| Patents for H01L 23 - Details of semiconductor or other solid state devices (226,155) |
|---|
| 08/18/2004 | CN1522464A Method and apparatus for controlling a plating process |
| 08/18/2004 | CN1522389A Method of measuring critical dimension and overlay in single step |
| 08/18/2004 | CN1522290A Thermoconductive composition |
| 08/18/2004 | CN1521849A Semiconductor structure for preventing self-alignment metal silicides bridge connection and method thereof |
| 08/18/2004 | CN1521847A Electronic parts packaging structure and method of manufacturing the same |
| 08/18/2004 | CN1521846A Semiconductor apparatus |
| 08/18/2004 | CN1521845A 静电放电保护电路 Electrostatic discharge protection circuit |
| 08/18/2004 | CN1521844A Conductive pad for collecting manufacturing process chips and releasing static electricity |
| 08/18/2004 | CN1521843A Semiconductor device having multi-layer interconnection structure |
| 08/18/2004 | CN1521842A Package of electronic components and method for producing the same |
| 08/18/2004 | CN1521841A 半导体器件 Semiconductor devices |
| 08/18/2004 | CN1521840A SOI substrate and semiconductor integrated circuit device |
| 08/18/2004 | CN1521826A Dual-trench isolated crosspoint memory array and method for fabricating same |
| 08/18/2004 | CN1521821A Manufacturing method for electronic component module and electromagnetically readable data carrier |
| 08/18/2004 | CN1521817A Semiconductor packaging member and method for making same |
| 08/18/2004 | CN1521816A Semiconductor chip package and process for making same |
| 08/18/2004 | CN1521804A Semiconductor device and method of manufacturing the same, semiconductor wafer, circuit board and electronic instrument |
| 08/18/2004 | CN1521226A Slurry for cmp, and method of manufacturing semiconductor device |
| 08/18/2004 | CN1520954A Processing method for planing pattern fin slices radiator and tools thereof |
| 08/18/2004 | CN1162921C Piezoelectric device and manufacturing method thereof and manufacturing method for piezoelectric oscillator |
| 08/18/2004 | CN1162920C Thermoelectric transducing material and method of producing the same |
| 08/18/2004 | CN1162908C 半导体装置 Semiconductor device |
| 08/18/2004 | CN1162907C Memory module with laminated chips and its making process |
| 08/18/2004 | CN1162905C Plastic molded type semiconductor device and method of manufacturing same |
| 08/18/2004 | CN1162904C 半导体器件 Semiconductor devices |
| 08/18/2004 | CN1162902C Method for manufacturing conductive connecting wire |
| 08/18/2004 | CN1162901C Semiconductor device manufacturing process |
| 08/18/2004 | CN1162898C Heat sink mfg. device and mfg. method |
| 08/18/2004 | CN1162744C Electro-optical device |
| 08/17/2004 | US6779167 Automated wiring pattern layout method |
| 08/17/2004 | US6778424 Semiconductor memory device and method of manufacturing the same |
| 08/17/2004 | US6778406 Resilient contact structures for interconnecting electronic devices |
| 08/17/2004 | US6778403 Wiring board having terminal |
| 08/17/2004 | US6778398 Electrically nonconductor configured to conduct heat from integrated circuit; plurality of contactors provide coupling to traces on on printed circuit; heat sinks |
| 08/17/2004 | US6778397 Heat dissipater for integrated circuits |
| 08/17/2004 | US6778396 Retaining device for heat sink |
| 08/17/2004 | US6778395 Heat sink clip |
| 08/17/2004 | US6778394 Electronic device having a heat dissipation member |
| 08/17/2004 | US6778393 Cooling device with multiple compliant elements |
| 08/17/2004 | US6778392 Heat dissipation device for electronic component |
| 08/17/2004 | US6778390 High-performance heat sink for printed circuit boards |
| 08/17/2004 | US6778142 Electronic device and a circuit arrangement |
| 08/17/2004 | US6778058 Embedded 3D coil inductors in a low temperature, co-fired ceramic substrate |
| 08/17/2004 | US6778046 Latching micro magnetic relay packages and methods of packaging |
| 08/17/2004 | US6778031 High-frequency circuit device using slot line and communication apparatus having high frequency circuit device |
| 08/17/2004 | US6777965 Interposer for electrically coupling a semiconductive device to an electrical apparatus |
| 08/17/2004 | US6777957 Test structure to measure interlayer dielectric effects and breakdown and detect metal defects in flash memories |
| 08/17/2004 | US6777821 Ball grid array x-ray orientation mark |
| 08/17/2004 | US6777820 Semiconductor wafer |
| 08/17/2004 | US6777819 Semiconductor package with flash-proof device |
| 08/17/2004 | US6777818 Mechanical support system for a thin package |
| 08/17/2004 | US6777817 Reworkable and thermally conductive adhesive and use thereof |
| 08/17/2004 | US6777816 Stress-relaxation layers intervening between lands and semiconductor chips; computers |
| 08/17/2004 | US6777815 Configuration of conductive bumps and redistribution layer on a flip chip |
| 08/17/2004 | US6777814 Semiconductor device |
| 08/17/2004 | US6777813 Fill pattern generation for spin-on-glass and related self-planarization deposition |
| 08/17/2004 | US6777812 Semiconductor devices having protected plug contacts and upper interconnections |
| 08/17/2004 | US6777811 Semiconductor device and its fabrication method |
| 08/17/2004 | US6777810 Interconnection alloy for integrated circuits |
| 08/17/2004 | US6777809 BEOL decoupling capacitor |
| 08/17/2004 | US6777807 Interconnect integration |
| 08/17/2004 | US6777806 Semiconductor device having no cracks in one or more layers underlying a metal line layer and method of manufacturing the same |
| 08/17/2004 | US6777804 Flip-chip package substrate |
| 08/17/2004 | US6777803 Solder mask on bonding ring |
| 08/17/2004 | US6777802 Integrated circuit package substrate with multiple voltage supplies |
| 08/17/2004 | US6777801 Large scale integration (?lsi?) chips sealed with resin |
| 08/17/2004 | US6777800 Encapsulated exposed by nonconductive molding material |
| 08/17/2004 | US6777799 Stacked semiconductor device and method of producing the same |
| 08/17/2004 | US6777798 Stacked semiconductor device structure |
| 08/17/2004 | US6777797 Stacked multi-chip package, process for fabrication of chip structuring package, and process for wire-bonding |
| 08/17/2004 | US6777795 Semiconductor integrated circuit modules, manufacturing methods and usage thereof |
| 08/17/2004 | US6777792 Semiconductor device and package with high heat radiation effect |
| 08/17/2004 | US6777791 Multiple ground signal path LDMOS power package |
| 08/17/2004 | US6777790 Redundant pinout configuration for signal enhancement in IC packages |
| 08/17/2004 | US6777789 Mounting for a package containing a chip |
| 08/17/2004 | US6777788 Method and structure for applying thick solder layer onto die attach pad |
| 08/17/2004 | US6777787 Semiconductor device with warp preventing board joined thereto |
| 08/17/2004 | US6777786 Semiconductor device including stacked dies mounted on a leadframe |
| 08/17/2004 | US6777785 Lead frame containing a master and a slave IC chips and a testing circuit embedded within the master IC chip |
| 08/17/2004 | US6777777 High density composite MIM capacitor with flexible routing in semiconductor dies |
| 08/17/2004 | US6777775 Semiconductor integrated circuit, D-A converter device, and A-D converter device |
| 08/17/2004 | US6777774 Low noise inductor using electrically floating high resistive and grounded low resistive patterned shield |
| 08/17/2004 | US6777770 Films deposited at glancing incidence for multilevel metallization |
| 08/17/2004 | US6777767 Methods for producing packaged integrated circuit devices & packaged integrated circuit devices produced thereby |
| 08/17/2004 | US6777755 Method and apparatus for creating a reliable long RC time constant |
| 08/17/2004 | US6777754 Bleeder resistance circuit having conductors, dielectrics, and doped thin film resistors |
| 08/17/2004 | US6777752 Complementary MOS semiconductor device |
| 08/17/2004 | US6777723 Semiconductor device having protection circuit implemented by bipolar transistor for discharging static charge current and process of fabrication |
| 08/17/2004 | US6777708 Apparatus and methods for determining floating body effects in SOI devices |
| 08/17/2004 | US6777707 Semiconductor integrated circuit with voltage down converter adaptable for burn-in testing |
| 08/17/2004 | US6777645 High-speed, precision, laser-based method and system for processing material of one or more targets within a field |
| 08/17/2004 | US6777620 Circuit board |
| 08/17/2004 | US6777612 Electronic device sealing electronic element therein and manufacturing method thereof, and printed wiring board suitable for such electronic device |
| 08/17/2004 | US6777464 Circuit connecting material, and structure and method of connecting circuit terminal |
| 08/17/2004 | US6777343 Method of forming contacts for a bit line and a storage node in a semiconductor device |
| 08/17/2004 | US6777333 Method for fabricating semiconductor device |
| 08/17/2004 | US6777325 Semiconductor manufacturing method for low-k insulating film |
| 08/17/2004 | US6777324 Multi-layer interconnection structure in semiconductor device and method for fabricating same |
| 08/17/2004 | US6777323 Lamination structure with copper wiring and its manufacture method |
| 08/17/2004 | US6777322 Method for fabricating a multi-layered dielectric layer including insulating layer having Si-CH3 bond therein |