| Patents for H01L 23 - Details of semiconductor or other solid state devices (226,155) |
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| 08/12/2004 | US20040155362 improved mold die which of a semiconductor chip in a chip-array molding process; reduces the likelihood of shorts between bonding wires near those regions in which opposing flows of mold resin meet |
| 08/12/2004 | US20040155361 thickness is further reduced and the stress applied to lead members in an encapsulation resin is reduced, thereby realizing a high reliability |
| 08/12/2004 | US20040155360 thermally conductive material is in physical contact with at least one of the die first surface, second surface and sidewall surface to alleviate overheating |
| 08/12/2004 | US20040155359 at least one solder bump fills bump-through-hole to connect electrically with portion of trace part of said conductive strip and which protrudes outwardly from encapsulant layer |
| 08/12/2004 | US20040155358 First and second level packaging assemblies and method of assembling package |
| 08/12/2004 | US20040155357 [chip package structure and manufacturing process thereof] |
| 08/12/2004 | US20040155356 Ceramic circuit board and method for manufacturing the same |
| 08/12/2004 | US20040155355 Semiconductor device, method of fabricating the same, stack-type semiconductor device, circuit board and electronic instrument |
| 08/12/2004 | US20040155354 Semiconductor device, method of fabricating the same, stack-type semiconductor device, circuit board and electronic instrument |
| 08/12/2004 | US20040155352 Direct build-up layer on an encapsulated die package having a moisture barrier structure |
| 08/12/2004 | US20040155351 Semiconductor device and manufacturing method of that |
| 08/12/2004 | US20040155350 Semiconductor device having multi-layer interconnection structure |
| 08/12/2004 | US20040155349 Semiconductor device and method of fabricating the same |
| 08/12/2004 | US20040155348 Barrier structure for copper metallization and method for the manufacture thereof |
| 08/12/2004 | US20040155347 Vertical routing structure |
| 08/12/2004 | US20040155346 poor quality photo resist patterns are prevented because the focus area is confined to an exposure region |
| 08/12/2004 | US20040155345 configured by a logic circuit and a memory circuit and changing in function every certain time interval |
| 08/12/2004 | US20040155344 Semiconductor device and manufacturing method thereof |
| 08/12/2004 | US20040155342 Semiconductor device and manufacturing method thereof |
| 08/12/2004 | US20040155340 Silicon oxycarbide, growth method of silicon oxycarbide layer, semiconductor device and manufacture method for semiconductor device |
| 08/12/2004 | US20040155339 Method and packaging structure for optimizing warpage of flip chip organic packages |
| 08/12/2004 | US20040155338 of improved thermal and electrical conductivity by using conductive epoxy combined with solder ball interconnects to connect between a heat spreader and a ground pad of the package substrate |
| 08/12/2004 | US20040155337 High density chip level package for the packaging of integrated circuits and method to manufacture same |
| 08/12/2004 | US20040155336 Soldering method, component to be joined by the soldering method, and joining structure |
| 08/12/2004 | US20040155335 Surface mount solder method and apparatus for decoupling capacitance and process of making |
| 08/12/2004 | US20040155334 Epoxy resin composition and semiconductor device |
| 08/12/2004 | US20040155333 Integrated circuit devices with an auxiliary pad for contact hole alignment |
| 08/12/2004 | US20040155332 Semiconductor die package with reduced inductance and reduced die attach flow out |
| 08/12/2004 | US20040155331 Packaged microelectronic devices and methods for packaging microelectronic devices |
| 08/12/2004 | US20040155330 Semiconductor device and method of manufacturing the same, circuit board and electronic instrument |
| 08/12/2004 | US20040155329 Electronic assembly comprising solderable thermal interface and methods of manufacture |
| 08/12/2004 | US20040155328 Wafer-interposer assembly |
| 08/12/2004 | US20040155327 entire die stack is attached to the substrate with one motion thereby reducing the number of iterations as compared to the typical method |
| 08/12/2004 | US20040155326 Semiconductor devices, and manufacturing methods, circuit substrates and electronic equipments for the same |
| 08/12/2004 | US20040155325 Die-in heat spreader microelectronic package |
| 08/12/2004 | US20040155324 Semiconductor package for three-dimensional mounting, fabrication method thereof, and semiconductor device |
| 08/12/2004 | US20040155323 Semiconductor device |
| 08/12/2004 | US20040155322 multi-layered pattern leads with intervening insulating peripheral sealing portions formed between layers of the pattern leads allows pattern leads on different layers to cross, thereby increasing the flexibility in the arrangement of chip pads |
| 08/12/2004 | US20040155321 enabling solder package leads with pre-plated pure tin, while maintaining a palladium layer in the localized areas intended for wire bonding with its significant cost advantage over the traditional silver spot plated inner leads |
| 08/12/2004 | US20040155320 Method and apparatus for deposited hermetic cover for digital X-ray panel |
| 08/12/2004 | US20040155319 Fill pattern generation for spin-on glass and related self-planarization deposition |
| 08/12/2004 | US20040155318 plurality of contiguous semiconductor devices each separated by a scribe lane; signal line; and a plurality of electrical connections, each electrically coupling a different semiconductor devices to said signal line |
| 08/12/2004 | US20040155316 Evaluation wiring pattern and evaluation method for evaluating reliability of semiconductor device, and semiconductor device having the same pattern |
| 08/12/2004 | US20040155315 Circuits and methods to protect a gate dielectric antifuse |
| 08/12/2004 | US20040155300 Low voltage NMOS-based electrostatic discharge clamp |
| 08/12/2004 | US20040155297 Semiconductor device and manufacturing method for the same |
| 08/12/2004 | US20040155291 Electrostatic discharge device |
| 08/12/2004 | US20040155279 Semiconductor device and method and system for fabricating the same |
| 08/12/2004 | US20040155278 Semiconductor device, apparatus and method for manufacturing the same |
| 08/12/2004 | US20040155266 Method of manufacturing a semiconductor device and a device manufactured by the method |
| 08/12/2004 | US20040155251 Peltier cooler integrated with electronic device(s) |
| 08/12/2004 | US20040155018 Method and apparatus for cutting electrical wiring line on a substrate, and method and apparatus for manufacturing electronic device |
| 08/12/2004 | US20040154956 Stacked die module and techniques for forming a stacked die module |
| 08/12/2004 | US20040154830 Ceramic circuit board and method for manufacturing the same |
| 08/12/2004 | US20040154742 Recognition device, bonding device, and method of manufacturing a circuit device |
| 08/12/2004 | US20040154722 Stacked die module and techniques for forming a stacked die module |
| 08/12/2004 | US20040154164 Ceramic packaging method employing flip-chip bonding |
| 08/12/2004 | US20040154163 Method of forming a connecting conductor and wirings of a semiconductor chip |
| 08/12/2004 | US20040154149 Protecting resin-encapsulated components |
| 08/12/2004 | DE4426311B4 Leiterbahnstruktur eines Halbleiterbauelementes und Verfahren zu ihrer Herstellung Interconnect structure of a semiconductor device and process for their preparation |
| 08/12/2004 | DE10303103A1 Microelectronic component comprising chip between substrates, is completed by intervening cast mass which seals substrates without forming peripheral edge |
| 08/12/2004 | DE10258565B3 Schaltungsanordnung für Halbleiterbauelemente und Verfahren zur Herstellung Circuit arrangement for semiconductor devices and methods for making |
| 08/12/2004 | DE102004005524A1 Harz zum Einkapseln eines Fotohalbleiterelements, Fotohalbleitereinrichtung, die eingekapselte optische Halbleiterelemente umfasst, und Verfahren zur Herstellung der Einrichtung Resin for encapsulating a photosemiconductor element, photo semiconductor device, which includes optical semiconductor elements encapsulated, and methods of making the device |
| 08/11/2004 | EP1445995A1 Method of mounting an electronic component on a circuit board |
| 08/11/2004 | EP1445861A2 Electronic device and method of manufacturing the same |
| 08/11/2004 | EP1445803A2 Solid state imaging device with sealing window smaller than the imager chip |
| 08/11/2004 | EP1445800A1 Metal insulator metal capacitor |
| 08/11/2004 | EP1445799A2 Heat dissipation device for a semiconductor on a printed circuit board |
| 08/11/2004 | EP1445798A1 Package for electronic parts, lid thereof, material for the lid and method for producing the lid material |
| 08/11/2004 | EP1445797A2 Chemical treatment of low-K dielectric films |
| 08/11/2004 | EP1445683A2 Electronic apparatus and method of cooling the electronic apparatus |
| 08/11/2004 | EP1444734A1 Fib-protected semiconductor chip |
| 08/11/2004 | EP1444733A2 Electronic device carrier adapted for transmitting high frequency signals |
| 08/11/2004 | EP1444732A2 Low cost microelectronic circuit package |
| 08/11/2004 | EP1444731A1 Controlled impedance transmission lines in a redistribution layer |
| 08/11/2004 | EP1444730A2 An electronic assembly having a wetting layer on a thermally conductive heat spreader |
| 08/11/2004 | EP1444729A2 Large area silicon carbide devices and manufacturing methods therefor |
| 08/11/2004 | EP1444728A1 Method for producing a protection for chip edges and system for the protection of chip edges |
| 08/11/2004 | EP1444541A2 Multilayer monolithic electronic device and method for making same |
| 08/11/2004 | EP0948814B1 Chip scale ball grid array for integrated circuit package |
| 08/11/2004 | CN2632942Y AC electric power and electronic switch assembly |
| 08/11/2004 | CN2632857Y Microject array cooled heat deposition |
| 08/11/2004 | CN2632856Y Liquid-cooled radiator |
| 08/11/2004 | CN2632855Y Heat conduit pipe structure |
| 08/11/2004 | CN2632854Y 散热器鳍片 Radiator fins |
| 08/11/2004 | CN2632853Y Laminated assembled radiative fins |
| 08/11/2004 | CN2632852Y Radiator |
| 08/11/2004 | CN2632851Y Radiator |
| 08/11/2004 | CN1520612A IC element and its mfg. as well as information carrier with mounted IC element and its manufacture |
| 08/11/2004 | CN1520611A Structure and method for fabrication of leadless multi-die carrier |
| 08/11/2004 | CN1520608A Improvement of titanium disilicide resistance in pinched active regions of semiconductor devices |
| 08/11/2004 | CN1520599A Thin film capacitor, and electronic circuit component |
| 08/11/2004 | CN1520553A Device for and method of storing identification data in integrated circuit |
| 08/11/2004 | CN1519955A Thin film transistor array panel, its mfg. method and mask for such panel |
| 08/11/2004 | CN1519948A Semiconductor wafer, solid imaging element optical element modular and mfg. method for both |
| 08/11/2004 | CN1519933A Semiconductor device and its mfg. method |
| 08/11/2004 | CN1519931A Semiconductor device, electronic appts. their mfg. methods and electronic instrument |
| 08/11/2004 | CN1519930A Semiconductor device, electronic appts. their mfg. methods and electronic instrument |
| 08/11/2004 | CN1519929A Semiconductor chip and its mfg. method |
| 08/11/2004 | CN1519928A Semiconductor device and its mfg. method |