| Patents for H01L 23 - Details of semiconductor or other solid state devices (226,155) |
|---|
| 08/10/2004 | US6774298 Thermoelectric module and method of producing the same |
| 08/10/2004 | US6774049 Electroless deposition of doped noble metals and noble metal alloys |
| 08/10/2004 | US6774041 Polishing method, metallization fabrication method, method for manufacturing semiconductor device and semiconductor device |
| 08/10/2004 | US6774036 Integrated circuit trenched features and method of producing same |
| 08/10/2004 | US6774035 Thermal processing of metal alloys for an improved CMP process in integrated circuit fabrication |
| 08/10/2004 | US6774027 Semiconductor device and method for manufacturing the same |
| 08/10/2004 | US6774024 Semiconductor integrated circuit device having multilevel interconnection |
| 08/10/2004 | US6774023 Method of manufacturing a semiconductor device having a multilayer structure including a dual-layer silicide |
| 08/10/2004 | US6774020 Semiconductor device and method of manufacturing the same |
| 08/10/2004 | US6773967 Method to prevent antifuse Si damage using sidewall spacers |
| 08/10/2004 | US6773966 Method of manufacturing semiconductor device |
| 08/10/2004 | US6773965 Semiconductor device, ball grid array connection system, and method of making |
| 08/10/2004 | US6773964 Integrated circuit package including sealed gaps and prevention of vapor induced failures and method of manufacturing the same |
| 08/10/2004 | US6773963 Apparatus and method for containing excess thermal interface material |
| 08/10/2004 | US6773961 Singulation method used in leadless packaging process |
| 08/10/2004 | US6773960 Methods for forming a slot with a laterally recessed area at an end thereof through an interposer or other carrier substrate |
| 08/10/2004 | US6773956 Method for contact-connecting a semiconductor component |
| 08/10/2004 | US6773952 Semiconductor chip structures with embedded thermal conductors and a thermal sink disposed over opposing substrate surfaces |
| 08/10/2004 | US6773947 Method of manufacturing semiconductor device including an opening formed by a laser |
| 08/10/2004 | US6773937 Method of verifying a mask for a mask ROM |
| 08/10/2004 | US6773933 Method of boosting wafer cleaning efficiency and increasing process yield |
| 08/10/2004 | US6773828 A lead frame, for example, made of a copper alloy may be plated with a layer of solder to facilitate soldering or wire bonding to the lead frame during an integrated circuit packaging process |
| 08/10/2004 | US6773536 Method and apparatus for bonding protection film onto silicon wafer |
| 08/10/2004 | US6773247 Die used for resin-sealing and molding an electronic component |
| 08/10/2004 | US6772603 Methods and apparatus for thermal management of vehicle systems and components |
| 08/10/2004 | US6772514 Method of machining glass substrate and method fabricating high-frequency circuit |
| 08/10/2004 | US6772511 Method for producing a semiconductor device |
| 08/10/2004 | US6772510 Mapable tape apply for LOC and BOC packages |
| 08/05/2004 | WO2004066699A1 Multi-layer ceramic substrate and method for manufacture thereof |
| 08/05/2004 | WO2004066697A1 Multilayer printed wiring board and process for producing the same |
| 08/05/2004 | WO2004066477A2 Semiconducting island as active layer in fet |
| 08/05/2004 | WO2004066385A2 Semiconductor structure having a reduced connecting capacitance and method for producing the semiconductor structure |
| 08/05/2004 | WO2004066383A1 Titanium underlayer for lines in semiconductor devices |
| 08/05/2004 | WO2004066307A2 Stacked memory cell having diffusion barriers |
| 08/05/2004 | WO2004065866A1 Cooling device of hybrid-type |
| 08/05/2004 | WO2004065660A1 Metal photo-etching product and production method therefor |
| 08/05/2004 | WO2004065486A1 Epoxy resin composition and semiconductor device made with the same |
| 08/05/2004 | WO2004065042A2 Electrochemical displacement-deposition method for making composite metal powders |
| 08/05/2004 | WO2004053931A3 Package having exposed integrated circuit device |
| 08/05/2004 | WO2004049438A3 Method for producing a calibration wafer |
| 08/05/2004 | WO2004042800A3 Semiconductor arrangement |
| 08/05/2004 | WO2004034427B1 Semiconductor packages, lead-containing solders and anodes and methods of removing alpha-emitters from materials |
| 08/05/2004 | WO2003094209A3 Use of conductive electrolessly deposided etch stop layers, liner layers and via plugs in interconnect structures |
| 08/05/2004 | WO2003085727A3 Semiconductor chip comprising a protective layer and a corresponding production method |
| 08/05/2004 | WO2003016811A3 Device using a medium having a high heat transfer rate |
| 08/05/2004 | US20040153279 Method and apparatus for monitoring integrated circuit fabrication |
| 08/05/2004 | US20040153275 Novel test structure for detecting bridging of DRAM capacitors |
| 08/05/2004 | US20040152829 Thermally conductive polymer molded article and method for producing the same |
| 08/05/2004 | US20040152804 Epoxy resin encapsulated semiconductor resin and foaming agent for halogen free polymer |
| 08/05/2004 | US20040152348 Socket for mating with electronic component, particularly semiconductor device with spring packaging, for fixturing, testing, burning-in or operating such a component |
| 08/05/2004 | US20040152336 Semiconductor device and its manufacturing method |
| 08/05/2004 | US20040152334 Organic insulating film, manufacturing method thereof, semiconductor device using such organic insulating film and manufacturing method thereof |
| 08/05/2004 | US20040152307 Integrated circuit structure with copper interconnect |
| 08/05/2004 | US20040152306 Semiconductor device manufacturing method for improving adhesivity of copper metal layer to barrier layer |
| 08/05/2004 | US20040152301 Method and apparatus for forming improved metal interconnects |
| 08/05/2004 | US20040152297 Semiconductor device and manufacturing method thereof |
| 08/05/2004 | US20040152294 Method for forming metal line of semiconductor device |
| 08/05/2004 | US20040152281 Semiconductor device having element isolation structure |
| 08/05/2004 | US20040152270 Method of forming an alignment mark structure using standard process steps for forming vertical gate transistors |
| 08/05/2004 | US20040152261 Magnetic shielding for magnetic random access memory card |
| 08/05/2004 | US20040152258 Semiconductor device and method of manufacturing the same |
| 08/05/2004 | US20040152256 Semiconductor device manufacturing method |
| 08/05/2004 | US20040152243 Semiconductor device and a method of manufacturing the same and designing the same |
| 08/05/2004 | US20040152242 Device package utilizing interconnect strips to make connections between package and die |
| 08/05/2004 | US20040152241 Circuit device manufacturing method |
| 08/05/2004 | US20040152240 Method and apparatus for the use of self-assembled nanowires for the removal of heat from integrated circuits |
| 08/05/2004 | US20040152235 Double side stack packaging method |
| 08/05/2004 | US20040152234 Circuit device manufacturing method |
| 08/05/2004 | US20040152233 Method and system for machine vision-based feature detection and mark verification in a workpiece or wafer marking system |
| 08/05/2004 | US20040152222 Method of assessing lateral dopant and/or charge carrier profiles |
| 08/05/2004 | US20040152220 Method of making a monitoring pattern to measure a depth and a profile of a shallow trench isolation |
| 08/05/2004 | US20040151893 Low temperature method and composition for producing electrical conductors |
| 08/05/2004 | US20040151885 Polymer matrices for polymer solder hybrid materials |
| 08/05/2004 | US20040151882 Wiring board with core layer containing inorganic filler |
| 08/05/2004 | US20040151505 Small form factor optical transceiver with extended transmission range |
| 08/05/2004 | US20040151025 Uv-blocking layer for reducing uv-induced charging of sonos dual-bit flash memory devices in beol processing |
| 08/05/2004 | US20040150977 Ball grid array package with an electromagnetic shield connected directly to a printed circuit board |
| 08/05/2004 | US20040150974 Mounting structure for ball grid array type IC |
| 08/05/2004 | US20040150969 High speed circuit board and method for fabrication |
| 08/05/2004 | US20040150968 Method for integrated high Q inductors in FCGBA packages |
| 08/05/2004 | US20040150966 Integrated library core for embedded passive components and method for forming electronic device thereon |
| 08/05/2004 | US20040150962 Making contact with semiconductor chips in chip cards |
| 08/05/2004 | US20040150957 Cooling apparatus for stacked components |
| 08/05/2004 | US20040150956 Pin fin heat sink for power electronic applications |
| 08/05/2004 | US20040150954 Power module for multi-chip printed circuit boards |
| 08/05/2004 | US20040150953 Microprocessor-heat slug fastening frame |
| 08/05/2004 | US20040150940 Thin film capacitor and fabrication method thereof |
| 08/05/2004 | US20040150939 MEMS-based variable capacitor |
| 08/05/2004 | US20040150489 On-carrier impedance transform network |
| 08/05/2004 | US20040150417 Integrated circuit with junction temperature sensing diode |
| 08/05/2004 | US20040150273 Press-fitting method and rectifying device having press-fitted member |
| 08/05/2004 | US20040150119 Wafer level assembly package |
| 08/05/2004 | US20040150118 Warp-suppressed semiconductor device |
| 08/05/2004 | US20040150116 Thermal enhance MCM package |
| 08/05/2004 | US20040150115 Electronic device, method of manufacturing the same, and electronic instrument |
| 08/05/2004 | US20040150114 Multi-chip electronic package having laminate carrier and method of making same |
| 08/05/2004 | US20040150113 Uniform profile; connecting semiconductors |
| 08/05/2004 | US20040150112 Semiconductor device and method of fabrication same |
| 08/05/2004 | US20040150110 Semiconductor device and method for manufacturing the same |
| 08/05/2004 | US20040150108 Low resistance barrier for a microelectronic component and method for fabricating the same |