| Patents for H01L 23 - Details of semiconductor or other solid state devices (226,155) |
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| 08/25/2004 | CN1523666A Semiconductor device and manufacturing method therefor |
| 08/25/2004 | CN1523665A 半导体装置及其制造方法 Semiconductor device and manufacturing method |
| 08/25/2004 | CN1523664A Packaging substrate and inversion type semiconductor device |
| 08/25/2004 | CN1523656A Method of manufacturing semiconductor device |
| 08/25/2004 | CN1523654A Apparatus and method for inspecting film carrier tape for mounting electronic component |
| 08/25/2004 | CN1523653A Semiconductor device for charge-up damage evaluation and charge-up damage evaluation method |
| 08/25/2004 | CN1523652A Semiconductor device and method for designing the same |
| 08/25/2004 | CN1523650A LSI packaging and assembly method thereof |
| 08/25/2004 | CN1523645A 半导体器件 Semiconductor devices |
| 08/25/2004 | CN1523535A A network card packaging arrangement and packaging method thereof |
| 08/25/2004 | CN1523443A K fraction fractal masking method for preparing material chips |
| 08/25/2004 | CN1523413A 显示装置 The display device |
| 08/25/2004 | CN1523368A Integrated testing circuit in integrated circuit |
| 08/25/2004 | CN1164158C Multi-layer circuit board for semiconductor chip assembly |
| 08/25/2004 | CN1163963C Manufacturing method of lead-wire frame and resin sealing type semiconductor device |
| 08/25/2004 | CN1163962C Electronic package, packaging assembly and making method thereof and method for making heat conducting structure |
| 08/25/2004 | CN1163961C Semiconductor device sealed with resin |
| 08/25/2004 | CN1163960C Ultrathin package device with high heat radiation and making method |
| 08/25/2004 | CN1163959C Surface mounting element and mounting structure for surface mounting element |
| 08/25/2004 | CN1163954C Semiconductor copper bonding point surface protection |
| 08/25/2004 | CN1163953C Substrate-type semiconductor device packing method without glue overflow |
| 08/25/2004 | CN1163951C Etching insulating layer and mfg. semiconductor device process |
| 08/24/2004 | US6782522 Semiconductor device having wide wiring pattern in outermost circuit |
| 08/24/2004 | US6782512 Fabrication method for a semiconductor device with dummy patterns |
| 08/24/2004 | US6782479 Apparatus and method for inhibiting analysis of a secure circuit |
| 08/24/2004 | US6781887 Anti-fuse structure and method of writing and reading in integrated circuits |
| 08/24/2004 | US6781849 Multi-chip package having improved heat spread characteristics and method for manufacturing the same |
| 08/24/2004 | US6781839 Vertical surface mount apparatus with thermal carrier and method |
| 08/24/2004 | US6781838 Attaching device for mounting and fixing a device for generating heat and a heat sink provided on the device for generating heat on a board, a mount board having the board, the device for generating heat, and the heat sink, and an attaching method of the device for generating heat and the heat sink providing on the device for generating heat on the board |
| 08/24/2004 | US6781837 System and method for information handling system heat sink retention |
| 08/24/2004 | US6781836 Microprocessor-heat slug fastening frame |
| 08/24/2004 | US6781835 Air-applying device having a case with an air inlet port, a cooling unit having the air-applying device, and an electronic apparatus having the air-applying device |
| 08/24/2004 | US6781834 Cooling device with air shower |
| 08/24/2004 | US6781832 Cooling unit for cooling heat generating component and electronic apparatus containing cooling unit |
| 08/24/2004 | US6781488 Connected construction of a high-frequency package and a wiring board |
| 08/24/2004 | US6781482 Integrated circuit |
| 08/24/2004 | US6781393 Methods relating to wafer integrated plasma probe assembly arrays |
| 08/24/2004 | US6781365 Conductive material for integrated circuit fabrication |
| 08/24/2004 | US6781258 Cooling device of electronic apparatus |
| 08/24/2004 | US6781248 Disposing tape between the semiconductor die and the substrate element, the intermediate conductive elements being located within a slot formed in the tape, and introducing encapsulant material into the slot |
| 08/24/2004 | US6781247 Semiconductor device |
| 08/24/2004 | US6781245 Array structure of solder balls able to control collapse |
| 08/24/2004 | US6781244 Electrical die contact structure and fabrication method |
| 08/24/2004 | US6781243 Leadless leadframe package substitute and stack package |
| 08/24/2004 | US6781242 Thin ball grid array package |
| 08/24/2004 | US6781240 Semiconductor package with semiconductor chips stacked therein and method of making the package |
| 08/24/2004 | US6781239 Integrated circuit and method of forming the integrated circuit having a die with high Q inductors and capacitors attached to a die with a circuit as a flip chip |
| 08/24/2004 | US6781238 Semiconductor device and method of fabricating the same |
| 08/24/2004 | US6781237 Wiring-inclusive structure and forming method thereof |
| 08/24/2004 | US6781236 Semiconductor device using a multilayer wiring structure |
| 08/24/2004 | US6781235 Three-level unitary interconnect structure |
| 08/24/2004 | US6781234 Semiconductor device having electrodes containing at least copper nickel phosphorous and tin |
| 08/24/2004 | US6781229 Method for integrating passives on-die utilizing under bump metal and related structure |
| 08/24/2004 | US6781228 Donut power mesh scheme for flip chip package |
| 08/24/2004 | US6781227 Compression assembled electronic package having a plastic molded insulation ring |
| 08/24/2004 | US6781225 Glueless integrated circuit system in a packaging module |
| 08/24/2004 | US6781224 Semiconductor device and package including forming pyramid mount protruding through silicon substrate |
| 08/24/2004 | US6781223 Semiconductor device having a signal lead exposed on the undersurface of a sealing resin with an air gap between the signal lead and a mounting substrate |
| 08/24/2004 | US6781222 Semiconductor package having vertically mounted passive devices under a chip and a fabricating method thereof |
| 08/24/2004 | US6781221 Packaging substrate for electronic elements and electronic device having packaged structure |
| 08/24/2004 | US6781220 Printed circuit board for semiconductor memory device |
| 08/24/2004 | US6781219 Semiconductor die assembly having leadframe decoupling characters |
| 08/24/2004 | US6781218 Method and apparatus for accessing internal nodes of an integrated circuit using IC package substrate |
| 08/24/2004 | US6781216 Semiconductor device having wiring patterns with insulating layer |
| 08/24/2004 | US6781215 Intermediate base for a semiconductor module and a semiconductor module using the intermediate base |
| 08/24/2004 | US6781207 Semiconductor device and manufacturing method thereof |
| 08/24/2004 | US6781205 Electrostatic charge measurement on semiconductor wafers |
| 08/24/2004 | US6781185 Semiconductor high dielectric constant decoupling capacitor structures and process for fabrication |
| 08/24/2004 | US6781184 Barrier layers for protecting metal oxides from hydrogen degradation |
| 08/24/2004 | US6781151 Failure analysis vehicle |
| 08/24/2004 | US6781150 Test structure for detecting bonding-induced cracks |
| 08/24/2004 | US6781089 Method and apparatus for cutting electrical wiring line on a substrate, and method and apparatus for manufacturing electronic device |
| 08/24/2004 | US6781066 Packaged microelectronic component assemblies |
| 08/24/2004 | US6781065 Solder-coated articles useful for substrate attachment |
| 08/24/2004 | US6781064 Printed circuit boards for electronic device packages having glass free non-conductive layers and method of forming same |
| 08/24/2004 | US6781057 Electrical arrangement and method for producing an electrical arrangement |
| 08/24/2004 | US6780898 Adhesive composition |
| 08/24/2004 | US6780793 Production method of semiconductor device |
| 08/24/2004 | US6780790 Semiconductor device and method of manufacturing the same |
| 08/24/2004 | US6780779 Method of fabricating semiconductor device |
| 08/24/2004 | US6780778 Method for fabricating semiconductor device |
| 08/24/2004 | US6780775 Design of lithography alignment and overlay measurement marks on CMP finished damascene surface |
| 08/24/2004 | US6780772 Method and system to provide electroplanarization of a workpiece with a conducting material layer |
| 08/24/2004 | US6780770 Method for stacking semiconductor die within an implanted medical device |
| 08/24/2004 | US6780769 Method of manufacturing structure for connecting interconnect lines including metal layer with thickness larger than thickness of metallic compound layer |
| 08/24/2004 | US6780768 Bonding pad for optical semiconductor device and fabrication method thereof |
| 08/24/2004 | US6780765 Integrated circuit trenched features and method of producing same |
| 08/24/2004 | US6780758 Method of establishing electrical contact between a semiconductor substrate and a semiconductor device |
| 08/24/2004 | US6780757 Semiconductor integrated circuit device and method for making the same |
| 08/24/2004 | US6780752 Metal thin film of semiconductor device and method for forming same |
| 08/24/2004 | US6780749 Method of manufacturing a semiconductor chip comprising multiple bonding pads in staggard rows on edges |
| 08/24/2004 | US6780748 Method of fabricating a wafer level chip size package utilizing a maskless exposure |
| 08/24/2004 | US6780747 Methods for providing void-free layers for semiconductor assemblies |
| 08/24/2004 | US6780744 Stereolithographic methods for securing conductive elements to contacts of semiconductor device components |
| 08/24/2004 | US6780733 Thinned semiconductor wafer and die and corresponding method |
| 08/24/2004 | US6780726 Scratch protection for direct contact sensors |
| 08/24/2004 | US6780716 Chip differentiation at the level of a reticle |
| 08/24/2004 | US6780681 Process of manufacturing a semiconductor device |
| 08/24/2004 | US6780680 Methods of fabricating multilevel leadframes and semiconductor devices |
| 08/24/2004 | US6780679 Semiconductor device and method of manufacturing the same |