| Patents for H01L 23 - Details of semiconductor or other solid state devices (226,155) |
|---|
| 08/11/2004 | CN1519927A 半导体装置 Semiconductor device |
| 08/11/2004 | CN1519926A Semiconductor device and its mfg. method |
| 08/11/2004 | CN1519925A Semiconductor device and its mfg. method |
| 08/11/2004 | CN1519924A Semiconductor device and its mfg. method |
| 08/11/2004 | CN1519923A Semiconductor device and its mfg. method |
| 08/11/2004 | CN1519922A Semiconductor device and its mfg. method circuit substrate and electronic appts. |
| 08/11/2004 | CN1519921A Resin for encapsulating optical semiconductor component, appts, contg. same encapsulated component and its prodn method |
| 08/11/2004 | CN1519920A Semiconductor device and mfg. method for same |
| 08/11/2004 | CN1519919A Encapsulation structure for composite erystal |
| 08/11/2004 | CN1519918A Semiconductor integrated device and its mfg. method |
| 08/11/2004 | CN1519912A Semiconductor device with multilayer wiring layers and its mfg. method |
| 08/11/2004 | CN1519908A Semiconductor device and its mfg. method |
| 08/11/2004 | CN1519907A Carrier of holding and electrical contact individual separated wafer |
| 08/11/2004 | CN1519904A Casing. esp. for semiconductor device, foot of such semiconductor device and mfg. method of such foot |
| 08/11/2004 | CN1519902A Semiconductor device with remarkable water proof properties |
| 08/11/2004 | CN1519897A Method of mfg. semiconductor device for improving adhesion property of copper metalic butt barrier layer |
| 08/11/2004 | CN1519896A Electronic parts and semiconductor device, its mfg. method and mounting method, circuit substrate and electronic appts. |
| 08/11/2004 | CN1519890A Photomask group of forming multilayer interlconnection line and semiconductor device made by such photomask |
| 08/11/2004 | CN1519829A 半导体集成装置 Semiconductor integrated device |
| 08/11/2004 | CN1519795A Wiring substrate and electrooptic device and their mfg. method |
| 08/11/2004 | CN1519197A Zeolite sol and its prepn. method, compsn. for forming multiporous film, multiporous film and its prepn. method, interlayer insulation membrane and semiconductor device |
| 08/11/2004 | CN1519076A Welding method, component connection welded by such welding method and connection structure |
| 08/11/2004 | CN1162058C Chip support and its mfg. method |
| 08/11/2004 | CN1161839C Two-stage electrostatic discharge protecting circuit with acceleratively conducting secondary stage |
| 08/11/2004 | CN1161838C Package substrate |
| 08/11/2004 | CN1161835C Semiconductor device and making method thereof |
| 08/11/2004 | CN1161834C Semiconductor device and manufacture thereof |
| 08/11/2004 | CN1161833C Mfg. method of elctronic components |
| 08/11/2004 | CN1161832C Manufacture of semiconductor device |
| 08/11/2004 | CN1161823C Reinforcement material for silicon wafer and method of manufacturing IC chip using reinforcement material |
| 08/11/2004 | CN1161426C Electroconductive thick film paste and its producing process and laminated ceramic electronic element |
| 08/10/2004 | US6775197 Non-volatile memory element integratable with standard CMOS circuitry and related programming methods and embedded memories |
| 08/10/2004 | US6775171 Method of utilizing voltage gradients to guide dielectric breakdowns for non-volatile memory elements and related embedded memories |
| 08/10/2004 | US6775153 Semiconductor device and method of manufacture thereof, circuit board, and electronic instrument |
| 08/10/2004 | US6775150 Electronic assembly comprising ceramic/organic hybrid substrate with embedded capacitors and methods of manufacture |
| 08/10/2004 | US6775149 Multichip mounted structure, electro-optical apparatus, and electronic apparatus |
| 08/10/2004 | US6775145 Construction for high density power module package (case II) |
| 08/10/2004 | US6775141 Heat dissipation structure for use in combination with electronic circuit board |
| 08/10/2004 | US6775140 Heat spreaders, heat spreader packages, and fabrication methods for use with flip chip semiconductor devices |
| 08/10/2004 | US6775139 Structure for removable cooler |
| 08/10/2004 | US6775138 Heat sink clip with plurality of pressing portions |
| 08/10/2004 | US6775135 Heat isolation apparatus |
| 08/10/2004 | US6775122 Circuit board with added impedance |
| 08/10/2004 | US6774872 Flat display device |
| 08/10/2004 | US6774748 RF package with multi-layer substrate having coplanar feed through and connection interface |
| 08/10/2004 | US6774718 Power amplifier module for wireless communication devices |
| 08/10/2004 | US6774714 Semiconductor device provided with noise cut filter |
| 08/10/2004 | US6774702 Fuse trimming failure test circuit for CMOS circuit |
| 08/10/2004 | US6774660 Evaluating pattern for measuring an erosion of a semiconductor wafer polished by a chemical mechanical polishing |
| 08/10/2004 | US6774659 Method of testing a semiconductor package device |
| 08/10/2004 | US6774640 Substrate having reference point connected with layer being evaluated for shift of inner layer traces, and test points at distance from reference point; measuring presence of short between reference and test points indicates amount of shift |
| 08/10/2004 | US6774501 Resin-sealed semiconductor device, and die bonding material and sealing material for use therein |
| 08/10/2004 | US6774500 Substrate for semiconductor device, semiconductor chip mounting substrate, semiconductor device and method of fabrication thereof, and circuit board, together with electronic equipment |
| 08/10/2004 | US6774499 Non-leaded semiconductor package and method of fabricating the same |
| 08/10/2004 | US6774498 Flip-chip package substrate |
| 08/10/2004 | US6774496 Semiconductor package with a thermoset bond |
| 08/10/2004 | US6774495 Solder terminal and fabricating method thereof |
| 08/10/2004 | US6774494 Semiconductor device and manufacturing method thereof |
| 08/10/2004 | US6774493 Integrated circuit coated with thermosetting polymer, with hardened adhesive polymer underfill encapsulant including intermixed reaction product of thermosetting polymer and fluxing agent that chemically immobilizes flux and by-products |
| 08/10/2004 | US6774492 Chip package assembly having chip package mounted on printed circuit board |
| 08/10/2004 | US6774491 Conductive lines, coaxial lines, integrated circuitry, and methods of forming conductive lines, coaxial lines, and integrated circuitry |
| 08/10/2004 | US6774489 Dielectric layer liner for an integrated circuit structure |
| 08/10/2004 | US6774486 Circuit boards containing vias and methods for producing same |
| 08/10/2004 | US6774485 Apparatus for and method of packaging semiconductor devices |
| 08/10/2004 | US6774484 High frequency semiconductor device |
| 08/10/2004 | US6774482 Chip cooling |
| 08/10/2004 | US6774481 Solid-state image pickup device |
| 08/10/2004 | US6774480 Ball grid array type package using plurality of pieces of adhesive film to attach semiconductor die to substrate having conductive traces to alleviate thermal mismatch stress between semiconductor die and printed circuit board |
| 08/10/2004 | US6774479 Electronic device having a semiconductor chip on a semiconductor chip connection plate and a method for producing the electronic device |
| 08/10/2004 | US6774477 Structure and method of stacking multiple semiconductor substrates of a composite semiconductor device |
| 08/10/2004 | US6774474 Partially captured oriented interconnections for BGA packages and a method of forming the interconnections |
| 08/10/2004 | US6774473 Semiconductor chip module |
| 08/10/2004 | US6774472 Panel structure with plurality of chip compartments for providing high volume of chip modules |
| 08/10/2004 | US6774471 Protected bond fingers |
| 08/10/2004 | US6774470 Non-contact data carrier and method of fabricating the same |
| 08/10/2004 | US6774468 Power semiconductor device |
| 08/10/2004 | US6774467 Semiconductor device and process of production of same |
| 08/10/2004 | US6774466 Semiconductor device |
| 08/10/2004 | US6774465 Semiconductor power package module |
| 08/10/2004 | US6774464 Semiconductor device and method of manufacturing the same |
| 08/10/2004 | US6774458 Vertical interconnection structure and methods |
| 08/10/2004 | US6774457 Rectangular contact used as a low voltage fuse element |
| 08/10/2004 | US6774456 Configuration of fuses in semiconductor structures with Cu metallization |
| 08/10/2004 | US6774452 Semiconductor structure having alignment marks with shallow trench isolation |
| 08/10/2004 | US6774450 Semiconductor device with thermoelectric heat dissipating element |
| 08/10/2004 | US6774449 Device including gallium nitride compound semiconductor layer and schottky electrode having multilayer structure, bottom layer in contact with gallium nitride layer is made of silicon; excellent in adhesion |
| 08/10/2004 | US6774447 Package having an opening in a surface thereof for mounting a solid state image sensor |
| 08/10/2004 | US6774439 Semiconductor device using fuse/anti-fuse system |
| 08/10/2004 | US6774432 UV-blocking layer for reducing UV-induced charging of SONOS dual-bit flash memory devices in BEOL |
| 08/10/2004 | US6774425 Metal-insulator-metal capacitor and a method for producing same |
| 08/10/2004 | US6774414 Thin film transistor array panel for a liquid crystal display |
| 08/10/2004 | US6774395 Plurality of storage devices individually coupled with the plurality of tied and floating body devices; data processing; insulator on semiconductors |
| 08/10/2004 | US6774394 Inline detection device for self-aligned contact defects |
| 08/10/2004 | US6774388 Modified contact for programmable devices |
| 08/10/2004 | US6774340 Shape of microdot mark formed by laser beam and microdot marking method |
| 08/10/2004 | US6774327 Hermetic seals for electronic components |
| 08/10/2004 | US6774317 Connection components with posts |
| 08/10/2004 | US6774315 Floating interposer |
| 08/10/2004 | US6774314 Electronic device and coupler |
| 08/10/2004 | US6774306 Microelectronic connections with liquid conductive elements |