Patents
Sitemap › H01 - Basic electric elements › H01L - Semiconductor devices; Electric solid state devices not otherwise provided for › H01L 23 - Details of semiconductor or other solid state devices
Patents for H01L 23 - Details of semiconductor or other solid state devices (226,155)
02/2014
02/20/2014US20140048952 Semiconductor device including through via structures and redistribution structures
02/20/2014US20140048951 Semiconductor assembly with dual connecting channels between interposer and coreless substrate
02/20/2014US20140048950 Thermally enhanced semiconductor assembly with embedded semiconductor device and built-in stopper and method of making the same
02/20/2014US20140048949 Thermally enhanced interconnect substrate with embedded semiconductor device and built-in stopper and method of making the same
02/20/2014US20140048948 Semiconductor memory device including alignment key structures
02/20/2014US20140048947 System package
02/20/2014US20140048946 Sensor packages and method of packaging dies of various sizes
02/20/2014US20140048945 Nonvolatile memory device and a method for fabricating the same
02/20/2014US20140048944 Interconnect substrate with embedded semiconductor device and built-in stopper and method of making the same
02/20/2014US20140048943 Semiconductor Constructions, Methods of Forming Conductive Structures and Methods of Forming DRAM Cells
02/20/2014US20140048942 Mounted structure
02/20/2014US20140048941 Contact Pads with Sidewall Spacers and Method of Making Contact Pads with Sidewall Spacers
02/20/2014US20140048940 Conductive Lines and Pads and Method of Manufacturing Thereof
02/20/2014US20140048939 Semiconductor device having metal plug and method of manufacturing the same
02/20/2014US20140048938 Semiconductor device and method for fabricating the same
02/20/2014US20140048937 Semiconductor device and method for manufacturing the same
02/20/2014US20140048936 High temperature interconnect assemblies for high temperature electronics utilizing transition pads
02/20/2014US20140048935 Integrated circuit device
02/20/2014US20140048934 Method to control underfill fillet width
02/20/2014US20140048933 Semiconductor device including a buffer layer structure for reducing stress
02/20/2014US20140048932 Semiconductor Device and Method of Dual-Molding Die Formed on Opposite Sides of Build-Up Interconnect Structure
02/20/2014US20140048931 Solder on trace technology for interconnect attachment
02/20/2014US20140048930 Conductive bump, semiconductor chip and stacked semiconductor package using the same
02/20/2014US20140048929 Bonded Structures for Package and Substrate
02/20/2014US20140048928 Multi-Chip Module with Multiple Interposers
02/20/2014US20140048927 Method to improve fine cu line reliability in an integrated circuit device
02/20/2014US20140048926 Semiconductor package and method of manufacturing the same
02/20/2014US20140048925 Integrated circuit
02/20/2014US20140048924 Ridged integrated heat spreader
02/20/2014US20140048923 Semiconductor Package for High Power Devices
02/20/2014US20140048922 Semiconductor device and method of manufacturing the same
02/20/2014US20140048921 Encapsulated arrays of electronic switching devices
02/20/2014US20140048920 Selective Leadframe Planishing
02/20/2014US20140048919 Integrated circuit packaging system with array contacts and method of manufacture thereof
02/20/2014US20140048918 Semiconductor device and method of manufacturing the same
02/20/2014US20140048917 Em protected semiconductor die
02/20/2014US20140048916 Wiring board with shielding lid and shielding slots as electromagnetic shields for embedded device
02/20/2014US20140048915 Shielding structure for transmission lines
02/20/2014US20140048914 Wiring board with embedded device and electromagnetic shielding
02/20/2014US20140048913 Electronic devices including emi shield structures for semiconductor packages and methods of fabricating the same
02/20/2014US20140048910 Substrate structure and method for manufacturing same
02/20/2014US20140048908 Semiconductor substrate assembly
02/20/2014US20140048907 Power tsvs of semiconductor device
02/20/2014US20140048906 Semiconductor Device and Method of Forming a Fan-Out PoP Device with PWB Vertical Interconnect Units
02/20/2014US20140048905 Low cost anti-fuse structure
02/20/2014US20140048904 Semiconductor Device, Integrated Circuit and Manufacturing Method Thereof
02/20/2014US20140048884 Disposable carbon-based template layer for formation of borderless contact structures
02/20/2014US20140048497 Frame Using Interior Connectors for Holding Highly-Concentrated Solar Cells
02/20/2014US20140048236 Direct semiconductor contact ebullient cooling package
02/20/2014US20140047702 Thermal expansion-enhanced heat sink for an electronic assembly
02/20/2014DE10306279B4 Halbleiteranordnung mit breiter Leiterbahn in äusserstem Schaltkreis A semiconductor device having a broad strip conductor in extreme circuit
02/20/2014DE10258780B4 Anti-Fuse-Schaltung und Anti-Fuse-System Anti-fuse circuit and anti-fuse system
02/20/2014DE102013214483A1 Feldemissionsvorrichtungen und Verfahren zu ihrer Herstellung Field emission devices and methods for their preparation
02/20/2014DE102013108813A1 Anschlussflächen mit Seitenwandabstandshaltern und Verfahren zum Herstellen von Anschlussflächen mit Seitenwandabstandshaltern Pads with sidewall spacers and method of manufacturing pads of sidewall spacers
02/20/2014DE102013108268A1 Pad-Seitenwand-Abstandshalter und Verfahren zur Herstellung von Pad-Seitenwand-Abstandshaltern Pad sidewall spacers and methods for the production of pad-side wall spacers
02/20/2014DE102013104397A1 Halbleiterpackage und Verfahren zur Herstellung desselben Semiconductor package and method for manufacturing the same
02/20/2014DE102012214491A1 Leuchtmodul und Verfahren zur Herstellung eines derartigen Leuchtmoduls Light-emitting module and method of manufacturing such a light-emitting module
02/20/2014DE102012214487A1 Band-shaped light emitting module e.g. LED module has two portions that are formed separately and bonded directly, so that shining tape encapsulated into polymeric material of first portion is formed downstream to second portion
02/20/2014DE102012214411A1 Vorrichtung und verfahren zum herstellen hermetisch dichter kavitäten Cavities hermetically sealed device and process for the manufacture
02/20/2014DE102012213917A1 Bauelemente-Ummantelung für ein Elektronikmodul Components jacket for an electronics module
02/20/2014DE102012207310B4 Halbleitervorrichtung Semiconductor device
02/20/2014DE102009044863B4 Halbleiter-Bauelement und Verfahren zum Herstellen eines Halbleiter-Bauelements A semiconductor device and method of manufacturing a semiconductor device
02/20/2014DE102009042319B4 Verfahren zur Herstellung eines Sensorknoten-Moduls A method for producing a sensor node module
02/20/2014DE102008064373B4 Halbleiteranordnung und Verfahren zur Herstellung einer Halbleiteranordnung A semiconductor device and method of manufacturing a semiconductor device
02/19/2014EP2698819A1 High-frequency package
02/19/2014EP2698817A1 Semiconductor device and method for manufacturing semiconductor device
02/19/2014EP2698746A2 Method and system for secure configuration of an electronic device via an RFID IC
02/19/2014EP2697831A1 Hemt transistors consisting of (iii-b)-n wide bandgap semiconductors comprising boron
02/19/2014EP2697827A1 Cooling device for an electronic module of a household appliance, and assembly and domestic appliance comprising a cooling device
02/19/2014CN203446164U Heat dissipation fin
02/19/2014CN203445115U Silicon substrate radio frequency filter capacitor bank
02/19/2014CN203445114U Chip architecture having negative voltage protection
02/19/2014CN203445113U Layout structure of circuit of open-collector output type
02/19/2014CN203445112U Frame lead bonding tool
02/19/2014CN203445111U Section copper strip TO-252 packaging lead wire framework
02/19/2014CN203445110U Pasting integrated circuit block
02/19/2014CN203445109U Thickened IC chip
02/19/2014CN203445108U Chip packaging and switching board and circuit board with chip packaging and switching board
02/19/2014CN203445107U Internal isolated heat-dissipation structure of ballast
02/19/2014CN203445106U CPU cooling device
02/19/2014CN203444218U Array substrate and display device
02/19/2014CN203438608U Enhanced graphite heat-dissipation film
02/19/2014CN103597916A Built-up substrate, method for manufacturing same, and semiconductor integrated circuit package
02/19/2014CN103597596A Signal routing using through-substrate vias
02/19/2014CN103597595A Wire bondable surface for microelectronic devices
02/19/2014CN103597594A Microelectronic substrate for alternate package functionality
02/19/2014CN103597593A Chip packages including through-silicon via dice with vertically integrated phased-array antennas and low-frequency and power delivery substrates
02/19/2014CN103597591A Cooling structure for semiconductor element
02/19/2014CN103597588A Nitride semiconductor device
02/19/2014CN103597309A Sealed casing
02/19/2014CN103596354A Hybrid wiring board with built-in stopper, interposer and build-up circuitry
02/19/2014CN103594473A Nonvolatile memory device and method for fabricating the same
02/19/2014CN103594464A COB packaging structure of light-emitting diode
02/19/2014CN103594458A Lining plate structure
02/19/2014CN103594457A Transparent capacitor
02/19/2014CN103594456A Transparent capacitor with roughened surfaces
02/19/2014CN103594455A Wireless IC device
02/19/2014CN103594454A Protecting ring structure for preventing test structure short circuit during packaging
02/19/2014CN103594453A Test structure for dielectric breakdown reliability analysis in integrated circuit and test method thereof
02/19/2014CN103594452A A semiconductor multilayer structure and a manufacturing method thereof
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