| Patents for H01L 23 - Details of semiconductor or other solid state devices (226,155) |
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| 08/24/2004 | US6780678 Cooling of optoelectronic elements |
| 08/24/2004 | US6780677 Process for mounting electronic device and semiconductor device |
| 08/24/2004 | US6780676 Method for fabricating a circuit device |
| 08/24/2004 | US6780675 Connecting first substrate to second substrate, where first substrate has raised bond pads which make electrical contact (without attachment) with raised bond pads on the second substrate; thermal expansion stress resistance |
| 08/24/2004 | US6780674 Liquid epoxy resin composition and semiconductor device |
| 08/24/2004 | US6780673 Method of forming a semiconductor device package using a plate layer surrounding contact pads |
| 08/24/2004 | US6780672 Micro eletro-mechanical component and system architecture |
| 08/24/2004 | US6780671 Method of encapsulating conductive lines of semiconductor devices |
| 08/24/2004 | US6780670 Semiconductor package and fabrication method of the same |
| 08/24/2004 | US6780669 Method of forming overmolded chip scale package and resulting product |
| 08/24/2004 | US6780668 Package of semiconductor device and method of manufacture thereof |
| 08/24/2004 | US6780667 Solid-state image pickup apparatus and fabricating method thereof |
| 08/24/2004 | US6780561 For forming protective film or an insulating film for a semiconductor element or a circuit board such as a printed board |
| 08/24/2004 | US6780550 Single pass lithography overlay technique |
| 08/24/2004 | US6780520 Bonding nickel/copper alloy plate onto ceramic substrate, applying photoresist, ethching, then removing photoresist; reduces the displacement failure during mounting of semiconductor |
| 08/24/2004 | US6780502 Crosslinked elastic polymer in a photo- or thermally-polymerizable resin |
| 08/24/2004 | US6780499 Porous low dielectric film |
| 08/24/2004 | US6780498 Semiconductor integrated circuit having a fast response can be produced by using the film formed from a polysiloxane crosslinked with a polycarbosilane |
| 08/24/2004 | US6780493 Wiring board and a process of producing a wiring board |
| 08/24/2004 | US6780353 Method for making micromolds |
| 08/24/2004 | US6780350 Metal-carbon composite powders, methods for producing powders and devices fabricated from same |
| 08/24/2004 | US6780001 Forming tool for forming a contoured microelectronic spring mold |
| 08/24/2004 | US6779711 Self-aligned corrosion stop for copper C4 and wirebond |
| 08/24/2004 | US6779595 Integrated heat dissipation apparatus |
| 08/24/2004 | US6779593 High performance cooling device with heat spreader |
| 08/24/2004 | US6779264 Electronic device |
| 08/24/2004 | US6779260 Overmolded electronic package including circuit-carrying substrate |
| 08/19/2004 | WO2004071139A2 Remedies to prevent cracking in a liquid system |
| 08/19/2004 | WO2004070852A2 Peltier cooler integrated with electronic device(s) |
| 08/19/2004 | WO2004070838A2 Device and method for encapsulating with encapsulating material and electronic component fixed on a carrier |
| 08/19/2004 | WO2004070837A1 Support system for an organic light-emitting diode |
| 08/19/2004 | WO2004070836A1 Hermetic sealing cap and method for producing same |
| 08/19/2004 | WO2004070835A1 Method for producing microsystems |
| 08/19/2004 | WO2004070832A1 Semiconductor integrated circuit device |
| 08/19/2004 | WO2004070818A1 Metal etching method for an interconnect structure and metal interconnect structure obtained by such method |
| 08/19/2004 | WO2004070792A2 Thin multiple semiconductor die package |
| 08/19/2004 | WO2004070790A2 Molded high density electronic packaging structure for high performance applications |
| 08/19/2004 | WO2004070769A2 Method for producing a chip panel by means of a heating and pressing process using a thermoplastic material |
| 08/19/2004 | WO2004070746A1 Spiral inductor and transformer |
| 08/19/2004 | WO2004070471A2 Arc layer for semiconductor device |
| 08/19/2004 | WO2004070303A1 Optimized multiple heat pipe blocks for electronics cooling |
| 08/19/2004 | WO2004070082A1 Method for the chemical treatment of a copper-alloy support for electronic components of the type used in the semiconductor industry |
| 08/19/2004 | WO2004049394A3 Digital and rf system and method therefor |
| 08/19/2004 | WO2004047133A3 Thermal switch, methods of use and manufacturing methods for same |
| 08/19/2004 | WO2004038767A3 Doped nanoscale wires and method of manufacture |
| 08/19/2004 | WO2004027866A3 Method for creating a link in an integrated metal substrate |
| 08/19/2004 | WO2004003975A3 Heat sink made from longer and shorter graphite sheets |
| 08/19/2004 | US20040163071 Evaluation TEG for semiconductor device and method of evaluation |
| 08/19/2004 | US20040162697 Methods and structure for IC temperature self-monitoring |
| 08/19/2004 | US20040162692 Method and apparatus for monitoring integrated circuit fabrication |
| 08/19/2004 | US20040161946 Method for fluorocarbon film depositing |
| 08/19/2004 | US20040161942 Method of manufacturing semiconductor device |
| 08/19/2004 | US20040161932 Slurry for cmp, and method of manufacturing semiconductor device |
| 08/19/2004 | US20040161926 Method for manufacturing semiconductor device, and method for manufacturing semiconductor module |
| 08/19/2004 | US20040161924 Damascene interconnect with bilayer capping film |
| 08/19/2004 | US20040161920 Semiconductor device manufacturing method |
| 08/19/2004 | US20040161917 Method for fabricating a semiconductor device having a metallic silicide layer |
| 08/19/2004 | US20040161916 Apparatus for adjusting input capacitance of semiconductor device and fabricating method |
| 08/19/2004 | US20040161910 Semiconductor apparatus and semiconductor apparatus manufacturing method |
| 08/19/2004 | US20040161908 Method for fabricating a semiconductor device having a heat radiation layer |
| 08/19/2004 | US20040161894 Non-volatile resistance variable devices and method of forming same, analog memory devices and method of forming same, programmable memory cell and method of forming same, and method of structurally changing a non-volatile device |
| 08/19/2004 | US20040161885 Semiconductor device having junction diode and fabricating method therefor |
| 08/19/2004 | US20040161884 Semiconductor device having contact pads and method for manufacturing the same |
| 08/19/2004 | US20040161880 Methods and apparatus for addition of electrical conductors to previously fabricated device |
| 08/19/2004 | US20040161879 Method for manufacturing a package |
| 08/19/2004 | US20040161878 Method for fabrication of semiconductor device |
| 08/19/2004 | US20040161876 Methods for marking a bare semiconductor die |
| 08/19/2004 | US20040161626 Tape substrate and method for fabricating the same |
| 08/19/2004 | US20040161571 Computers; heat exchanging interface containing heat conductive fillers; elastomer layers |
| 08/19/2004 | US20040161530 Covering with sheet of radiation transparent material; adhesion og metal frame to sheet; spraying, fusion metal particles |
| 08/19/2004 | US20040160771 Concave cup printed circuit board for light emitting diode and method for producing the same |
| 08/19/2004 | US20040160753 System and method for packaging electronic components |
| 08/19/2004 | US20040160752 Electronic component built-in module and method of manufacturing the same |
| 08/19/2004 | US20040160751 Printed circuit board and method of manufacturing printed circuit board |
| 08/19/2004 | US20040160742 Three-dimensional electrical device packaging employing low profile elastomeric interconnection |
| 08/19/2004 | US20040160727 Integrated passive components and package with posts |
| 08/19/2004 | US20040160657 Electrochromic rearview mirror assembly incorporating a display/signal light |
| 08/19/2004 | US20040160399 Electro-optical device, method for making the same, and electronic apparatus |
| 08/19/2004 | US20040160299 Integrated passive components and package with posts |
| 08/19/2004 | US20040160238 Semiconductor apparatus |
| 08/19/2004 | US20040160170 Display apparatus and method of manufacturing the same |
| 08/19/2004 | US20040159962 Semiconductor module having inner pressure release portion |
| 08/19/2004 | US20040159961 Semiconductor chip and method for producing housing |
| 08/19/2004 | US20040159960 Electronic device and method of manufacturing the same |
| 08/19/2004 | US20040159958 Semiconductor device and method of manufacturing the same |
| 08/19/2004 | US20040159957 Interposer substrate and wafer scale interposer substrate member for use with flip-chip configured semiconductor dice |
| 08/19/2004 | US20040159956 High voltage flip-chip component package and method for forming the same |
| 08/19/2004 | US20040159955 Semiconductor chip module |
| 08/19/2004 | US20040159954 Electronic device having a stack of semiconductor chips and method for the production thereof |
| 08/19/2004 | US20040159953 Method for manufacturing a semiconductor device having self-aligned contacts |
| 08/19/2004 | US20040159952 Pad structure for bonding pad and probe pad and manufacturing method thereof |
| 08/19/2004 | US20040159951 Semiconductor device and manufacturing method of semiconductor device |
| 08/19/2004 | US20040159950 Buried conductors |
| 08/19/2004 | US20040159947 Copper-containing C4 ball-limiting metallurgy stack for enhanced reliability of packaged structures and method of making same |
| 08/19/2004 | US20040159946 Microelectronic assemblies, electronic devices, and apparatuses for supporting microelectronic substrates |
| 08/19/2004 | US20040159944 Prevents tin migration; resists electrical discontinuities between metallization and metal bumps; having titanium metal or alloy adhesion layer; integrated circuit electrical connection miniaturization |
| 08/19/2004 | US20040159943 Semiconductor device and method for designing the same |
| 08/19/2004 | US20040159942 Semiconductor package and method producing same |
| 08/19/2004 | US20040159941 Semiconductor device capable of adjusting input resistance without changing input terminal capacitance |
| 08/19/2004 | US20040159940 Hermetically sealed semiconductor power module and large scale module comprising the same |