| Patents for H01L 23 - Details of semiconductor or other solid state devices (226,155) |
|---|
| 08/19/2004 | US20040159939 High performance multi-chip flip chip package |
| 08/19/2004 | US20040159936 Heat sink assembly |
| 08/19/2004 | US20040159935 Thermally optimized conductive block |
| 08/19/2004 | US20040159934 Heat pipe thermal management of high potential electronic chip packages |
| 08/19/2004 | US20040159933 Electronic parts packaging structure and method of manufacturing the same |
| 08/19/2004 | US20040159932 Semiconductor device |
| 08/19/2004 | US20040159931 Electronic package, heater block and method |
| 08/19/2004 | US20040159930 Semiconductor device, method of manufacturing the same, and electronic device using the semiconductor device |
| 08/19/2004 | US20040159929 Semiconductor die package having two die paddles |
| 08/19/2004 | US20040159928 Supporting structure for a chip and method for producing the same |
| 08/19/2004 | US20040159927 Semiconductor device package and method of manufacture |
| 08/19/2004 | US20040159926 Semiconductor device |
| 08/19/2004 | US20040159925 Semiconductor device and method for manufacture thereof |
| 08/19/2004 | US20040159924 Semiconductor device |
| 08/19/2004 | US20040159923 Using benzocyclobutene based polymers as underfill materials |
| 08/19/2004 | US20040159922 Plurality of bonding wires electrically connecting pads with leads; resin body seals semiconductor chip; preventing shifting |
| 08/19/2004 | US20040159921 Connector structure with bond site configured to receive solder having at least two elongated members |
| 08/19/2004 | US20040159920 Semiconductor device, method of manufacturing the same, cover for semiconductor device, and electronic equipment |
| 08/19/2004 | US20040159919 Electronic circuit device |
| 08/19/2004 | US20040159918 Lead frame for semiconductor package |
| 08/19/2004 | US20040159917 Semiconductor leadframe for staggered board attach |
| 08/19/2004 | US20040159916 Electronic component and method of manufacturing same |
| 08/19/2004 | US20040159913 Circuit device and method of manufacture thereof |
| 08/19/2004 | US20040159907 Nonconductive; programmed to be in permanently conductive state by simple writing circuit; low leakage current |
| 08/19/2004 | US20040159906 Semiconductor device and blowout method of fuse |
| 08/19/2004 | US20040159894 Direct current voltage regulator comprising power stage formed under a rail supplt integrated circuit with signals; transistors and capacitor connect control electrode of transistor to a reference voltage |
| 08/19/2004 | US20040159892 Semiconductor integrated circuit device and electronic card using the same |
| 08/19/2004 | US20040159888 Semiconductor device and semiconductor device fabrication method |
| 08/19/2004 | US20040159887 Thermally monitored semiconductor; Seebeck effect thermoelectric sensor |
| 08/19/2004 | US20040159875 Copper-containing material is formed over a semiconductor; forming methylated silicon nitride barrier layer; nitriding |
| 08/19/2004 | US20040159839 Electro-optical device, method for making the same, and electronic apparatus |
| 08/19/2004 | US20040159553 Semiconductor manufacturing apparatus and method for manufacturing semiconductor devices |
| 08/19/2004 | US20040159462 Flexible dielectric electronic substrate and method for making same |
| 08/19/2004 | US20040159422 Heat pipe having a wick structure containing phase change materials |
| 08/19/2004 | US20040159396 Method for manufacturing electronic component |
| 08/19/2004 | US20040159390 low temperature ceramic layer containing particles of a glass, a ceramic, and an organic binder; self-constraining layer containing a refractory ceramic and a wetting agent for the glass in the first layer; densification but no shrinkage on firing |
| 08/19/2004 | US20040159379 .15%-0.7% chromium; .005%-.3% silver; .01%-0.15% titanium; .01%-0.10% silicon; up to .2% iron; up to .5% tin; balance copper; high electrical conductivity, good resistance to stress relaxation and isotropic bend properties; box-type connectors |
| 08/19/2004 | US20040158980 Component built-in module and method for producing the same |
| 08/19/2004 | US20040158979 Method of manufacturing a semiconductor element-mounting board |
| 08/19/2004 | DE202004009244U1 Bimetal-type heat sink construction, has aluminum covering layer with numerous laminations fabricated from the surface of covering layer by skiving method |
| 08/19/2004 | DE202004006839U1 Heat-extraction device e.g. for cooling electrical components and units, such as CPU, uses first and second heat-removal fans with vanes rotating in common direction |
| 08/19/2004 | DE202004006689U1 External cooling device for a computer processor comprises a heat sink mounted on the outside of a housing or switching cabinet and linked via heat conducting pipes to the processor on the inside of the housing |
| 08/19/2004 | DE19861009B4 Packaged semiconductor device has a ball grid array substrate |
| 08/19/2004 | DE10361388A1 Halbleitervorrichtung Semiconductor device |
| 08/19/2004 | DE10357990A1 Hochintegrierte Schaltung zur Verminderung der Hysterese einer Verzögerungseinheit Highly integrated circuit for reducing the hysteresis of a delay unit |
| 08/19/2004 | DE10354744A1 Verfahren zum Bilden eines Metallspiegels eines Halbleiterbauelements A method of forming a metal mirror of a semiconductor device |
| 08/19/2004 | DE10343526A1 Halbleitervorrichtung mit Anschlußfläche A semiconductor device having pad |
| 08/19/2004 | DE10308872B3 Integrated semiconductor memory circuit has additional word lines and associated blind contact structures for compensation of parasitic capacitances between bit line contacts and word lines |
| 08/19/2004 | DE10305455A1 Trägeranordnung für eine organische Leuchtdiode Carrier assembly for an organic light-emitting diode |
| 08/19/2004 | DE10304777A1 Verfahren zur Herstellung eines Chipnutzens mittels eines Hitze- und Druckprozesses unter Verwendung eines thermoplastischen Materials A process for producing a chip by means of a utility heat and pressure process using a thermoplastic material |
| 08/19/2004 | DE10303933A1 Semiconducting component with reduced connector-related parasitic inductance/capacitance has contact area(s) connected to connecting legs not connected to mounting plate, connected together in housing |
| 08/19/2004 | DE10303682A1 Verfahren zum Bewerten lateraler Dotier- und/oder Ladungsträgerprofile A method for evaluating lateral doping and / or carrier profiles |
| 08/19/2004 | DE10303463A1 Semiconducting component with at least 2 chips in common housing has contact element(s) protruding from housing with plate-shaped section with opposing connection areas and that contacts chips |
| 08/19/2004 | DE10303455A1 Lead frame band has several component lead frames which are held in support and guiding area and each of which have two electrical connection strips |
| 08/19/2004 | DE10303449A1 Verfahren zum Umhüllen eines elektronischen Bauelementes sowie nach diesem Verfahren hergestelltes elektronisches Bauelement Process for coating an electronic component and electronic component produced according to this method |
| 08/19/2004 | DE10244446B4 Halbleiterchipstapel Semiconductor chip stack |
| 08/19/2004 | DE10125586B4 Kupferlegierung zur Verwendung in elektrischen und elektronischen Teilen Copper alloy for use in electric and electronic parts |
| 08/19/2004 | CA2515325A1 Peltier cooler integrated with electronic device(s) |
| 08/18/2004 | EP1448034A1 Method and device for mounting electronic component on circuit board |
| 08/18/2004 | EP1448033A1 Method and device for mounting electronic component on a circuit board |
| 08/18/2004 | EP1448031A1 Concave cup printed circuit board for light emitting diode and method for producing the same |
| 08/18/2004 | EP1447850A2 Electronic parts packaging structure and method of manufacturing the same |
| 08/18/2004 | EP1447849A2 Semiconductor device and circuit board having the same mounted thereon |
| 08/18/2004 | EP1447848A2 Semi conductor integrated circuit including anti-fuse and method for manufacturing the same |
| 08/18/2004 | EP1447847A2 Lead frame for an electronic component package |
| 08/18/2004 | EP1447846A2 Socket and method for connecting electronic components |
| 08/18/2004 | EP1447845A2 Package of electronic components and method for producing the same |
| 08/18/2004 | EP1447844A2 Reinforced semiconductor wafer |
| 08/18/2004 | EP1447843A2 Adhesive sheet for semiconductor connecting substrate, adhesive-backed tape for TAB, adhesive-backed tape for wire bonding connection, semiconductor connecting substrate, and semiconductor device |
| 08/18/2004 | EP1447842A1 Bonding wire |
| 08/18/2004 | EP1446993A1 I-channel surface-mount connector with extended flanges |
| 08/18/2004 | EP1446841A1 A method of manufacturing a semiconductor device |
| 08/18/2004 | EP1446836A1 Silicon on insulator device with improved heat removal and method of manufacture |
| 08/18/2004 | EP1446834A2 Substrate design and process for reducing electromagnetic emission |
| 08/18/2004 | EP1446833A1 Optimised application of pcms in chillers |
| 08/18/2004 | EP1446832A2 Electrode structure for use in an integrated circuit |
| 08/18/2004 | EP1446824A2 Integrated semiconductor component for conducting high-frequency measurements and the use thereof |
| 08/18/2004 | EP1446251A1 Highly filled composites of powdered fillers and polymer matrix |
| 08/18/2004 | EP1389404B1 Method for shielding an electric circuit created on a printed circuit board and a corresponding combination of a printed circuit board and a shield |
| 08/18/2004 | EP1295337A4 Process for the manufacture of printed circuit boards with plated resistors |
| 08/18/2004 | EP1230680B1 Method for integrating a chip in a printed board and integrated circuit |
| 08/18/2004 | EP1192524A4 Micro cooling device |
| 08/18/2004 | EP0944922B1 Manufacture of a chip module |
| 08/18/2004 | EP0933012B1 Device for positioning and retaining micro-building-blocks |
| 08/18/2004 | EP0870328B1 Rectifier diode |
| 08/18/2004 | EP0749996B1 Epoxy resin composition |
| 08/18/2004 | CN2634662Y Structure improved heat radiation module |
| 08/18/2004 | CN2634661Y High efficiency heat radiator |
| 08/18/2004 | CN2634660Y Movable wind guide device for heat radiator |
| 08/18/2004 | CN2634659Y CPU heat radiator fastener |
| 08/18/2004 | CN2634658Y Heat radiator structure of central processing unit |
| 08/18/2004 | CN2634657Y Improved heat radiator structure of central processing unit |
| 08/18/2004 | CN2634656Y Improved heat radiator and fastener structure |
| 08/18/2004 | CN2634655Y Improved fastener structure |
| 08/18/2004 | CN2634654Y Heat radiator structure of central processing unit |
| 08/18/2004 | CN2634414Y General heat exchanging assembly |
| 08/18/2004 | CN1522483A Contact for spiral contactor and spiral contactor |
| 08/18/2004 | CN1522479A 插座连接器 Receptacle connector |
| 08/18/2004 | CN1522470A TFT substrate, liquid crystal display device using the same, and its manufacturing method |
| 08/18/2004 | CN1522467A Using the wave soldering process to attach motherboard chipset heat sinks |