| Patents for H01L 23 - Details of semiconductor or other solid state devices (226,155) |
|---|
| 08/17/2004 | US6777321 Method of forming buried wiring |
| 08/17/2004 | US6777320 In-plane on-chip decoupling capacitors and method for making same |
| 08/17/2004 | US6777319 Microelectronic spring contact repair |
| 08/17/2004 | US6777318 Aluminum/copper clad interconnect layer for VLSI applications |
| 08/17/2004 | US6777269 Semiconductor integrated circuit device, design method for semiconductor integrated circuit device, design aiding device for semiconductor integrated circuit device, program, and program recording medium |
| 08/17/2004 | US6777268 Method of fabricating tape attachment chip-on-board assemblies |
| 08/17/2004 | US6777266 Dual-chip integrated circuit package and method of manufacturing the same |
| 08/17/2004 | US6777265 Partially patterned lead frames and methods of making and using the same in semiconductor packaging |
| 08/17/2004 | US6777264 Method of manufacturing a semiconductor device having a die pad without a downset |
| 08/17/2004 | US6777262 Method of packaging a semiconductor device having gull-wing leads with thinner end portions |
| 08/17/2004 | US6777261 Method and apparatus for a semiconductor package for vertical surface mounting |
| 08/17/2004 | US6777259 Accelerometer protected by caps applied at the wafer scale |
| 08/17/2004 | US6777250 Manufacture of wafer level semiconductor device with quality markings on the sealing resin |
| 08/17/2004 | US6777105 Part |
| 08/17/2004 | US6777086 Laminates prepared from impregnated flexible graphite sheets |
| 08/17/2004 | US6776862 Improvements in densification of a multilayered ceramic board fabricated by a so-called ?non-shrinkage process? |
| 08/17/2004 | US6776861 Suppression of planar shrinkage in ltcc ceramic tape laminate structures without externally applied forces |
| 08/17/2004 | US6776828 Electroless gold plating composition comprising one or more water soluble gold compounds, one or more gold complexing agents, one or more organic stabilizer compounds, and one or more uniformity enhancers |
| 08/17/2004 | US6776806 Isolating, resistive, conducting (or) and/or semiconducting patterns and structures for use in electronic circuits which most particularly consist of a single or several stacked layers of thin films |
| 08/17/2004 | US6776663 Electronic component with isolation barriers between the terminal pins |
| 08/17/2004 | US6776622 Conductive contact structure and process for producing the same |
| 08/17/2004 | US6776399 Chip-scale package |
| 08/17/2004 | US6776329 Applying paste comprising mixture of heat conducting metal powder and liquid to workpiece, contacting second workpiece, drying paste, sintering, compacting porous layer which has been sintered to workpieces by pressing workpieces together |
| 08/17/2004 | US6776226 Electronic device containing thermal interface material |
| 08/17/2004 | US6776224 Heating dissipating device for electronic elements |
| 08/17/2004 | US6776221 Computer system having a chassis-level capillary pump loop transferring heat to a frame-level thermal interface component |
| 08/17/2004 | US6775958 Interposing bonding member between case housing product and lid made of material that transmits laser beam used for sealing, irradiating bonding member with laser beam through lid, melting bonding member and welding case and lid together |
| 08/17/2004 | US6775920 Method of fabricating semiconductor device comprising superposition inspection step |
| 08/17/2004 | US6775906 Method of manufacturing an integrated circuit carrier |
| 08/17/2004 | US6775901 Bonding wire inductor |
| 08/12/2004 | WO2004068924A1 Apparatus for cooling heat generating components using a plate heat sink and methods for manufacturing the same |
| 08/12/2004 | WO2004068922A1 Multilayer printed board, electronic apparatus, and packaging method |
| 08/12/2004 | WO2004068665A2 Wafer scale packaging technique for sealed optical elements and sealed packages produced thereby |
| 08/12/2004 | WO2004068581A1 Semiconductor device and supporting plate |
| 08/12/2004 | WO2004068580A1 High-frequency circuit package and mounting configuration thereof |
| 08/12/2004 | WO2004068577A1 Semiconductor device |
| 08/12/2004 | WO2004068576A2 Method of forming a catalyst containing layer over a patterned dielectric |
| 08/12/2004 | WO2004068560A2 Area array package with non-electrically connected solder balls |
| 08/12/2004 | WO2004068558A2 Package for integrated circuit die |
| 08/12/2004 | WO2004068551A2 Patterning layers comprised of spin-on ceramic films |
| 08/12/2004 | WO2004068550A2 Interconnect structures incorporating low-k dielectric barrier films |
| 08/12/2004 | WO2004068545A2 Method and apparatus for the use of self-assembled nanowires for the removal of heat from integrated circuits |
| 08/12/2004 | WO2004068543A2 Electrostatic discharge circuit and method therefor |
| 08/12/2004 | WO2004067631A1 Resin composition, cured resin, cured resin sheet, laminate, prepreg, electronic part, and multilayer substrate |
| 08/12/2004 | WO2004067362A1 Stanchion with an integrated device for securing a load, in particular for tarpaulin-covered transport vehicles |
| 08/12/2004 | WO2004067244A1 Semiconductor-sealing-purpose epoxy resin compound producing method |
| 08/12/2004 | WO2004057668A3 Electronic device and method of manufacturing same |
| 08/12/2004 | WO2004057667A3 Method for re-routing lithography-free microelectronic devices |
| 08/12/2004 | WO2004053932A3 Inside-out heat sink |
| 08/12/2004 | WO2004042304A3 Method and apparatus for efficient vertical fluid delivery for cooling a heat producing device |
| 08/12/2004 | WO2003081339A3 Patterning semiconductor layers using phase shifting and assist features |
| 08/12/2004 | US20040158805 Parasitic capacitance extracting device and method for semiconductor integrated circuit |
| 08/12/2004 | US20040157992 Resin for the encapsulation of photosemiconductor element, photosemiconductor device comprising encapsulated optical semiconductor element, and process for producing the device |
| 08/12/2004 | US20040157472 Deposition method, deposition apparatus, insulating film and semiconductor integrated circuit |
| 08/12/2004 | US20040157450 Waferlevel method for direct bumping on copper pads in integrated circuits |
| 08/12/2004 | US20040157443 Semiconductor device and method for manufacturing the same |
| 08/12/2004 | US20040157442 Robust via structure and method |
| 08/12/2004 | US20040157440 Using stabilizers in electroless solutions to inhibit plating of fuses |
| 08/12/2004 | US20040157433 Plating metal caps on conductive interconnect for wirebonding |
| 08/12/2004 | US20040157428 Fill pattern generation for spin-on glass and related self-planarization deposition |
| 08/12/2004 | US20040157424 Method of manufacturing electronic device |
| 08/12/2004 | US20040157410 Semiconductor device, semiconductor module, electronic equipment, method for manufacturing semiconductor device, and method for manufacturing semiconductor module |
| 08/12/2004 | US20040157408 Dual sided lithographic substrate imaging |
| 08/12/2004 | US20040157400 Protecting resin-encapsulated components |
| 08/12/2004 | US20040157392 Capacitor in an interconnect system and method of manufacturing thereof |
| 08/12/2004 | US20040157386 Electronic assembly including a die having an integrated circuit and a layer of diamond to transfer heat |
| 08/12/2004 | US20040157379 Method for making MOSFET anti-fuse structure |
| 08/12/2004 | US20040157377 Electronic component, method for encapsulating the component, and method for producing components according to the method |
| 08/12/2004 | US20040157376 Method of manufacturing a semiconductor device and semiconductor device |
| 08/12/2004 | US20040157374 Method for packaging a multi-chip module of a semiconductor device |
| 08/12/2004 | US20040157373 Stacked die module and techniques for forming a stacked die module |
| 08/12/2004 | US20040157372 Alternative flip chip in leaded molded package design and method for manufacture |
| 08/12/2004 | US20040157371 Method for packaging a semiconductor device |
| 08/12/2004 | US20040157370 Inductors for integrated circuits, integrated circuit components, and integrated circuit packages |
| 08/12/2004 | US20040157366 Method for packaging a semiconductor device |
| 08/12/2004 | US20040157365 Method for packaging a multi-chip module of a semiconductor device |
| 08/12/2004 | US20040157363 Semiconductor device, method of manufacturing the same, circuit board, and electronic instrument |
| 08/12/2004 | US20040157362 Methods of making microelectronic packages including electrically and/or thermally conductive element |
| 08/12/2004 | US20040157361 Semiconductor substrate for build-up packages |
| 08/12/2004 | US20040157359 Method for planarizing bumped die |
| 08/12/2004 | US20040157137 Reticle for manufacturing a semiconductor device |
| 08/12/2004 | US20040157089 Heat sink formed of diamond-containing composite material with a multilayer coating |
| 08/12/2004 | US20040156772 Self-propagating High Temperature Synthesis by igniting powder mixture of titanium, scandium, vanadium, chromium, zirconium, niobium and tantalium; carbon and/or nitrogen; and silicon, aluminum, or tin; nitriding; carbiding |
| 08/12/2004 | US20040156578 Integrated circuits using optical fiber interconnects formed through a semiconductor wafer |
| 08/12/2004 | US20040156529 Methods and tangible objects employing textured machine readable data |
| 08/12/2004 | US20040156178 Radio frequency device |
| 08/12/2004 | US20040156177 Package of electronic components and method for producing the same |
| 08/12/2004 | US20040156175 Heat dissipating structure of printed circuit board and fabricating method thereof |
| 08/12/2004 | US20040156174 System and method for dissipating heat from an electronic board |
| 08/12/2004 | US20040156173 Semiconductor package with a heat spreader |
| 08/12/2004 | US20040156172 Thermally enhanced semicoductor package with emi shielding |
| 08/12/2004 | US20040156171 Heat sink clip |
| 08/12/2004 | US20040156165 Protecting resin-encapsulated components |
| 08/12/2004 | US20040156156 Antifuse programming with relaxed upper current limit |
| 08/12/2004 | US20040155992 Method of manufacturing an array substrate for use in a LCD device |
| 08/12/2004 | US20040155734 High frequency module |
| 08/12/2004 | US20040155692 Power device with bi-directional level shift circuit |
| 08/12/2004 | US20040155365 Lead frame, resin sealing mold and method for manufacturing a semiconductor device using the same |
| 08/12/2004 | US20040155364 Reworkable thermosetting resin compositions |
| 08/12/2004 | US20040155363 Resin-encapsulated semiconductor device and method for manufacturing the same |