| Patents for H01L 23 - Details of semiconductor or other solid state devices (226,155) |
|---|
| 08/26/2004 | US20040164392 Stacked semiconductor package and method for fabricating |
| 08/26/2004 | US20040164390 [semiconductor package with a heat spreader] |
| 08/26/2004 | US20040164389 [chip package and process for forming the same] |
| 08/26/2004 | US20040164387 Semiconductor device fabricating apparatus and semiconductor device fabricating method |
| 08/26/2004 | US20040164386 Unmolded package for a semiconductor device |
| 08/26/2004 | US20040164385 multi-chip module wherein plural semiconductor chips are mounted on the same wiring substrate and a main surface is sealed with resin; improving reliability and attaining high-density packaging and low cost |
| 08/26/2004 | US20040164384 Surface excited device package including a substrate having a vibration-permitted cavity |
| 08/26/2004 | US20040164383 covalently bonding a thermal interface material to a bottom surface of a heat dissipating device and/or a backside surface of a heat generating device such as an integrated circuit; and thermally coupling the devices to reduce thermal resistance |
| 08/26/2004 | US20040164382 Multi-die semiconductor package |
| 08/26/2004 | US20040164361 Permanently on transistor implemented using a double polysilicon layer CMOS process with buried contact |
| 08/26/2004 | US20040164356 Electrostatic discharge protection structures having high holding current for latch-up immunity |
| 08/26/2004 | US20040164355 Arrangement for ESD protection of an integrated circuit |
| 08/26/2004 | US20040164354 Minimum-dimension, fully- silicided MOS driver and ESD protection design for optimized inter-finger coupling |
| 08/26/2004 | US20040164337 Capacitor element, manufacturing method therefor, semiconductor device substrate, and semiconductor device |
| 08/26/2004 | US20040164324 Electronic circuit package |
| 08/26/2004 | US20040164316 Pressure contact type semiconductor device having dummy segment |
| 08/26/2004 | US20040164297 Display device |
| 08/26/2004 | US20040164295 A replacement for probe cards includes contacter provides conductive pathways from the IC contact pads to a second surface where a corresponding set of contact pads provide access to test systems and/or other devices. |
| 08/26/2004 | US20040163948 Plating apparatus and method of managing plating liquid composition |
| 08/26/2004 | US20040163846 Printed circuit board employing lossy power distribution network to reduce power plane resonances |
| 08/26/2004 | US20040163843 Multi-chip package with soft element and method of manufacturing the same |
| 08/26/2004 | US20040163836 Multi-layer ceramic feedthrough structure in a transmitter optical subassembly |
| 08/26/2004 | US20040163798 Compact thermosiphon for dissipating heat generated by electronic components |
| 08/26/2004 | US20040163797 Cooling system for densely packed electronic components |
| 08/26/2004 | US20040163796 Circulative cooling apparatus |
| 08/26/2004 | US20040163795 Heat sink |
| 08/26/2004 | US20040163482 Apparatus and method for inspecting film carrier tape for mounting electronic component |
| 08/26/2004 | US20040163462 Slosh supressor and heat sink |
| 08/26/2004 | US20040163252 Contact carriers (tiles) for populating larger substrates with spring contacts |
| 08/26/2004 | US20040163248 Metal core substrate printed wiring board enabling thermally enhanced ball grid array ( BGA) packages and method |
| 08/26/2004 | US20040163234 Resistive vias in a substrate |
| 08/26/2004 | US20040163233 Methods of forming electrical connections within ferroelectric devices |
| 08/26/2004 | DE19637285B4 Halbleiterbauelement und Verfahren zum Zusammenbau hiervon Semiconductor device and method thereof for assembly |
| 08/26/2004 | DE10348191A1 Arrangement for moving spindle for e.g. insertion machine for mounting components, moves spindle along longitudinal axis and applies first force in connection with second force to spindle in first direction |
| 08/26/2004 | DE10340848A1 Herstellungsverfahren für eine Halbleitereinrichtung Manufacturing method of a semiconductor device |
| 08/26/2004 | DE10338291A1 Verfahren zum Herstellen einer Halbleitervorrichtung A method of manufacturing a semiconductor device |
| 08/26/2004 | DE10334761A1 Elektronische Schaltungsvorrichtung An electronic circuit device |
| 08/26/2004 | DE10320579A1 Semiconductor wafer having an upper side, semiconductor chip positions with integrated circuits for first chips, central and edge regions and an equalizing layer useful in semiconductor technology |
| 08/26/2004 | DE10320337A1 Semiconductor wafer manufacture for flip-chip contacts, by applying second solder paste of lower melting point to form extensions to lands formed by first solder paste |
| 08/26/2004 | DE10320090A1 Electronic assembly, especially a circuit board, has conducting tracks between components made from carbonized plastic and or agglomerated nano-particles mounted on a plastic substrate |
| 08/26/2004 | DE10306811A1 Structural element used for packaging organic light-emitting diode or display, preferably with organic semiconductor, has capsule containing material reacting irreversibly with water e.g. polyurethane with free isocyanate groups |
| 08/26/2004 | DE10306767A1 Semiconductor module, e.g. for power semiconductor applications, has insulator that is resistant to high temperatures, arranged between package wall and semiconductor device |
| 08/26/2004 | DE10306643A1 Druckkontaktierung für ein Leistungshalbleitermodul Pressure contact for a power semiconductor module |
| 08/26/2004 | DE10305411A1 A microelectromechanical arrangement with at least one layer on a substrate, especially a thermoelectric layer on a substrate useful for thermoelectric generators or Peltier effect elements |
| 08/26/2004 | DE10305365A1 Substrate connection contacting method e.g. for transistor in GSM or UMTS mobile telephone etc., by etching recesses to expose conductive material filling contact hole and connection surface, and applying further conductive material |
| 08/26/2004 | DE10258093B3 Anordnung zum Schutz von 3-dimensionalen Kontaktstrukturen auf Wafern Arrangement for the protection of the 3-dimensional contact structures on wafers |
| 08/26/2004 | DE10221646B4 Verfahren zur Verbindung von Schaltungseinrichtungen und entsprechender Verbund von Schaltungseinrichtungen A method for connection of circuit devices and the appropriate compound of circuit devices |
| 08/26/2004 | DE102004006989A1 Halbleitervorrichtung in Druckkontaktbauweise A semiconductor device in pressure contact design |
| 08/26/2004 | DE102004005883A1 Verfahren und Vorrichtung für eine aufgebrachte hermetische Abdichtung für ein digitales Röntgenstrahlpaneel Method and apparatus for a hermetic seal applied for a digital Röntgenstrahlpaneel |
| 08/26/2004 | DE102004005697A1 Widerstandsfähige Via-Struktur und zugehöriges Herstellungsverfahren Durable via structure and manufacturing method thereof |
| 08/26/2004 | CA2515201A1 Protecting resin-encapsulated components |
| 08/25/2004 | EP1450417A1 High-powered light emitting device with improved thermal properties |
| 08/25/2004 | EP1450407A1 Integrated voltage regulating circuit and method of fabrication thereof |
| 08/25/2004 | EP1450406A1 Micro fuse |
| 08/25/2004 | EP1450405A2 Drive IC and display device having the same |
| 08/25/2004 | EP1450404A2 Assembly in pressure contact with a power semiconductor module |
| 08/25/2004 | EP1450403A1 Heat spreader module |
| 08/25/2004 | EP1450402A1 Semiconductor device with improved heat dissipation, and a method of making semiconductor device |
| 08/25/2004 | EP1450401A1 Module structure and module comprising it |
| 08/25/2004 | EP1450400A1 Module part |
| 08/25/2004 | EP1449810A2 Method for manufacturing micro-electro-mechanical system using solder balls |
| 08/25/2004 | EP1449414A1 Interposer |
| 08/25/2004 | EP1449252A2 Electronic assembly |
| 08/25/2004 | EP1449250A2 Forming defect prevention trenches in dicing streets |
| 08/25/2004 | EP1449249A2 Backside metallization on sides of microelectronic dice for effective thermal contact with heat dissipation devices |
| 08/25/2004 | EP1449247A2 Method of using ternary copper alloy to obtain a low resistance and large grain size interconnect |
| 08/25/2004 | EP1449243A1 Method for forming an oxynitride spacer for a metal gate electrode using a pecvd process with a silicon-starving atmosphere |
| 08/25/2004 | EP1449162A2 Semiconductor wafer identification |
| 08/25/2004 | EP1448745A1 Anisotropically electroconductive adhesive film, method for the production thereof, and semiconductor devices |
| 08/25/2004 | EP1448335A1 A wire bonder for ball bonding insulated wire and method of using same |
| 08/25/2004 | EP1448316A1 Hot melt conductor paste composition |
| 08/25/2004 | EP1211799B1 Lc oscillator |
| 08/25/2004 | EP1192658A4 Stackable flex circuit ic package and method of making the same |
| 08/25/2004 | EP1135802A4 Three-dimensional packaging technology for multi-layered integrated circuits |
| 08/25/2004 | EP1062849A4 Circuit board features with reduced parasitic capacitance and method therefor |
| 08/25/2004 | EP0839323B1 Microelectronic spring contact elements |
| 08/25/2004 | CN2636601Y Radiator fastener |
| 08/25/2004 | CN2636426Y Electron assembly parallel packaging structure |
| 08/25/2004 | CN2636425Y High performance lighting protection integrated circuit module |
| 08/25/2004 | CN2636424Y Structure improved heat radiation module |
| 08/25/2004 | CN2636423Y Centrifugal in-line type forced air cooling heat radiating device |
| 08/25/2004 | CN2636422Y Heat radiation device |
| 08/25/2004 | CN2636421Y Heat radiation device having double layered fin |
| 08/25/2004 | CN2636420Y Heat radiation device |
| 08/25/2004 | CN2636419Y Finned flow defection structure of heat radiator |
| 08/25/2004 | CN2636418Y Pulse heat pipe type electron element heat radiation cooling device |
| 08/25/2004 | CN2636417Y Mixed type cooling device |
| 08/25/2004 | CN2636416Y Fastener improved structure of integrated circuit cooling fin |
| 08/25/2004 | CN2636415Y Flow deflecting structure of heat radiation device |
| 08/25/2004 | CN2636414Y Radiator heat conducting gum protective device |
| 08/25/2004 | CN2636413Y Heat radiator fastener |
| 08/25/2004 | CN2636412Y CPU heat radiator |
| 08/25/2004 | CN2636309Y Fin type heat sink |
| 08/25/2004 | CN2636308Y Fastener for heat sink |
| 08/25/2004 | CN2636307Y High core heat sink for CPU |
| 08/25/2004 | CN1524296A Rf power LDMOS transistor |
| 08/25/2004 | CN1524293A Microelectronic substrate with integrated devices |
| 08/25/2004 | CN1524291A Metal ion diffusion barrier layers |
| 08/25/2004 | CN1523672A 半导体集成电路器件 The semiconductor integrated circuit device |
| 08/25/2004 | CN1523671A Semiconductor device and method for fabricating the same |