devices (226,155)
08/2004
08/04/2004EP1442265A1 Heat collector with mounting plate
08/04/2004EP1442153A1 Gcib processing to improve interconnection vias and improved interconnection via
08/04/2004EP1442081A1 Curable organopolysiloxane composition, use of the cured product of the composition, and semiconductor device
08/04/2004EP1292549B1 Material composite and production and use of the material composite
08/04/2004EP0792462B1 Probe card assembly and method of using the same
08/04/2004CN2631195Y 散热片结构 Fin structure
08/04/2004CN2631041Y Low-voltage semiconductor overvoltage protecting device
08/04/2004CN2631040Y Central welding pad memory body piled-up packing assembly
08/04/2004CN2631039Y Radiator fastening device
08/04/2004CN2631038Y Bare cystal-shape integrated circuit packing assembly
08/04/2004CN2630922Y Separate radiator and desk type computer CPU radiating structure improvement
08/04/2004CN2630921Y Pump-free liquid radiating device for microelectronic device
08/04/2004CN1518797A Antifuse reroute of dies
08/04/2004CN1518767A Low profile integrated module interconnects
08/04/2004CN1518764A Method of preventing bridge between polycrystalline micro-scale features
08/04/2004CN1518763A Extension of fatigue life for C4 solder ball in chip to substrate connection
08/04/2004CN1518762A Hybrid low kinterconnect structure comprised of 2 spin-on dielectric materials
08/04/2004CN1518578A Curing agent for epoxy resins and epoxy resin composition
08/04/2004CN1518133A Luminous device with dependent voltage/resistance layer
08/04/2004CN1518119A Structure of complementary metal oxide semiconductor image sensor and its manufacturing method
08/04/2004CN1518115A Semiconductor device
08/04/2004CN1518112A Semiconductor device and its manufacturing method
08/04/2004CN1518106A 半导体器件 Semiconductor devices
08/04/2004CN1518105A Semiconductor chip, semiconductor wafer and semiconductor device and its manufacturing method
08/04/2004CN1518104A 半导体器件 Semiconductor devices
08/04/2004CN1518103A ESD protective element structure
08/04/2004CN1518102A ESD protective circuit element
08/04/2004CN1518101A Semiconductor device with Cu interconnection and its manufacturing method
08/04/2004CN1518099A Lead frame and its manufacturing method and semiconductor device using the lead frame
08/04/2004CN1518098A Slot-type heat pipe and its manufacturing method
08/04/2004CN1518097A Energy transfer method and device with unidirectional airflow and hollow cavity
08/04/2004CN1518094A Manufacturing method of semiconductor device and semiconductor device
08/04/2004CN1518093A Semiconductor device and its manufacturing method
08/04/2004CN1518092A Semiconductor device and its manufacturing method
08/04/2004CN1518091A Manufacturing method of inlaid metal and its structure
08/04/2004CN1518088A Method for manufacturing metal insulator metal capacitor and resistor at the same gradation
08/04/2004CN1518087A Wiring pattern embedding checking method, semiconductor device manufacturing method and checking device
08/04/2004CN1518083A Thin film type carrier band for mounting electronic device and final defect labelling method of using the carrier band
08/04/2004CN1518081A Lead forming device and method of semiconductor element
08/04/2004CN1518080A Electronic element packaging structure and its manufacturing method
08/04/2004CN1518078A Wiring substrate and its manufacturing method, semiconductor device, electronic module and electronic instrument
08/04/2004CN1518075A Organic insulating film, its manufacturing method, semiconductor device using the organic insulating film and its manufacturing method
08/04/2004CN1518071A Method and equipment for applying adhesive tape
08/04/2004CN1518069A Polished semiconductor chip and its manufacturing method
08/04/2004CN1518068A Semiconductor substrate, its manufacturing method and manufacturing method of semiconductor device
08/04/2004CN1518067A Manufacturing method of semiconductor device
08/04/2004CN1518062A Manufacturing method of thin film element, thin film transistor circuit board, active matrix display device
08/04/2004CN1518060A Metal element, semiconductor device, electronic device and electronic equipment and its manufacturing method
08/04/2004CN1518059A Semiconductor device and its manufacturing method
08/04/2004CN1518020A Sheet solid electrolytic condensor with small size and simple structure
08/04/2004CN1517752A Display device and its manufacturing method
08/04/2004CN1517153A Pad coating system and its interlocking method
08/04/2004CN1161010C Method for producing interconnections with electrically conductive cross connections between top and bottom part of substrate and interconnections having such cross connections on substrate
08/04/2004CN1160855C Improvement of activation speed of signal wiring line in semiconductor integrated circuit and method for raising start speed of signal wiring
08/04/2004CN1160790C High-frequency module and method of manufacture thereof
08/04/2004CN1160789C Static discharge protection component capable of recording static discharge
08/04/2004CN1160788C Electrostatic protector of chip
08/04/2004CN1160787C Package for electronic component
08/04/2004CN1160786C Semiconductor device with deep substrate contacts
08/04/2004CN1160784C Radio frequency power amplification module
08/04/2004CN1160783C Semiconductor device which improves heat reliability
08/04/2004CN1160782C 半导体集成电路装置 The semiconductor integrated circuit device
08/04/2004CN1160781C Discrete semiconductor device and method for producing the same
08/04/2004CN1160780C Multi-layer solder band for semiconductor substrates and process thereof
08/04/2004CN1160779C Semiconductor element-mounting board, manufacturing method for board, semiconductor device and manufacturing method for device
08/04/2004CN1160775C Method for forming integrated circuit
08/04/2004CN1160773C Method for manufacturing semiconductor device
08/04/2004CN1160772C Semiconductor device and making method thereof
08/04/2004CN1160766C Semiconductor device and manufacturing method thereof
08/04/2004CN1160392C Phenolic resin, epoxy resin, and processes for producing these
08/03/2004US6772356 System for specifying core voltage for a microprocessor by selectively outputting one of a first, fixed and a second, variable voltage control settings from the microprocessor
08/03/2004US6772025 Device “ID” encoding with use of protection devices
08/03/2004US6771806 Multi-pixel methods and apparatus for analysis of defect information from test structures on semiconductor devices
08/03/2004US6771508 Method and apparatus for cooling an electronic component
08/03/2004US6771507 Power module for multi-chip printed circuit boards
08/03/2004US6771506 Heat sink fastener
08/03/2004US6771502 Heat sink made from longer and shorter graphite sheets
08/03/2004US6771500 System and method for direct convective cooling of an exposed integrated circuit die surface
08/03/2004US6771487 Power electronics component with improved thermal properties
08/03/2004US6771484 Multi-layer capacitor, wiring board, and high-frequency circuit
08/03/2004US6770982 Semiconductor device power distribution system and method
08/03/2004US6770981 Composite interposer for BGA packages
08/03/2004US6770980 Semiconductor device having semiconductor element packaged on interposer
08/03/2004US6770979 Semiconductor package and substrate thereof
08/03/2004US6770978 Metal line, method for fabricating the metal line, thin film transistor employing the metal line and display device
08/03/2004US6770977 Semiconductor device and method for fabricating the same
08/03/2004US6770975 Integrated circuits with multiple low dielectric-constant inter-metal dielectrics
08/03/2004US6770973 Semiconductor apparatus including a multi-layer wiring configuration and manufacturing method therefor
08/03/2004US6770971 Semiconductor device and method of fabricating the same
08/03/2004US6770970 High-frequency module, method of manufacturing thereof and method of molding resin
08/03/2004US6770967 Remote thermal vias for densely packed electrical assemblage
08/03/2004US6770966 Electronic assembly including a die having an integrated circuit and a layer of diamond to transfer heat
08/03/2004US6770965 Substrate with embedding resin containing thermoplastic resin, acid anhydride curing agent, curing accelerator and filler with specified particle size; low viscosity, high reliability by matching thermal expansion coefficients
08/03/2004US6770964 Semiconductor device including intermediate wiring element
08/03/2004US6770963 Multi-power ring chip scale package for system level integration
08/03/2004US6770962 Disposable mold runner gate for substrate based electronic packages
08/03/2004US6770961 Carrier frame and semiconductor package including carrier frame
08/03/2004US6770960 Transferring semiconductor crystal from a substrate to a resin
08/03/2004US6770959 Semiconductor package without substrate and method of manufacturing same
08/03/2004US6770958 Under bump metallization structure