| Patents for H01L 23 - Details of semiconductor or other solid state devices (226,155) |
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| 08/05/2004 | US20040150107 Stack package and fabricating method thereof |
| 08/05/2004 | US20040150106 Selectively coating bond pads |
| 08/05/2004 | US20040150105 Contact structure for reliable metallic interconnection |
| 08/05/2004 | US20040150104 Semiconductor device |
| 08/05/2004 | US20040150101 Information handling system |
| 08/05/2004 | US20040150100 Packaging of integrated circuits with carbon nano-tube arrays to enhance heat dissipation through a thermal interface |
| 08/05/2004 | US20040150099 Cavity down MCM package |
| 08/05/2004 | US20040150098 Multi-stack chip size packaging method |
| 08/05/2004 | US20040150097 Optimized conductive lid mounting for integrated circuit chip carriers |
| 08/05/2004 | US20040150096 Capping coating for 3D integration applications |
| 08/05/2004 | US20040150095 Multilayer; carrier and semiconductive chips; electroconductive and dielectric layers |
| 08/05/2004 | US20040150094 Stacked structure of integrated circuits |
| 08/05/2004 | US20040150091 Magnetic shielding for magnetic random access memory |
| 08/05/2004 | US20040150088 Semiconductor die package |
| 08/05/2004 | US20040150087 Method for removing impurities of a semiconductor wafer, semiconductor wafer assembly, and semiconductor device |
| 08/05/2004 | US20040150086 Semiconductor package having reduced thickness |
| 08/05/2004 | US20040150085 Semiconductor device having a chip-size package |
| 08/05/2004 | US20040150084 Semiconductor device |
| 08/05/2004 | US20040150082 Semiconductor device |
| 08/05/2004 | US20040150081 Multichip module, manufacturing method thereof, multichip unit and manufacturing method thereof |
| 08/05/2004 | US20040150080 Wire bonding pad for semiconductor chips |
| 08/05/2004 | US20040150079 Underfill compounds including electrically charged filler elements, microelectronic devices having underfill compounds including electrically charged filler elements, and methods of underfilling microelectronic devices |
| 08/05/2004 | US20040150078 Resin molded type semiconductor device and a method of manufacturing the same |
| 08/05/2004 | US20040150077 Lead frame and semiconductor device using this |
| 08/05/2004 | US20040150075 Semiconductor device with cupper wiring and method for manufacturing semiconductor device |
| 08/05/2004 | US20040150073 Semiconductor device having superior resistance to moisture |
| 08/05/2004 | US20040150072 Integrated circuit having an energy-absorbing structure |
| 08/05/2004 | US20040150070 Semiconductor device and method for manufacturing the same |
| 08/05/2004 | US20040150069 Dielectric stack |
| 08/05/2004 | US20040150068 Membrane 3D IC fabrication |
| 08/05/2004 | US20040150064 Optoelectronic component array and method for the production of an optoelectronic component array |
| 08/05/2004 | US20040150054 Controlling fuse by flow of metal from electrode into junction; forming electrode in contact aperture; covering; masking; isotropic etching |
| 08/05/2004 | US20040150045 LSI alleviating hysteresis of delay time |
| 08/05/2004 | US20040150026 Metal insulator metal capacitor |
| 08/05/2004 | US20040150013 Semiconductor device |
| 08/05/2004 | US20040150012 Chemical treatment of low-k dielectric films |
| 08/05/2004 | US20040150007 Semiconductor integrated circuit device |
| 08/05/2004 | US20040150000 Semiconductor device |
| 08/05/2004 | US20040149991 Flat-type capacitor for integrated circuit and method of manufacturing the same |
| 08/05/2004 | US20040149990 Array substrate for a liquid crystal display and method for fabricating thereof |
| 08/05/2004 | US20040149987 Thin film transistor with protective cap over flexible substrate, electronic device using the same, and manufacturing method thereof |
| 08/05/2004 | US20040149898 Injection-molded structure of an image sensor and method for manufacturing the same |
| 08/05/2004 | US20040149689 Method for producing metal/ceramic bonding substrate |
| 08/05/2004 | US20040149681 includes a substrate made of a glassfiber reinforced epoxy resin material and the permanent solder mask has an even and smooth outer surface |
| 08/05/2004 | US20040149490 Coaxial via hole and process of fabricating the same |
| 08/05/2004 | US20040149489 Electronic module and method for assembling same |
| 08/05/2004 | US20040149479 Polymer-embedded solder bumps for reliable plastic package attachment |
| 08/05/2004 | US20040149423 Heat sink for convection cooling in horizontal applications |
| 08/05/2004 | US20040149368 Process for the constrained sintering of asymmetrically configured dielectric layers |
| 08/05/2004 | US20040149085 Heating solution of tungsten or molybdenum and copper oxide or silver oxide in aqueous hydroxide solution; forming silver or copper particles while adhered to molybdenum or tungsten; no reduction |
| 08/05/2004 | US20040148959 Remedies to prevent cracking in a liquid system |
| 08/05/2004 | US20040148954 Temperature control apparatus and method |
| 08/05/2004 | US20040148774 Method for manufacturing and packaging integrated circuit |
| 08/05/2004 | US20040148773 Angled flying lead wire bonding process |
| 08/05/2004 | US20040148765 Electronic package repair process |
| 08/05/2004 | DE202004008768U1 Computer-Kühlsystem Computer cooling system |
| 08/05/2004 | DE202004008119U1 Sprung adapter for heat conducting pipes for cooling a CPU has a heat conducting plate that is pressed against the processor using a spring mechanism with holes through the plate in which the pipes run |
| 08/05/2004 | DE202004008118U1 Adapter for heat conducting pipes for cooling a processor or chip set has a pressure plate and fastening elements with which it is held in a rigid or sprung manner against the cooling surface of the processor or chip set |
| 08/05/2004 | DE202004007912U1 Fastening module for a processor cooling unit has a film that is detachably connected at least partially between the processor and its socket, in order to indicate if a processor or socket has been damaged by incorrect handling |
| 08/05/2004 | DE10358556A1 Ausbildung selbstjustierender Kontakte unter Verwendung von Doppelten-SiN-Abstandschichten Training self-aligning contacts using double-SiN spacer layers |
| 08/05/2004 | DE10349185A1 Halbleiterbaugruppe Semiconductor package |
| 08/05/2004 | DE10339239A1 Leistungs-Halbleitereinrichtung Power semiconductor device |
| 08/05/2004 | DE10326083A1 Rippenkonstruktion und Baugruppe mit einer solchen Rib construction and assembly of such a |
| 08/05/2004 | DE10304835A1 Laminated microelectromechanical component, e.g. rotation rate sensor, micro swing mirror, acceleration sensor, comprises electric conductive structure integrated in functional layer |
| 08/05/2004 | DE10303950A1 Steuerelektronik für ein Flurförderzeug, insbesondere deichselgeführtes Flurförderzeug Control electronics for a truck, especially drawbar-run truck |
| 08/05/2004 | DE10302623A1 Halbleiterstruktur mit einer reduzierten Anschlußkapazität sowie ein Verfahren zum Herstellen der Halbleiterstruktur Semiconductor structure having a reduced terminal capacity and a method for manufacturing the semiconductor structure |
| 08/05/2004 | DE10302611A1 Polished semiconductor wafer used in the production of an electronic component has a front side and a rear side with a maximum deviation of planarity of the rear side from the ideal plane lies in the region |
| 08/05/2004 | DE10301480A1 Manufacturing pins, especially for semiconducting components, involves coating pin or section of pin with separate metal coating only after final stamping out of pin from base body |
| 08/05/2004 | DE10301243A1 Verfahren zum Herstellen einer integrierten Schaltungsanordnung, insbesondere mit Kondensatoranordnung, sowie integrierte Schaltungsanordnung A method of fabricating an integrated circuit arrangement, in particular with the capacitor arrangement, and integrated circuit arrangement |
| 08/05/2004 | DE10297094T5 Aktiver Strom/Erde ESD Trigger Active power / ground ESD trigger |
| 08/05/2004 | DE10249205B3 Leistungsbauelementanordnung zur mechatronischen Integration von Leistungsbauelementen Power component assembly for mechatronic integration of power devices |
| 08/05/2004 | DE10215355B4 Verfahren zur Flip-Chip-Montage von Halbleiterchips A method for flip-chip mounting of semiconductor chips |
| 08/05/2004 | DE102004002659A1 Semiconductor device e.g. dynamic random access memory device, includes contact patterns and spacers formed on sidewall of wiring forming contact hole regions |
| 08/05/2004 | DE102004002417A1 Kontaktstellenbeschichtungssystem und Verriegelungsverfahren dafür Contact points coating system and locking method therefor |
| 08/04/2004 | EP1443811A2 High speed circuit board and method for fabrication |
| 08/04/2004 | EP1443809A2 Electronic circuit unit and method for manufacturing the same |
| 08/04/2004 | EP1443662A2 One chipped-direct conversion transceiver for reducing dc offset and a method of manufacturing the same |
| 08/04/2004 | EP1443568A2 Micro-fabricated device with thermoelectric device and method of making |
| 08/04/2004 | EP1443567A2 Modular emitter device and manufacturing method thereof |
| 08/04/2004 | EP1443561A2 Stacked chip electronic package having laminate carrier and method of making same |
| 08/04/2004 | EP1443560A2 Multi-chip electronic package having laminate carrier and method of making same |
| 08/04/2004 | EP1443559A2 Integrated circuit assembly module |
| 08/04/2004 | EP1443558A1 Semiconductor device |
| 08/04/2004 | EP1443557A2 Semiconductor device and method for manufacturing the same |
| 08/04/2004 | EP1443556A2 Method of manufacturing thin film element, thin film transistor circuit substrate, active matrix display device, electro-optical device, and electronic apparatus |
| 08/04/2004 | EP1443555A2 Semiconductor device and method of manufacturing the same |
| 08/04/2004 | EP1443554A1 Package for semiconductor devices |
| 08/04/2004 | EP1443552A2 Semiconductor device and method of fabricating semiconductor device |
| 08/04/2004 | EP1443551A2 Semiconductor device manufacturing method for improving adhesiveness of copper metal layer to barrier layer |
| 08/04/2004 | EP1443548A2 Composite metal column for mounting semiconductor device |
| 08/04/2004 | EP1443547A2 Method for efficient capillary underfill |
| 08/04/2004 | EP1443544A2 Semiconductor substrate, method for fabricating the same, and method for fabricating a semiconductor device |
| 08/04/2004 | EP1443017A2 Multi-metal layer MEMS structure and process for making the same |
| 08/04/2004 | EP1443016A2 Micro-Fabricated device and method of making same |
| 08/04/2004 | EP1443014A1 Electronic control for industrial truck, especially towbar guided industrial truck |
| 08/04/2004 | EP1442481A1 Integrated circuit bus grid having wires with pre-selected variable widths |
| 08/04/2004 | EP1442480A1 Device for the hermetic encapsulation of a component that must be protected against all stresses |
| 08/04/2004 | EP1442479A2 Method of forming reliable cu interconnects |
| 08/04/2004 | EP1442474A2 Process for forming metallized contacts to periphery transistors |
| 08/04/2004 | EP1442266A1 HIGH HEAT FLUX SINGLE−PHASE HEAT EXCHANGER |